The Global Market for Thermal Interface Materials 2023-2033: Development of High-Power and Frequency Electronic Devices Drives Demand
Dublin, March 14, 2023 (GLOBE NEWSWIRE) -- The "The Global Market for Thermal Interface Materials 2023-2033" report has been added to ResearchAndMarkets.com's offering.
The effective transfer/removal of heat from a semiconductor device is crucial to ensure reliable operation and to enhance the lifetime of these components.
The development of high-power and high-frequency electronic devices has greatly increased issues with excessive heat accumulation. There is therefore a significant requirement for effective thermal management materials to remove excess heat from electronic devices to ambient environment.
Thermal interface materials (TIMs) offer efficient heat dissipation to maintain proper functions and lifetime for these devices. TIMs are materials that are applied between the interfaces of two components (typically a heat generating device such as microprocessors, photonic integrated circuits, etc. and a heat dissipating device e.g. heat sink) to enhance the thermal coupling between these devices.
A range of Carbon-based, metal/solder and filler-based TIMs are available both commercially and in the research and development (R&D) phase.
Report contents include:
Analysis of recent commercial and R&D developments in thermal interface materials (TIMs).
Market trends and drivers.
Analysis of thermal interface materials (TIMs) including:
Thermally Conductive Adhesives.
Thermal Compounds or Greases.
Thermally Conductive Epoxy/Adhesives.
Phase Change Materials.
Market analysis. Markets covered include:
Electric Vehicles (EV) batteries.
Data Center infrastructure.
Global market revenues for thermal interface materials (TIMs), historical and forecast to 2033.
Profiles of 63 producers. Companies profiled include Arieca, Carbice Corporation, CondAlign, Fujipoly, Henkel, Indium Corporation, KULR Technology Group, Inc., Parker-Hannifin Corporation, Samyang Corporation and SHT Smart High-Tech AB.
Key Topics Covered:
2.1 Thermal Pads/Insulators
2.2 Thermally Conductive Adhesives
2.3 Thermal Compounds or Greases
2.4 Thermally Conductive Epoxy/Adhesives
2.5 Phase Change Materials
2.5.1 Properties of Phase Change Materials (PCMs)
184.108.40.206 Organic/biobased phase change materials
220.127.116.11.1 Advantages and disadvantages
18.104.22.168.2 Paraffin wax
22.214.171.124 Inorganic phase change materials
126.96.36.199.1 Salt hydrates
188.8.131.52.1.1 Advantages and disadvantages
184.108.40.206.2 Metal and metal alloy PCMs (High-temperature)
220.127.116.11 Eutectic mixtures
18.104.22.168 Encapsulation of PCMs
22.214.171.124 Nanomaterial phase change materials
2.5.3 Thermal energy storage (TES)
126.96.36.199 Sensible heat storage
188.8.131.52 Latent heat storage
2.5.4 Application in TIMs
2.6 Metal-based TIMs
2.6.1 Solders and low melting temperature alloy TIMs
2.6.2 Liquid metals
2.6.3 Solid liquid hybrid (SLH) metals
2.7 Carbon-based TIMs
2.7.1 Multi-walled nanotubes (MWCNT)
184.108.40.206 Application as thermal interface materials
2.7.2 Single-walled carbon nanotubes (SWCNTs)
220.127.116.11 Application as thermal interface materials
2.7.3 Vertically aligned CNTs (VACNTs)
18.104.22.168 Application as thermal interface materials
2.7.4 BN nanotubes (BNNT) and nanosheets (BNNS)
22.214.171.124 Application as thermal interface materials
126.96.36.199 Application as thermal interface materials
188.8.131.52 Application as thermal interface materials
2.7.7 Graphite flakes
184.108.40.206 Application as thermal interface materials
3 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)
3.1 Consumer electronics
3.2 EV Batteries
3.3 Data Centers
3.4 ADAS Sensors
3.5 EMI shielding
3.7 Global revenues for TIMs 2018-2033, by market
3.8 Future market prospects
4 COMPANY PROFILES (63 company profiles)
5 RESEARCH METHODOLOGY
A selection of companies mentioned in this report includes
AI Technology Inc.
Applied Nanotech, Inc.
Carbodeon Ltd. Oy
Danish Graphene ApS
First Graphene Ltd
Global Graphene Group
Hitek Electronic Materials
Hongfucheng New Materials
HyMet Thermal Interfaces SIA
KULR Technology Group, Inc.
HyMet Thermal Interfaces
Parker Hannifin Corporation
Schlegel Electronic Materials
Shin-Etsu Chemical Co. Ltd.
SHT Smart High Tech AB
Zeon Nano Technology Co., Ltd.
For more information about this report visit https://www.researchandmarkets.com/r/34rioh
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