Advertisement
UK markets closed

  • FTSE 100

    7,895.85
    +18.80 (+0.24%)
     

  • FTSE 250

    19,391.30
    -59.37 (-0.31%)
     

  • AIM

    745.67
    +0.38 (+0.05%)
     

  • GBP/EUR

    1.1607
    -0.0076 (-0.65%)
     

  • GBP/USD

    1.2370
    -0.0068 (-0.55%)
     

  • Bitcoin GBP

    51,539.24
    +2,090.85 (+4.23%)
     

  • CMC Crypto 200

    1,368.11
    +55.49 (+4.23%)
     

  • S&P 500

    4,967.23
    -43.89 (-0.88%)
     

  • DOW

    37,986.40
    +211.02 (+0.56%)
     

  • CRUDE OIL

    83.24
    +0.51 (+0.62%)
     

  • GOLD FUTURES

    2,406.70
    +8.70 (+0.36%)
     

  • NIKKEI 225

    37,068.35
    -1,011.35 (-2.66%)
     

  • HANG SENG

    16,224.14
    -161.73 (-0.99%)
     

  • DAX

    17,737.36
    -100.04 (-0.56%)
     

  • CAC 40

    8,022.41
    -0.85 (-0.01%)
     
Property:

11 beautiful homes with glorious garden rooms

Investing in a home with a garden room will enable you to enjoy your outside space whatever the weather

Comprehensive Analysis of Ericsson's 5G NR Digital Baseband Unit - ERS Baseband 6648 System

Research and Markets
·2-min read

Dublin, Nov. 09, 2021 (GLOBE NEWSWIRE) -- The "ERICSSON ERS Baseband 6648" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis of the Ericsson Baseband 6648 system. This product is a 5G NR digital baseband unit and supports single mode LTE, single mode 5G NR, and mixed mode LTE+5G NR.

Features

  • System Functional Description

  • System Level Block Diagrams

  • High Level Mechanical Analysis

    • Heat Sink

    • Heat Fins

  • High Level PCB Analysis

  • Component Diagrams

    • Semiconductor/component locations on PCB

  • High Level Bill of Materials

    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)

    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)

    • Complete Part Number/Marking

    • Component Manufacturer Identification

    • Function Component Description

    • Package Type

  • Excludes analysis of passive chip resistors, capacitors, and inductors

ADVERTISEMENT

Key Topics Covered:

EXECUTIVE SUMMARY

  • Active/Passive Component Summary

CHAPTER 1: ERICSSON 5G BBU

  • Overview of Baseband Unit

CHAPTER 2: MECHANICAL ANALYSIS

  • Chassis-Top Cover

  • Chassis/ Heat Sink

  • Plastic Bottom Cover

CHAPTER 3: FAN TRAY UNIT

  • Fan Unit

CHAPTER 4: BASEBAND 6648 PCB

  • Main PCB

  • Main PCB Top Active Component Analysis

  • Main PCB Top Passive Component Analysis

  • Main PCB Bottom Active Component Analysis

  • Main PCB Bottom Passive Component Analysis

  • Auxiliary PCB

CHAPTER 5: SOC HEAT SINKS

  • L1 Modem/Fronthaul Heat Sink

  • L2/L2 Processor Heat Sink

APPENDIX A COMPONENT ANALYSIS

APPENDIX B COMPONENTS BY SYSTEM AREA

APPENDIX C ACTIVE COMPONENTS BY SUPPLIER

APPENDIX D PASSIVE COMPONENTS BY SUPPLIER

For more information about this report visit https://www.researchandmarkets.com/r/7lopsn

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900