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Analysis of Samsung Electronics' 5G NR Digital BBU CDU50: High Level Bill of Materials, High Level PCB Analysis, System Functional Description, System Level Block Diagrams, High Level Mechanical Analysis

Research and Markets
·2-min read
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Dublin, Aug. 02, 2022 (GLOBE NEWSWIRE) -- The "Samsung Electronics Co., Ltd. 5G NR Digital BBU CDU50" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis for the Samsung Electronics CDU50 system. This product is a 5G NR digital baseband unit and supports the distributed unit (DU) and centralized unit (CU) functions of a 5G NR gNodeB.

Features

  • System Functional Description

  • System Level Block Diagrams

  • High Level Mechanical Analysis

    • Heat Sink

    • Heat Fins

  • High Level PCB Analysis

      • Component Diagrams

      • Semiconductor/component locations on PCB

  • High Level Bill of Materials

    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)

    • Complete Part Number/Marking

    • Component Manufacturer Identification

    • Function Component Description

    • Package Type

  • Excludes analysis of passive chip resistors, capacitors and inductors

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Key Topics Covered:

EXECUTIVE SUMMARY

  • Active/Passive Component Summary

  • Important Note

CHAPTER 1: SAMSUNG 5G CDU

  • Overview of Baseband Unit

CHAPTER 2: MECHANICAL ANALYSIS

  • Chassis Frame (SHELF)

  • Chassis Frame Back Cover

  • Air Filter Unit

  • DC Power Busbar Unit

CHAPTER 3: FAN UNIT

  • Individual Fan Unit

CHAPTER 4: POWER/SIGNAL BACKPLANE DISTRIBUTION PCB (UCDB)

CHAPTER 5: GMA1-A1A MANAGEMENT CARD

  • Plastic Shield

  • Front Panel

  • GMA1-A1A PCB

  • GMA1-A1A PCB Top Active Component Analysis

  • GMA1-A1A PCB Top Passive Component Analysis

  • GMA1-A1A PCB Bottom Active Component Analysis

  • GMA1-A1A PCB Bottom Passive Component Analysis

CHAPTER 6: GCB1-C1A CHANNEL MODEM PCB

  • GCB1-C1A Plastic Shield

  • Front Panel

  • GCB1-C1A PCB

  • GCB1-C1A PCB Top Active Component Analysis

  • GCB1-C1A PCB Top Passive Component Analysis

  • GCB1-C1A PCB Bottom Active Component Analysis

  • GCB1-C1A PCB Bottom Passive Component Analysis

CHAPTER 7: GMA1-A1A IC HEAT SINKS

CHAPTER 8: GCB1-C1A IC HEAT SINKS

APPENDIX A COMPONENT ANALYSIS

APPENDIX B COMPONENTS BY SYSTEM AREA

APPENDIX C ACTIVE COMPONENTS BY SUPPLIER

APPENDIX D PASSIVE COMPONENTS BY SUPPLIER

For more information about this report visit https://www.researchandmarkets.com/r/geub7v

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900