Insights on the Interposer and Fan-Out WLP Global Market to 2027 - 45 Companies Profiled Including Amkor Technology, ASE Group & Broadcom

Dublin, Aug. 19, 2020 (GLOBE NEWSWIRE) -- The "Interposer and Fan-Out WLP - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

The publisher brings years of research experience to the 6th edition of this report. The 219-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Global Interposer and Fan-Out WLP Market to Reach $26.5 Billion by 2027

Amid the COVID-19 crisis, the global market for Interposer and Fan-Out WLP estimated at US$6.2 Billion in the year 2020, is projected to reach a revised size of US$26.5 Billion by 2027, growing at a CAGR of 23.1% over the analysis period 2020-2027.

Through-Silicon Vias (TSVs), one of the segments analyzed in the report, is projected to record a 24.3% CAGR and reach US$16.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Interposers segment is readjusted to a revised 22.1% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.7 Billion, While China is Forecast to Grow at 29.1% CAGR

The Interposer and Fan-Out WLP market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.5 Billion by the year 2027 trailing a CAGR of 29% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 18% and 21.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 19.8% CAGR.

Fan-out Wafer-Level Packaging (FOWLP) Segment to Record 20.2% CAGR

In the global Fan-out Wafer-Level Packaging (FOWLP) segment, USA, Canada, Japan, China and Europe will drive the 19.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$771.7 Million in the year 2020 will reach a projected size of US$2.7 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027, while Latin America will expand at a 21.5% CAGR through the analysis period.

Competitors identified in this market include, among others:

• Amkor Technology, Inc.

• ASE Group

• Broadcom Ltd.

• Infineon Technologies AG

• Intel Corporation

• Jiangsu Changjiang Electronics Technology Co., Ltd.

• Qualcomm, Inc.

• Samsung Electronics Co., Ltd.

• STMicroelectronics NV

• Taiwan Semiconductor Manufacturing Co., Ltd.

• Texas Instruments, Inc.

• Toshiba Corporation

• United Microelectronics Corporation
  

Key Topics Covered:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

• Global Competitor Market Shares

• Interposer and Fan-Out WLP Competitor Market Share Scenario Worldwide (in %): 2019 & 2025

• Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

IV. COMPETITION

Total Companies Profiled: 45

For more information about this report visit https://www.researchandmarkets.com/r/7wmkvx

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