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Global Advanced IC Substrates Market (2021 to 2026) - Growth, Trends, COVID-19 Impact, and Forecasts -

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The "Advanced IC Substrates Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to's offering.

The advanced IC substrate market (henceforth, referred to as the 'market studied') was valued at USD 7.73 billion in 2020, and it is expected to reach USD 10.49 billion by 2026, with a CAGR of 5.3% over the forecast period 2021-2026.

Companies Mentioned

  • ASE Kaohsiung (ASE Inc.)

  • AT&S Austria Technologie & Systemtechnik AG

  • Siliconware Precision Industries Co. Ltd

  • TTM Technologies Inc.

  • IBIDEN Co. Ltd

  • KYOCERA Corporation

  • Fujitsu Ltd

  • STATS ChipPAC Pte. Ltd

  • Shinko Electric Industries Co. Ltd

  • Kinsus Interconnect Technology Corp.

  • Unimicron Corporation

Key Market Trends

Rising Application of Advanced Substrates in Manufacturing of IoT Equipment to Drive the Market Growth

  • The global demand for IoT is augmented by the consumer and industrial sectors, as the growing application of the technology is driving the demand from both sectors. According to the Internet & Television Association, by 2020, the global growth of IoT was expected to reach 50.1 billion units.

  • The growth in demand is augmenting the vendors to produce IoT specific chipsets. Some of the major IoT chipset vendors operating in the market include Altair, Huawei, Intel, Qualcomm, Samsung, and Sierra, among others. Moreover, Qualcomm's networking solutions for Wi-Fi environments, such as Pro 1200, are embedded with FCBGA.

  • With the increase in sheer numbers of IoT devices, the chip requirement for building IoT devices is expected to skyrocket over the forecast period. Moreover, the innovation in reducing energy consumption, combined with the miniaturization of chips, is likely to be the priority of manufacturers.

  • The growth in IoT is helping IC substrate manufacturers. For instance, Apple is moving to adopt TSMC's antenna in package technology and ASE's FC_AiP process, to package mmWave antenna for its 5G iPhones and 5G iPads set to launch in 2020. The growth in IoT has resulted in greater use of the latest semiconductor packages that can enhance the performance of ICs and minimize the cost in various instances.

Asia Pacific to Register the Fastest Growth During the Forecast Period

  • The growth of the semiconductor packaging manufacturer in the region correlates with the end user's growth in the region as the fastest-growing market for smartphones, thereby, witnessing a rising investment in renewable and automotive (EVs specifically), among various others.

  • Some of the prominent players across the region have invested in the advancement in IC fabrication technology. For instance, in 2018, Taiwan-based Powertech Technology announced an investment of more than USD 1.68 billion in the country, in an advanced factory, to ride on the next technology wave of high-performance computing and connected cars. This is set to fuel innovation in the advanced IC substrates in the applications mentioned above.

  • Moreover, investments in the smartphone segment in the Asia Pacific countries are expected to drive the demand for advanced IC substrates. For instance, in 2018, Samsung inaugurated its new mobile phone manufacturing facility in Uttar Pradesh, India, as the world's largest mobile devices manufacturing factory.

Key Topics Covered:





4.1 Market Overview

4.2 Industry Attractiveness - Porter's Five Forces Analysis

4.2.1 Bargaining Power of Suppliers

4.2.2 Bargaining Power of Consumers

4.2.3 Threat of New Entrants

4.2.4 Intensity of Competitive Rivalry

4.2.5 Threat of Substitute Products

4.3 Industry Value Chain Analysis

4.4 Market Drivers

4.4.1 Rising Application of Advanced Substrate in Manufacturing of IoT Equipment

4.4.2 Increasing Trend for Miniaturization in Semiconductor Devices

4.5 Market Restraints

4.6 Assessment of the COVID-19 Impact on the Industry


5.1 By Type

5.1.1 FC BGA

5.1.2 FC CSP

5.2 By Application

5.2.1 Mobile and Consumer

5.2.2 Automotive and Transportation

5.2.3 IT and Telecom

5.2.4 Other Applications (Healthcare, Infrastructure, Aerospace, and Defense)

5.3 By Geography

5.3.1 North America

5.3.2 Europe

5.3.3 Asia Pacific

5.3.4 Rest of the World


6.1 Company Profiles

6.1.1 ASE Kaohsiung (ASE Inc.)

6.1.2 AT&S Austria Technologie & Systemtechnik AG

6.1.3 Siliconware Precision Industries Co. Ltd

6.1.4 TTM Technologies Inc.

6.1.5 IBIDEN Co. Ltd

6.1.6 KYOCERA Corporation

6.1.7 Fujitsu Ltd

6.1.8 STATS ChipPAC Pte. Ltd

6.1.9 Shinko Electric Industries Co. Ltd

6.1.10 Kinsus Interconnect Technology Corp.

6.1.11 Unimicron Corporation



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