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Amkor Technology, Inc. (AMKR)

NasdaqGS - NasdaqGS Real-time price. Currency in USD
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32.24-0.49 (-1.50%)
At close: 04:00PM EDT
32.24 0.00 (0.00%)
After hours: 04:03PM EDT

Amkor Technology, Inc.

2045 East Innovation Circle
Tempe, AZ 85284
United States
480 821 5000
https://amkor.com

Sector(s)Technology
IndustrySemiconductor Equipment & Materials
Full-time employees28,700

Key executives

NameTitlePayExercisedYear born
Mr. James J. KimExecutive Chairman of the Board2.47MN/A1936
Mr. Giel RuttenPresident, CEO & Director2.59M1.38M1957
Ms. Susan Y. KimExecutive Vice Chairman227kN/A1963
Ms. Megan FaustExecutive VP, CFO & Treasurer1.16M1.29M1974
Mr. Mark N. RogersExecutive VP, General Counsel & Corporate Secretary1.06MN/A1966
Mr. Farshad HaghighiExecutive VP & Chief Sales Officer1.03M499.59k1963
Ms. Jennifer JueVice President of Investor Relations & FinanceN/AN/AN/A
Mr. Kevin EngelExecutive Vice President of Business UnitsN/AN/A1972
JinAn LeeExecutive Vice President of Worldwide ManufacturingN/AN/AN/A
Amounts are as of 31 December 2022, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.

Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.

Corporate governance

Amkor Technology, Inc.’s ISS governance QualityScore as of 1 March 2024 is 5. The pillar scores are Audit: 4; Board: 8; Shareholder rights: 5; Compensation: 5.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.