Semiconductor Packaging Market to Reach $41.8 Billion by 2027

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New York, April 06, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Semiconductor Packaging Industry" - https://www.reportlinker.com/p05959998/?utm_source=GNW
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Abstract:
- Global Semiconductor Packaging Market to Reach $41.8 Billion by 2027
- Amid the COVID-19 crisis, the global market for Semiconductor Packaging estimated at US$26.7 Billion in the year 2020, is projected to reach a revised size of US$41.8 Billion by 2027, growing at a CAGR of 6.6% over the analysis period 2020-2027. Organic substrates, one of the segments analyzed in the report, is projected to record a 7.4% CAGR and reach US$22.3 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Lead frames segment is readjusted to a revised 6.3% CAGR for the next 7-year period.
- The U.S. Market is Estimated at $7.2 Billion, While China is Forecast to Grow at 10.2% CAGR
- The Semiconductor Packaging market in the U.S. is estimated at US$7.2 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$9.1 Billion by the year 2027 trailing a CAGR of 10.2% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.5% and 6% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.2% CAGR.
- Bonding wires Segment to Record 5.8% CAGR
- In the global Bonding wires segment, USA, Canada, Japan, China and Europe will drive the 5.3% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$3 Billion in the year 2020 will reach a projected size of US$4.3 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$5.7 Billion by the year 2027, while Latin America will expand at a 7% CAGR through the analysis period.

- Select Competitors (Total 41 Featured) -

• Amkor Technology, Inc.

• ASE Group

• Chipbond Technology Corporation

• ChipMOS Technologies, Inc.

• Fujitsu Ltd.

• Intel Corporation

• Interconnect Systems, Inc.

• Powertech Technology, Inc.

• Samsung Electronics Co., Ltd.

• Siliconware Precision Industries Co., Ltd. (SPIL)

• STATS ChipPAC Pte. Ltd.

• Tianshui Huatian Technology Co., Ltd.

• Unisem (M) Berhad

• UTAC Holdings Ltd.

Read the full report: https://www.reportlinker.com/p05959998/?utm_source=GNW

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW
Influencer Market Insights
World Market Trajectories
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Semiconductor
Packaging by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027 and % CAGR

Table 2: World Historic Review for Semiconductor Packaging by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 3: World 15-Year Perspective for Semiconductor Packaging
by Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa Markets for Years 2012, 2020 & 2027

Table 4: World Current & Future Analysis for Organic substrates
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 5: World Historic Review for Organic substrates by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 6: World 15-Year Perspective for Organic substrates by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 7: World Current & Future Analysis for Lead frames by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 8: World Historic Review for Lead frames by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2012 through 2019 and
% CAGR

Table 9: World 15-Year Perspective for Lead frames by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 10: World Current & Future Analysis for Bonding wires by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 11: World Historic Review for Bonding wires by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2012 through 2019 and
% CAGR

Table 12: World 15-Year Perspective for Bonding wires by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 13: World Current & Future Analysis for Other Materials
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 14: World Historic Review for Other Materials by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 15: World 15-Year Perspective for Other Materials by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 16: World Current & Future Analysis for Consumer
Electronics Industry by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets - Independent Analysis of Annual Sales in US$
Million for Years 2020 through 2027 and % CAGR

Table 17: World Historic Review for Consumer Electronics
Industry by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2012 through 2019 and % CAGR

Table 18: World 15-Year Perspective for Consumer Electronics
Industry by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2012, 2020 &
2027

Table 19: World Current & Future Analysis for Aerospace &
Defense by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027 and % CAGR

Table 20: World Historic Review for Aerospace & Defense by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 21: World 15-Year Perspective for Aerospace & Defense by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 22: World Current & Future Analysis for Medical Devices
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 23: World Historic Review for Medical Devices by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 24: World 15-Year Perspective for Medical Devices by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 25: World Current & Future Analysis for Communications
and Telecom by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets - Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027 and % CAGR

Table 26: World Historic Review for Communications and Telecom
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 27: World 15-Year Perspective for Communications and
Telecom by Geographic Region - Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2012, 2020 &
2027

Table 28: World Current & Future Analysis for Automotive by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 29: World Historic Review for Automotive by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin
America, Middle East and Africa Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2012 through 2019 and
% CAGR

Table 30: World 15-Year Perspective for Automotive by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

Table 31: World Current & Future Analysis for Other End-Uses by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 32: World Historic Review for Other End-Uses by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2012 through 2019 and % CAGR

Table 33: World 15-Year Perspective for Other End-Uses by
Geographic Region - Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2012, 2020 & 2027

III. MARKET ANALYSIS

UNITED STATES
Table 34: USA Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 35: USA Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 36: USA 15-Year Perspective for Semiconductor Packaging
by Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 37: USA Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 38: USA Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 39: USA 15-Year Perspective for Semiconductor Packaging
by End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

CANADA
Table 40: Canada Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 41: Canada Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 42: Canada 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 43: Canada Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 44: Canada Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 45: Canada 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

JAPAN
Table 46: Japan Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 47: Japan Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 48: Japan 15-Year Perspective for Semiconductor Packaging
by Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 49: Japan Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 50: Japan Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 51: Japan 15-Year Perspective for Semiconductor Packaging
by End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

CHINA
Table 52: China Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 53: China Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 54: China 15-Year Perspective for Semiconductor Packaging
by Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 55: China Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 56: China Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 57: China 15-Year Perspective for Semiconductor Packaging
by End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

EUROPE
Table 58: Europe Current & Future Analysis for Semiconductor
Packaging by Geographic Region - France, Germany, Italy, UK,
Spain, Russia and Rest of Europe Markets - Independent Analysis
of Annual Sales in US$ Million for Years 2020 through 2027 and
% CAGR

Table 59: Europe Historic Review for Semiconductor Packaging by
Geographic Region - France, Germany, Italy, UK, Spain, Russia
and Rest of Europe Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2012 through 2019 and % CAGR

Table 60: Europe 15-Year Perspective for Semiconductor
Packaging by Geographic Region - Percentage Breakdown of Value
Sales for France, Germany, Italy, UK, Spain, Russia and Rest of
Europe Markets for Years 2012, 2020 & 2027

Table 61: Europe Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 62: Europe Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 63: Europe 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 64: Europe Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 65: Europe Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 66: Europe 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

FRANCE
Table 67: France Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 68: France Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 69: France 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 70: France Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 71: France Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 72: France 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

GERMANY
Table 73: Germany Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 74: Germany Historic Review for Semiconductor Packaging
by Material - Organic substrates, Lead frames, Bonding wires
and Other Materials Markets - Independent Analysis of Annual
Sales in US$ Million for Years 2012 through 2019 and % CAGR

Table 75: Germany 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 76: Germany Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 77: Germany Historic Review for Semiconductor Packaging
by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses Markets - Independent Analysis of
Annual Sales in US$ Million for Years 2012 through 2019 and %
CAGR

Table 78: Germany 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

ITALY
Table 79: Italy Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 80: Italy Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 81: Italy 15-Year Perspective for Semiconductor Packaging
by Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 82: Italy Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 83: Italy Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 84: Italy 15-Year Perspective for Semiconductor Packaging
by End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

UNITED KINGDOM
Table 85: UK Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 86: UK Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 87: UK 15-Year Perspective for Semiconductor Packaging by
Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 88: UK Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 89: UK Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 90: UK 15-Year Perspective for Semiconductor Packaging by
End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

SPAIN
Table 91: Spain Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 92: Spain Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 93: Spain 15-Year Perspective for Semiconductor Packaging
by Material - Percentage Breakdown of Value Sales for Organic
substrates, Lead frames, Bonding wires and Other Materials for
the Years 2012, 2020 & 2027

Table 94: Spain Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 95: Spain Historic Review for Semiconductor Packaging by
End-Use - Consumer Electronics Industry, Aerospace & Defense,
Medical Devices, Communications and Telecom, Automotive and
Other End-Uses Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 96: Spain 15-Year Perspective for Semiconductor Packaging
by End-Use - Percentage Breakdown of Value Sales for Consumer
Electronics Industry, Aerospace & Defense, Medical Devices,
Communications and Telecom, Automotive and Other End-Uses for
the Years 2012, 2020 & 2027

RUSSIA
Table 97: Russia Current & Future Analysis for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials - Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027 and
% CAGR

Table 98: Russia Historic Review for Semiconductor Packaging by
Material - Organic substrates, Lead frames, Bonding wires and
Other Materials Markets - Independent Analysis of Annual Sales
in US$ Million for Years 2012 through 2019 and % CAGR

Table 99: Russia 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 100: Russia Current & Future Analysis for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses - Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027 and % CAGR

Table 101: Russia Historic Review for Semiconductor Packaging
by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses Markets - Independent Analysis of
Annual Sales in US$ Million for Years 2012 through 2019 and %
CAGR

Table 102: Russia 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

REST OF EUROPE
Table 103: Rest of Europe Current & Future Analysis for
Semiconductor Packaging by Material - Organic substrates, Lead
frames, Bonding wires and Other Materials - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027 and % CAGR

Table 104: Rest of Europe Historic Review for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials Markets - Independent
Analysis of Annual Sales in US$ Million for Years 2012 through
2019 and % CAGR

Table 105: Rest of Europe 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 106: Rest of Europe Current & Future Analysis for
Semiconductor Packaging by End-Use - Consumer Electronics
Industry, Aerospace & Defense, Medical Devices, Communications
and Telecom, Automotive and Other End-Uses - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027 and % CAGR

Table 107: Rest of Europe Historic Review for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses Markets - Independent Analysis of
Annual Sales in US$ Million for Years 2012 through 2019 and %
CAGR

Table 108: Rest of Europe 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

ASIA-PACIFIC
Table 109: Asia-Pacific Current & Future Analysis for
Semiconductor Packaging by Geographic Region - Australia,
India, South Korea and Rest of Asia-Pacific Markets -
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027 and % CAGR

Table 110: Asia-Pacific Historic Review for Semiconductor
Packaging by Geographic Region - Australia, India, South Korea
and Rest of Asia-Pacific Markets - Independent Analysis of
Annual Sales in US$ Million for Years 2012 through 2019 and %
CAGR

Table 111: Asia-Pacific 15-Year Perspective for Semiconductor
Packaging by Geographic Region - Percentage Breakdown of Value
Sales for Australia, India, South Korea and Rest of
Asia-Pacific Markets for Years 2012, 2020 & 2027

Table 112: Asia-Pacific Current & Future Analysis for
Semiconductor Packaging by Material - Organic substrates, Lead
frames, Bonding wires and Other Materials - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027 and % CAGR

Table 113: Asia-Pacific Historic Review for Semiconductor
Packaging by Material - Organic substrates, Lead frames,
Bonding wires and Other Materials Markets - Independent
Analysis of Annual Sales in US$ Million for Years 2012 through
2019 and % CAGR

Table 114: Asia-Pacific 15-Year Perspective for Semiconductor
Packaging by Material - Percentage Breakdown of Value Sales for
Organic substrates, Lead frames, Bonding wires and Other
Materials for the Years 2012, 2020 & 2027

Table 115: Asia-Pacific Current & Future Analysis for
Semiconductor Packaging by End-Use - Consumer Electronics
Industry, Aerospace & Defense, Medical Devices, Communications
and Telecom, Automotive and Other End-Uses - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027 and % CAGR

Table 116: Asia-Pacific Historic Review for Semiconductor
Packaging by End-Use - Consumer Electronics Industry, Aerospace &
Defense, Medical Devices, Communications and Telecom,
Automotive and Other End-Uses Markets - Independent Analysis of
Annual Sales in US$ Million for Years 2012 through 2019 and %
CAGR

Table 117: Asia-Pacific 15-Year Perspective for Semiconductor
Packaging by End-Use - Percentage Breakdown of Value Sales for
Consumer Electronics Industry, Aerospace & Defense, Medical
Devices, Communications and Telecom, Automotive and Other
End-Uses for the Years 2012, 2020 & 2027

AUSTRALIA
Table 118: Australia Current & Future Analysis for
Semiconductor Packaging by Material - Organic substrates, Lead
frames, Bonding wires and Other Materials - Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027 and % CAGR

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