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Global $1.45 Bn Radiation Hardened Electronics Market 2018-2023: Focus on Rad-Hard by Design, Rad-Hard by Process, and Rad-Hard by Software -

Research and Markets

Dublin, March 08, 2019 (GLOBE NEWSWIRE) -- The "Global Radiation Hardened Electronics Market: Focus on Manufacturing Techniques (Rad-Hard by Design (RHBD), Rad-Hard by Process (RHBP), and Rad-Hard by Software (RHBS)); Component Type; and End Users - Analysis and Forecast, 2018-2023" report has been added to ResearchAndMarkets.com's offering.

The global radiation hardened electronics market generated $1.45 billion in 2018 and is estimated to grow at a CAGR of 3.34%, during 2018-2023.

Region-wise, North America dominated the global radiation hardened electronics market in 2017, with the U.S. acquiring the most significant market share, globally. However, Asia-Pacific is expected to pace at the highest growth rate during the forecast period, 2018-2023.

The global radiation hardened electronics market is expected to witness stable growth during the forecast period 2018-2023, due to factors such as the increase of space missions and developing reconfigurable components for communication, navigation, science, space exploration, and remote sensing. The radiation hardened electronics market comprises sophisticated radiation hardened electronics systems used for various space, military, and commercial applications.

Radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. The global radiation hardened electronics market is expected to grow, owing to the increasing number of commercial satellites and increasing use of radiation hardened products in the military and other harsh environment applications.

Key Topics Covered:

Executive Summary

1 Market Dynamics
1.1 Market Drivers
1.1.1 Advancement in Microprocessor and FPGA Technologies
1.1.2 Rising Demand from Communication Satellite Segment
1.1.3 Increasing Space Missions
1.2 Market Challenges
1.2.1 High Designing and Developing Cost
1.2.2 Difficulties in Creating Real Testing Environment
1.3 Market Opportunities
1.3.1 Increasing demand of COTS in Healthcare and Consumer Electronics
1.3.2 Increasing Demand for Reconfigurable Radiation Hardened Components

2 Competitive Insights
2.1 Key Strategies and Developments
2.1.1 New Product Launch
2.1.2 Acquisitions
2.1.3 Partnerships, Agreements, and Contracts
2.1.4 Other Developments
2.2 Competitive Benchmarking
2.3 Market Share Analysis

3 Industry Analysis
3.1 Overview
3.2 Comparison of Radiation Hardened Products Standard Requirements for End User
3.3 Evolving Radiation Hardened Electronics in New Space
3.4 Radiation Hardened Electronics Manufacturers and Certifications
3.5 Supply Chain Analysis
3.6 Industry Attractiveness: Porter's Five Forces
3.6.1 Threat from New Entrants
3.6.2 Threat from Substitutes
3.6.3 Bargaining Power of Buyers
3.6.4 Bargaining Power of Suppliers
3.6.5 Intensity of Competitive Rivalry

4 Global Radiation Hardened Electronics Market, 2017 to 2023
4.1 Assumptions and Limitations
4.2 Market Overview

5 Global Radiation Hardened Electronics Market (by Manufacturing Technique)
5.1 Market Overview
5.2 Rad-Hard by Design (RHBD)
5.2.1 Total Ionizing Doze
5.2.2 Single Event Effect
5.3 Rad-Hard by Process (RHBP)
5.3.1 Silicon on Insulator (SOI)
5.3.2 Silicon on Sapphire (SOS)
5.4 Rad-Hard by Software (RHBS)

6 Global Radiation Hardened Electronics Market (by Component Type)
6.1 Market Overview
6.2 Microprocessors and Controllers
6.3 Discrete Semiconductors
6.4 Power Sources
6.5 Memory
6.6 Field-Programmable Gate Array
6.7 Analog and Mixed Signals
6.8 Sensors
6.9 Application-Specific Integrated Circuit
6.10 Others

7 Global Radiation Hardened Electronics Market (by End User)
7.1 Market Overview
7.2 Space
7.2.1 New Space
7.2.2 Conventional Space
7.2.3 Space End-User Market by QLM V Qualification
7.2.4 Business Opportunities for Radiation Hardened Electronics in Small Satellite
7.3 Military
7.3.1 Military End-User Market by QLM Q Qualification
7.4 Nuclear Power Plants
7.5 Others

8 Global Radiation Hardened Electronics Market (by Region)

9 Company Profiles

  • Analog Devices Inc.

  • Anaren Inc.

  • BAE Systems

  • Cobham plc

  • Data Device Corporation

  • Honeywell International Inc.

  • IBM Corporation

  • Infineon Technologies Inc.

  • Maxwell Technologies Inc.

  • Microchip Technology Inc.

  • Micropac Industries Inc.

  • Microsemi Corporation

  • pSemi Corporation

  • Renesas Electronics Corporation

  • STMicroelectronics N.V

  • Solid State Devices Inc.

  • TT Electronics

  • Texas Instruments Inc.

  • The Boeing Company

  • Xilinx Inc.

For more information about this report visit https://www.researchandmarkets.com/research/84qkc3/global_1_45_bn?w=12

Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.

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