Worldwide Audio DSP Industry to 2027 - Advantage of Compound Semiconductors Over Silicon-Based Technology

Dublin, May 24, 2021 (GLOBE NEWSWIRE) -- The "Audio DSP Market By Type and End Use: Global Opportunity Analysis and Industry Forecast, 2020-2027" report has been added to ResearchAndMarkets.com's offering.

The global audio DSP market was valued at $11.06 billion in 2019, and is projected to reach $23.43 billion by 2027, registering a CAGR of 9.3% from 2020 to 2027. The audio DSP market is currently in its growth stage and is expected to register substantial growth in the future, owing to high investments in R&D activities by market players and increase in focus toward Internet of Things (IoT). Other factors that drive the market growth include increase in demand for automobile & electronics and development of smart devices.

The scope of the report discusses potential opportunities for key players to enter the audio DSP market. Furthermore, it provides an in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter's five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. Moreover, it features strategies adopted by key market players to maintain their foothold in the market.

The audio DSP market size is segmented on the basis of type, end use, and region. By type, the market is bifurcated into discrete and integrated. By end use, it is analyzed across computer, phones, tablets, over-ear headphones, TWS, home entertainment, commercial, automotive, portable, smart home, IoT, wearable, and AR/VR. By Region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with its prominent countries.

The key players profiled in the audio DSP industry include Texas Instrument, Altera Corporation, NXP Semiconductors, Broadcom Corporation, Analog Devices, Renesas Electronics, Xilinx Incorporated, Toshiba Corporation, LSI Corporation, and Ceva Incorporated. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Key Benefits For Stakeholders

• This study includes the analytical depiction of the audio DSP market forecast along with the current trends and future estimations to determine the imminent investment pockets.

• The report presents information regarding the key drivers, restraints, and opportunities in the audio DSP market.

• The audio DSP market trends are quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.

• Porter's five forces analysis illustrates the potency of the buyers and suppliers in the industry.

Key Topics Covered:

Chapter 1: Introduction
1.1. Report Description
1.2. Key Benefits for Stakeholders
1.3. Key Market Segments
1.4. Research Methodology
1.4.1. Primary Research
1.4.2. Secondary Research
1.4.3. Analyst Tools and Models

Chapter 2: Executive Summary
2.1. Cxo Perspective

Chapter 3: Market Landscape
3.1. Market Definition and Scope
3.2. Key Findings
3.2.1. Top Impacting Factors
3.2.2. Top Investment Pockets
3.3. Porter's Five Forces Analysis
3.4. Market Share Analysis (2019)
3.6. Market Dynamics
3.6.1. Drivers
3.6.1.1. Advantage of Compound Semiconductors Over Silicon-Based Technology
3.6.1.2. Increase in Demand for Compound Semiconductor Epitaxial Wafer in Led Technology
3.6.1.3. Emerging Trends Toward Compound Semiconductor Wafers in the Automotive Industry
3.6.2. Restraints
3.6.2.1. High-Cost Associated with Compound Semiconductor Materials and Components
3.6.3. Opportunity
3.6.3.1. Emerging Usage of Compound Semiconductors in Smart Technologies
3.7. Pricing Analysis (2019)
3.8. COVID-19 Impact Analysis
3.8.1. COVID-19 Outbreak
3.8.2. Impact on Market Size
3.8.3. End-user Trends, Preferences, and Budget Impact
3.8.4. Parent Industry Impact
3.8.5. Key Player Strategies to Tackle Negative Impact
3.8.5.1. Limiting Cuts to R&D Expense:
3.8.5.2. Focusing on Next-Generation Products
3.8.5.3. Shifting Toward Agile Supply Chain Model
3.8.6. Opportunity Window
3.9. Technology Trends

Chapter 4: Audio Dsp Market, by Type
4.1. Overview
4.2. Discrete
4.2.1. Key Market Trends, Growth Factors, and Opportunities
4.2.2. Market Size and Forecast, by Region
4.2.3. Market Analysis, by Country
4.3. Integrated
4.3.1. Key Market Trends, Growth Factors, and Opportunities
4.3.2. Market Size and Forecast, by Region
4.3.3. Market Analysis, by Country

Chapter 5: Audio Dsp Market, by End Use
5.1. Overview
5.2. Computer
5.2.1. Metal Organic Chemical Vapor Deposition
5.2.2. Key Market Trends, Growth Factors, and Opportunities
5.2.3. Market Size and Forecast, by Region
5.2.4. Market Analysis, by Country
5.3. Phones
5.3.1. Metal Organic Molecular Beam Epitaxy
5.3.2. Key Market Trends, Growth Factors, and Opportunities
5.3.3. Market Size and Forecast, by Region
5.3.4. Market Analysis, by Country
5.4. Tablets
5.4.1. Key Market Trends, Growth Factors, and Opportunities
5.4.2. Market Size and Forecast, by Region
5.4.3. Market Analysis, by Country
5.5. Over-Ear Headphones
5.5.1. Liquid Phase Epitaxy
5.5.2. Key Market Trends, Growth Factors, and Opportunities
5.5.3. Market Size and Forecast, by Region
5.5.4. Market Analysis, by Country
5.6. Tws
5.6.1. Key Market Trends, Growth Factors, and Opportunities
5.6.2. Market Size and Forecast, by Region
5.6.3. Market Analysis, by Country
5.7. Home Entertainment
5.7.1. Key Market Trends, Growth Factors, and Opportunities
5.7.2. Market Size and Forecast, by Region
5.7.3. Market Analysis, by Country
5.8. Commercial
5.8.1. Key Market Trends, Growth Factors, and Opportunities
5.8.2. Market Size and Forecast, by Region
5.8.3. Market Analysis, by Country
5.9. Automotive
5.9.1. Key Market Trends, Growth Factors, and Opportunities
5.9.2. Market Size and Forecast, by Region
5.9.3. Market Analysis, by Country
5.10. Portable
5.10.1. Key Market Trends, Growth Factors, and Opportunities
5.10.2. Market Size and Forecast, by Region
5.10.3. Market Analysis, by Country
5.11. Smart Home
5.11.1. Key Market Trends, Growth Factors, and Opportunities
5.11.2. Market Size and Forecast, by Region
5.11.3. Market Analysis, by Country
5.12. Iot
5.12.1. Key Market Trends, Growth Factors, and Opportunities
5.12.2. Market Size and Forecast, by Region
5.12.3. Market Analysis, by Country
5.13. Wearable
5.13.1. Key Market Trends, Growth Factors, and Opportunities
5.13.2. Market Size and Forecast, by Region
5.13.3. Market Analysis, by Country
5.14. Ar/Vr
5.14.1. Key Market Trends, Growth Factors, and Opportunities
5.14.2. Market Size and Forecast, by Region
5.14.3. Market Analysis, by Country

Chapter 6: Audio Dsp Market, by Region
6.1. Overview
6.2. North America
6.3. Europe
6.4. Asia-Pacific
6.5. LAMEA

Chapter 7: Company Profiles
7.1. Analog Devices Incorporated
7.1.1. Company Overview
7.1.2. Key Executives
7.1.3. Company Snapshot
7.1.4. Operating Business Segments
7.1.5. Product Portfolio
7.1.6. R&D Expenditure
7.1.7. Business Performance
7.1.8. Key Strategic Moves and Developments
7.2. Broadcom Incorporated (Broadcom Corporation)
7.2.1. Company Overview
7.2.2. Key Executives
7.2.3. Company Snapshot
7.2.4. Operating Business Segments
7.2.5. Product Portfolio
7.2.6. R&D Expenditure
7.2.7. Business Performance
7.2.8. Key Strategic Moves and Developments
7.3. Ceva Incorporated
7.3.1. Company Overview
7.3.2. Key Executives
7.3.3. Company Snapshot
7.3.4. Operating Business Segments
7.3.5. Product Portfolio
7.3.6. R&D Expenditure
7.3.7. Business Performance
7.3.8. Key Strategic Moves and Developments
7.4. Intel Corporation (Altera Corporation)
7.4.1. Company Overview
7.4.2. Key Executives
7.4.3. Company Snapshot
7.4.4. Operating Business Segments
7.4.5. Product Portfolio
7.4.6. R&D Expenditure
7.4.7. Business Performance
7.4.8. Key Strategic Moves and Developments
7.5. Nxp Semiconductors N. V
7.5.1. Company Overview
7.5.2. Key Executives
7.5.3. Company Snapshot
7.5.4. Operating Business Segments
7.5.5. Product Portfolio
7.5.6. R&D Expenditure
7.5.7. Business Performance
7.5.8. Key Strategic Moves and Developments
7.6. Qualcomm Incorporated
7.6.1. Company Overview
7.6.2. Key Executives
7.6.3. Company Snapshot
7.6.4. Operating Business Segments
7.6.5. Product Portfolio
7.6.6. R&D Expenditure
7.6.7. Business Performance
7.6.8. Key Strategic Moves and Developments
7.7. Renesas Electronics Corporation
7.7.1. Company Overview
7.7.2. Key Executives
7.7.3. Company Snapshot
7.7.4. Operating Business Segments
7.7.5. Product Portfolio
7.7.6. R&D Expenditure
7.7.7. Business Performance
7.7.8. Key Strategic Moves and Developments
7.8. Texas Instruments Incorporated.
7.8.1. Company Overview
7.8.2. Key Executives
7.8.3. Company Snapshot
7.8.4. Operating Business Segments
7.8.5. Product Portfolio
7.8.6. R&D Expenditure
7.8.7. Business Performance
7.8.8. Key Strategic Moves and Developments
7.9. Toshiba Corporation
7.9.1. Company Overview
7.9.2. Key Executives
7.9.3. Company Snapshot.
7.9.4. Operating Business Segments
7.9.5. Product Portfolio
7.9.6. R&D Expenditure
7.9.7. Business Performance
7.9.8. Key Strategic Moves and Developments
7.10. Xilinx Incorporated
7.10.1. Company Overview
7.10.2. Key Executives
7.10.3. Company Snapshot
7.10.4. Operating Business Segments
7.10.5. Product Portfolio
7.10.6. R&D Expenditure
7.10.7. Business Performance
7.10.8. Key Strategic Moves and Developments

For more information about this report visit https://www.researchandmarkets.com/r/r0ian1

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