Inari Amertron Berhad (0166.KL)

3.0300 -0.0300 (-0.98%) At close: 04:54PM MYT

Inari Amertron Berhad

D-07-03, Plaza Kelana Jaya
Jalan SS 7/13A Kelana Jaya
Petaling Jaya 47301
Malaysia
60 3 7876 0169
https://www.inari-amertron.com

Sector(s): Technology
Industry: Semiconductor Equipment & Materials
Full-time employees: 

Key executives

Name	Title	Pay	Exercised	Year born
Mr. Kean Cheong Lau	Group CEO & Executive Director	N/A	N/A	1967
Dr. Seng Chuan Tan	Executive Vice Chairman	N/A	N/A	1955
Mr. Gian Kui Wong	Executive Director	810k	N/A	1960
Mr. Phon Guan Ho	Executive Director	N/A	N/A	1955
Mr. Mang Lee Mai	Executive Director	N/A	N/A	1959
Ms. Poh Leng Chong	Group Chief Financial Officer	N/A	N/A	1970
Mr. Bin Samsuri Sabran	Head of Business Unit - Inari Technology Sdn Bhd	N/A	N/A	1965
Mr. Kar Leong Khoo	Senior Vice President of Inari Integrated Systems Sdn Bhd	N/A	N/A	1970
Mr. Kha Choy Foo	Head of Business Unit - Amertron Technology (Kunshan) Co. Ltd	N/A	N/A	N/A
Mr. Choon Meng Pang	Head of Business Unit of Amertron Incorporated	N/A	N/A	N/A

Amounts are as of 31 December 2023, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in MYR.

Description

Inari Amertron Berhad, an investment holding company, engages in the provision of electronic manufacturing, outsourced semiconductor assembly, and testing services for radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies in Malaysia, Singapore, the United States, China, the Philippines, and internationally. The company offers wafer processing services covering bumping, probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection; and chip fabrication and wafer certification in fiber optic chips, such as wafer scribe and cleave, bar aligning, demount-load fixtures and facet coating, and chip on carrier. It also provides advanced system in package assembly and test services, including fine-pitch surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill, and post-mold oxide plating and final testing, as well as finial testing of advanced communication chips; and other services, such as new product introduction services, failure analysis lab, sensor and IC package design and characterization, process customization and assembly, product testing, box build, and direct-to-end-customer dropship services. In addition, the company manufactures electronics optical fiber and optoelectronics devices, communication chips, and die preparations, as well as offers manufactures, assembles, and tests optoelectronic and sensor components, modules, and systems; designs, develops, and manufactures fiber optic products; designs, assembles, and supplies semiconductor manufacturing process tools, as well as customized semiconductor process tools and parts; and invests in properties. Inari Amertron Berhad was founded in 2006 and is based in Petaling Jaya, Malaysia.

Corporate governance

Inari Amertron Berhad’s ISS governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder rights: N/A; Compensation: N/A.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.