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BE Semiconductor Industries N.V. (BESIY)

Other OTC - Other OTC Delayed price. Currency in USD
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156.31-4.25 (-2.65%)
At close: 03:04PM EDT

BE Semiconductor Industries N.V.

Ratio 6
Duiven 6921 RW
Netherlands
31 26 319 4500
https://www.besi.com

Sector(s)Technology
IndustrySemiconductor Equipment & Materials
Full-time employees1,736

Key executives

NameTitlePayExercisedYear born
Mr. Richard W. BlickmanChairman of Management Board, President & CEO2.04MN/A1954
Mr. Leon VerweijenSenior Vice President of FinanceN/AN/A1976
Mr. Henk-Jan Jonge PoerinkSenior Vice President of Global OperationsN/AN/A1970
Edmond FrancoVice President of Corporate DevelopmentN/AN/AN/A
Mr. Rene W. HendriksSenior Vice President of Sales - North America & EuropeN/AN/A1961
Mr. Peter WiednerSenior Vice President of Sub Micron Die AttachN/AN/A1970
Mr. Jong Kwon ParkSenior Vice President of Sales & Customer Support - APACN/AN/A1966
Mr. Jeroen KleijburgSenior Vice President of PackagingN/AN/A1974
Mr. Christoph ScheiringSenior Vice President of Die AttachN/AN/A1970
Andrea Kopp-BattagliaSenior Vice President of Finance- Die AttachN/AN/A1978
Amounts are as of 31 December 2023, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.

Description

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Corporate governance

BE Semiconductor Industries N.V.’s ISS governance QualityScore as of 1 March 2024 is 4. The pillar scores are Audit: 5; Board: 2; Shareholder rights: 5; Compensation: 8.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.