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The Global Die Bonder Equipment Market is expected to grow by $ 92.81 mn during 2022-2026, accelerating at a CAGR of 2.19% during the forecast period

·3-min read
ReportLinker
ReportLinker

Global Die Bonder Equipment Market 2022-2026 The analyst has been monitoring the die bonder equipment market and it is poised to grow by $ 92. 81 mn during 2022-2026, accelerating at a CAGR of 2.

New York, Sept. 13, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Die Bonder Equipment Market 2022-2026" - https://www.reportlinker.com/p04821774/?utm_source=GNW
19% during the forecast period. Our report on the die bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis of the current global market scenario, the latest trends and drivers, and the overall market environment. The market is driven by incentives and discounts for long-term customers, demand for high-quality semiconductor ICs for wireless devices and IoT applications, and the increasing complexity of semiconductor IC designs.
The die bonder equipment market analysis includes the end-user segment and geographic landscape.

The die bonder equipment market is segmented as below:
By End-user
• OSATs
• IDMs

By Geography
• APAC
• North America
• Europe
• South America
• The Middle East and Africa

This study identifies the growing use of 3D chip packaging as one of the prime reasons driving the die bonder equipment market growth during the next few years. Also, an increase in the number of OSAT vendors and laser-assisted bonding technology will lead to sizable demand in the market.

The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on the die bonder equipment market covers the following areas:
• Die bonder equipment market sizing
• Die bonder equipment market forecast
• Die bonder equipment market industry analysis

This robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading die bonder equipment market vendors that include Anza Technology Inc., ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc, MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Corp, Paroteq GmbH, SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor Co. Ltd. Also, the die bonder equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio’s market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Read the full report: https://www.reportlinker.com/p04821774/?utm_source=GNW

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