Previous close | 64,100.00 |
Open | 64,700.00 |
Bid | 64,300.00 x 0 |
Ask | 64,400.00 x 0 |
Day's range | 64,300.00 - 65,000.00 |
52-week range | 53,000.00 - 70,000.00 |
Volume | |
Avg. volume | 1,463,275 |
Market cap | 509.827T |
Beta (5Y monthly) | 0.85 |
PE ratio (TTM) | N/A |
EPS (TTM) | N/A |
Earnings date | N/A |
Forward dividend & yield | 1,448.00 (2.26%) |
Ex-dividend date | 27 Dec 2023 |
1y target est | N/A |
Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report
Earnings preview of key companies reporting next week and what to look out for.
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