Global Dicing Tapes Market Outlook to 2027 - Featuring Minitron Electronic, Mitsui & NEPTCO Among Others

Dublin, Oct. 05, 2020 (GLOBE NEWSWIRE) -- The "Dicing Tapes - Global Market Outlook (2019-2027)" report has been added to ResearchAndMarkets.com's offering.

The Global Dicing Tapes Market is expected to grow at a CAGR of 8.0% during the forecast period. Increase in demand for small electronic components such as IC's & electronic chips and reducing thickness of electronic components are the major factors driving the market growth. However, the high cost of raw materials and high manufacturing costs are restraining market growth.

Dicing tapes are fundamentally designed to hold the semiconductor wafer during the process. This procedure separates the dies and furthermore keeps the chips inside close resistances regarding dimensions, position, etc. They are made of PVC or poly-ethylene with an adhesive to hold the dies in place. Significantly they are of two types. They are UV film sensitive tapes and silicone-free adhesive plastic films.

Based on coatings, the single sided segment is likely to have a huge demand due to increase in consumer choice for single sided coated dicing tapes, mainly for use in semiconductors, have led to this phase occupying a major market share across the globe. By geography, Asia Pacific is going to have a lucrative growth during the forecast period due to sheer number of electrical and electronic manufacturers in the region. China has emerged as an outstanding marketplace for dicing tape. There has also been a raised production of consumer durable electronic goods (CDEG) in the region.

Some of the key players profiled in the Dicing Tapes Market include AI Technology Inc, Denka Company Limited, Denka electronics & products, Furukawa Electric Co Ltd, Lintec Corporation, Loadpoint Limited, Minitron Electronic GmbH, Mitsui Corporation, NEPTCO Inc, Nippon Pulse Motor Taiwan, Nitto Denko Corporation, Pantech Tape Co Ltd, Sumitomo Bakelite Co Ltd and Ultron Systems Inc.

Types Covered:

• Back Grinding

• Wafer Dicing

Coatings Covered:

• Single Sided

• Double Sided

Materials Covered:

• Non UV Curable Dicing Tapes

• Silicon Free Adhesive Films

• UV Curable Dicing Tapes

Strengths Covered:

• Adhesive Strength

• Elongation

• Tensile Strength

Backing Materials Covered:

• Ethylene Vinyl Acetate (EVA)

• Polyethylene Terephthalate (PET)

• Polyolefin (PO)

• Polyvinyl Chloride (PVC)

Thicknesses Covered:

• Adhesive Thickness

• Backing Film Thickness

• Below 85 Microns

• 85-125 Microns

• 126-150 Microns

• Above 150 Microns

Applications Covered:

• Adhesive Control Needs

• Ceramics

• Glass

• Package Dicing

• Resin Substrate Manufacturing

Regions Covered:

North America

• US

• Canada

• Mexico

Europe

• Germany

• UK

• Italy

• France

• Spain

• Rest of Europe

Asia Pacific

• Japan

• China

• India

• Australia

• New Zealand

• South Korea

• Rest of Asia Pacific

South America

• Argentina

• Brazil

• Chile

• Rest of South America

Middle East & Africa

• Saudi Arabia

• UAE

• Qatar

• South Africa

• Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments

• Strategic recommendations for the new entrants

• Covers Market data for the years 2018, 2019, 2020, 2024 and 2027

• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)

• Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.

• Strategic recommendations in key business segments based on the market estimations

• Competitive landscaping mapping the key common trends

• Company profiling with detailed strategies, financials, and recent developments

• Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Application Analysis
3.7 Emerging Markets
3.8 Impact of Covid-19

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Dicing Tapes Market, By Type
5.1 Introduction
5.2 Back Grinding
5.3 Wafer Dicing

6 Global Dicing Tapes Market, By Coating
6.1 Introduction
6.2 Single Sided
6.3 Double Sided

7 Global Dicing Tapes Market, By Material
7.1 Introduction
7.2 Non UV Curable Dicing Tapes
7.3 Silicon Free Adhesive Films
7.4 UV Curable Dicing Tapes

8 Global Dicing Tapes Market, By Strength
8.1 Introduction
8.2 Adhesive Strength
8.3 Elongation
8.4 Tensile Strength

9 Global Dicing Tapes Market, By Backing Material
9.1 Introduction
9.2 Ethylene Vinyl Acetate (EVA)
9.3 Polyethylene Terephthalate (PET)
9.4 Polyolefin (PO)
9.5 Polyvinyl Chloride (PVC)

10 Global Dicing Tapes Market, By Thickness
10.1 Introduction
10.2 Adhesive Thickness
10.3 Backing Film Thickness
10.4 Below 85 Microns
10.5 85-125 Microns
10.6 126-150 Microns
10.7 Above 150 Microns

11 Global Dicing Tapes Market, By Application
11.1 Introduction
11.2 Adhesive Control Needs
11.3 Ceramics
11.4 Glass
11.5 Package Dicing
11.6 Resin Substrate Manufacturing

12 Global Dicing Tapes Market, By Geography
12.1 Introduction
12.2 North America
12.2.1 US
12.2.2 Canada
12.2.3 Mexico
12.3 Europe
12.3.1 Germany
12.3.2 UK
12.3.3 Italy
12.3.4 France
12.3.5 Spain
12.3.6 Rest of Europe
12.4 Asia Pacific
12.4.1 Japan
12.4.2 China
12.4.3 India
12.4.4 Australia
12.4.5 New Zealand
12.4.6 South Korea
12.4.7 Rest of Asia Pacific
12.5 South America
12.5.1 Argentina
12.5.2 Brazil
12.5.3 Chile
12.5.4 Rest of South America
12.6 Middle East & Africa
12.6.1 Saudi Arabia
12.6.2 UAE
12.6.3 Qatar
12.6.4 South Africa
12.6.5 Rest of Middle East & Africa

13 Key Developments
13.1 Agreements, Partnerships, Collaborations and Joint Ventures
13.2 Acquisitions & Mergers
13.3 New Product Launch
13.4 Expansions
13.5 Other Key Strategies

14 Company Profiling
14.1 AI Technology Inc
14.2 Denka Company Limited
14.3 Denka electronics & products
14.4 Furukawa Electric Co Ltd
14.5 Lintec Corporation
14.6 Loadpoint Limited
14.7 Minitron Electronic GmbH
14.8 Mitsui Corporation
14.9 NEPTCO Inc
14.10 Nippon Pulse Motor Taiwan
14.11 Nitto Denko Corporation
14.12 Pantech Tape Co Ltd
14.13 Sumitomo Bakelite Co Ltd
14.14 Ultron Systems Inc

For more information about this report visit https://www.researchandmarkets.com/r/lz0q14

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