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Techbond Group Berhad (5289.KL)

Kuala Lumpur - Kuala Lumpur Delayed price. Currency in MYR
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0.5350-0.0100 (-1.83%)
As of 11:38AM MYT. Market open.

Techbond Group Berhad

No. 36, Jalan Anggerik Mokara 31/59
Seksyen 31 Kota Kemuning
Shah Alam 40460
Malaysia
60 3 5122 3333
https://www.techbond.com.my

Sector(s)Basic Materials
IndustrySpecialty Chemicals
Full-time employees95

Key executives

NameTitlePayExercisedYear born
Mr. Seng Thye LeeMD & DirectorN/AN/A1961
Ms. Siew Geak TanExecutive DirectorN/AN/A1961
Mr. Seh Meng LeeDeputy MD & Executive DirectorN/AN/A1990
Mr. Yuen Shiuan LeeOperation ManagerN/AN/A1996
Ms. Wai Leng OngCompany SecretaryN/AN/AN/A
Amounts are as of 31 December 2023, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in MYR.

Description

Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based and solvent-based sealants. It also provides products and services comprising original equipment manufacturer industrial adhesives, chemicals, and adhesive repellents and cleaners, as well as adhesive blending machines; and cleaners, spare parts, and maintenance services. In addition, the company manufactures and markets phenolic resins, paper resins, additives, formalin, and phenoset microspheres. The company's industrial adhesives are used in manufacturing a range of products, including wood-based products, paper and packaging products, cigarettes and cigarette packs, automotive applications, personal care products, bookbinding, and mattresses, as well as building and construction applications. It also exports its products. The company was founded in 1992 and is headquartered in Shah Alam, Malaysia. Techbond Group Berhad is a subsidiary of Sonicbond Sdn. Bhd.

Corporate governance

Techbond Group Berhad’s ISS governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder rights: N/A; Compensation: N/A.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.