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Worldwide E-Scrap and Printed Circuit Board (PCB) E-Scrap Industry to 2027 - Strategic Recommendations for New Entrants

Dublin, Feb. 02, 2021 (GLOBE NEWSWIRE) -- The "E-Scrap and Printed Circuit Board (PCB) E-Scrap - Global Market Outlook (2019-2027)" report has been added to ResearchAndMarkets.com's offering.

According to this report, the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market is growing at a CAGR of 7.6% during the forecast period. The increasing volumes of electronic waste across the world and increased numbers of regulations mandating proper management of e-waste are the major factors propelling market growth. However, the high initial cost of electronic waste management is hampering market growth.

E-scrap and printed circuit board (PCB) e-scrap is an electronic waste, which defines discarded electronic devices. Used electronics which are meant for reclaim, resale, recycling via material recovery are also considered electronic waste. The process of electronic waste is a combination of manual as well as mechanical dismantling, size reduction, and sending hazardous waste for final disposal and metal components for processing.

Based on the e-scrap source, the household appliances segment is estimated to have lucrative growth due to the growing usage of complex electronics devices such as laptops, smartphones, tablets, and a variety of connected devices. By geography, Asia Pacific is going to have lucrative growth during the forecast period. The blooming consumer electronics industry and the increasing regulations pertaining to the proper disposal of e-waste and the increased demand for copper and other metals in the fields of telecommunication and construction in the region are the key factors attributed to its dominance.

Some of the key players profiled in the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market include AmeriScraps, Boliden Group, Dowa Holdings Co. Ltd., Feeco International, GCL Recycling and Refining, LS-Nikko Copper Inc., Mairec, Qizheng, Ultromext Ltd, URT Recycling Technology, Umicore N.V., Sims Recycling Solutions, EnvironCom, Waste Management, Dongjiang, Cimelia, and Stena Metall Group.

PCB E-Scrap Types Covered:

  • Smartphones

  • Telecommunications Circuit Cards

  • Network Communication Boards

  • PC Motherboards

  • Circuit Packs

  • Laptops Boards

E-Scrap Sources Covered:

  • Entertainment Devices

  • Household Appliances

  • IT and Telecommunication Products

  • Other E-Scrap Sources

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Materials Recovered (PCB E-Scrap) Covered:

  • Precious Metals

  • Metals

  • Ferrous Components

Applications Covered:

  • Enterprises

  • Small and Medium-sized Businesses (SMBs)

Regions Covered:

  • North America

  • US

  • Canada

  • Mexico

  • Europe

  • Germany

  • UK

  • Italy

  • France

  • Spain

  • Rest of Europe

  • Asia Pacific

  • Japan

  • China

  • India

  • Australia

  • New Zealand

  • South Korea

  • Rest of Asia Pacific

  • South America

  • Argentina

  • Brazil

  • Chile

  • Rest of South America

  • Middle East & Africa

  • Saudi Arabia

  • UAE

  • Qatar

  • South Africa

  • Rest of Middle East & Africa

What the report offers:

  • Market share assessments for the regional and country-level segments

  • Strategic recommendations for the new entrants

  • Covers Market data for the years 2018, 2019 2020, 2024, and 2027

  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)

  • Strategic recommendations in key business segments based on the market estimations

  • Competitive landscaping mapping the key common trends

  • Company profiling with detailed strategies, financials, and recent developments

  • Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Application Analysis
3.7 Emerging Markets
3.8 Impact of Covid-19

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, By PCB E-Scrap Type
5.1 Introduction
5.2 Smartphones
5.3 Telecommunications Circuit Cards
5.4 Network Communication Boards
5.5 PC Motherboards
5.6 Circuit Packs
5.7 Laptops Boards

6 Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, By E-Scrap Source
6.1 Introduction
6.2 Entertainment Devices
6.3 Household Appliances
6.4 IT and Telecommunication Products
6.5 Other E-Scrap Sources
6.5.1 Laboratory Equipment
6.5.2 Other IT Assets

7 Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, By Material Recovered (PCB E-Scrap)
7.1 Introduction
7.2 Precious Metals
7.2.1 Silver
7.2.2 Gold
7.2.3 Palladium
7.3 Metals
7.3.1 Aluminum
7.3.2 Copper
7.3.3 Tin
7.4 Ferrous Components

8 Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, By Application
8.1 Introduction
8.2 Enterprises
8.3 Small and Medium-sized Businesses (SMBs)

9 Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, By Geography
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 UK
9.3.3 Italy
9.3.4 France
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 Japan
9.4.2 China
9.4.3 India
9.4.4 Australia
9.4.5 New Zealand
9.4.6 South Korea
9.4.7 Rest of Asia Pacific
9.5 South America
9.5.1 Argentina
9.5.2 Brazil
9.5.3 Chile
9.5.4 Rest of South America
9.6 Middle East & Africa
9.6.1 Saudi Arabia
9.6.2 UAE
9.6.3 Qatar
9.6.4 South Africa
9.6.5 Rest of Middle East & Africa

10 Key Developments
10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies

11 Company Profiling
11.1 AmeriScraps
11.2 Boliden Group
11.3 Dowa Holdings Co. Ltd.
11.4 Feeco International
11.5 GCL Recycling and Refining
11.6 LS-Nikko Copper Inc.
11.7 Mairec
11.8 Qizheng
11.9 Ultromext Ltd
11.10 URT Recycling Technology
11.11 Umicore N.V.
11.12 Sims Recycling Solutions
11.13 EnvironCom
11.14 Waste Management
11.15 Dongjiang
11.16 Cimelia
11.17 Stena Metall Group

For more information about this report visit https://www.researchandmarkets.com/r/kk3lb0

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900