UK Markets closed
  • FTSE 100

    7,122.32
    -6.89 (-0.10%)
     
  • FTSE 250

    22,646.08
    -38.76 (-0.17%)
     
  • AIM

    1,182.30
    -6.44 (-0.54%)
     
  • GBP/EUR

    1.1701
    -0.0065 (-0.55%)
     
  • GBP/USD

    1.3234
    -0.0068 (-0.5148%)
     
  • BTC-GBP

    40,186.25
    -3,197.59 (-7.37%)
     
  • CMC Crypto 200

    1,349.17
    -92.59 (-6.42%)
     
  • S&P 500

    4,527.68
    -49.42 (-1.08%)
     
  • DOW

    34,516.52
    -123.27 (-0.36%)
     
  • CRUDE OIL

    65.87
    -0.63 (-0.95%)
     
  • GOLD FUTURES

    1,785.90
    +23.20 (+1.32%)
     
  • NIKKEI 225

    28,029.57
    +276.20 (+1.00%)
     
  • HANG SENG

    23,766.69
    -22.24 (-0.09%)
     
  • DAX

    15,169.98
    -93.13 (-0.61%)
     
  • CAC 40

    6,765.52
    -30.23 (-0.44%)
     

Insights on the Wafer Level Packaging Global Market to 2026 - by Packaging Technology, End-use Industry and Region - ResearchAndMarkets.com

·3-min read

DUBLIN, November 25, 2021--(BUSINESS WIRE)--The "Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.

The global wafer level packaging market experienced strong growth during 2015-2020. Looking forward, the publisher expects the market to grow at a CAGR of around 11% during 2021-2026.

Companies Mentioned

  • Amkor Technology Inc.

  • China Wafer Level CSP Co. Ltd.

  • Chipbond Technology Corporation

  • Deca Technologies Inc. (Infineon Technologies AG)

  • Fujitsu Limited

  • IQE PLC

  • JCET Group Co. Ltd.

  • Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)

  • Tokyo Electron Ltd.

  • Toshiba Corporation.

The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors.

For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Questions Answered in This Report:

  • How has the global wafer level packaging market performed so far and how will it perform in the coming years?

  • What has been the impact of COVID-19 on the global wafer level packaging market?

  • What are the key regional markets?

  • What is the breakup of the market based on the packaging type?

  • What is the breakup of the market based on the end use industry?

  • What are the various stages in the value chain of the industry?

  • What are the key driving factors and challenges in the industry?

  • What is the structure of the global wafer level packaging market and who are the key players?

  • What is the degree of competition in the industry?

Key Topics Covered:

1 Preface

2 Scope and Methodology

3 Executive Summary

4 Introduction

4.1 Overview

4.2 Key Industry Trends

5 Global Wafer Level Packaging Market

5.1 Market Overview

5.2 Market Performance

5.3 Impact of COVID-19

5.4 Market Forecast

6 Market Breakup by Packaging Technology

7 Market Breakup by End Use Industry

8 Market Breakup by Region

9 SWOT Analysis

10 Value Chain Analysis

11 Porters Five Forces Analysis

12 Price Analysis

13 Competitive Landscape

13.1 Market Structure

13.2 Key Players

13.3 Profiles of Key Players

For more information about this report visit https://www.researchandmarkets.com/r/c9sp8a

View source version on businesswire.com: https://www.businesswire.com/news/home/20211125006123/en/

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Press Manager
press@researchandmarkets.com

For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

Our goal is to create a safe and engaging place for users to connect over interests and passions. In order to improve our community experience, we are temporarily suspending article commenting