Taiwan Semiconductor Manufacturing Company Limited (2330.TW)
| Previous close | 766.00 |
| Open | 788.00 |
| Bid | 781.00 x 0 |
| Ask | 782.00 x 0 |
| Day's range | 782.00 - 789.00 |
| 52-week range | 494.50 - 826.00 |
| Volume | |
| Avg. volume | 43,274,840 |
| Market cap | 20.281T |
| Beta (5Y monthly) | 1.24 |
| PE ratio (TTM) | 23.31 |
| EPS (TTM) | N/A |
| Earnings date | N/A |
| Forward dividend & yield | 14.00 (1.83%) |
| Ex-dividend date | 13 Jun 2024 |
| 1y target est | N/A |
- Business Wire
TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
SANTA CLARA, Calif., April 24, 2024--TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSM
- Business Wire
TSMC Files Annual Report on Form 20-F for 2023
HSINCHU, Taiwan, April 18, 2024--TSMC (TWSE: 2330, NYSE: TSM) today filed its 2023 annual report on Form 20-F with the U.S. Securities and Exchange Commission.
- Business Wire
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
SANTA CLARA, Calif., September 27, 2023--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D
