DLG.DE - Dialog Semiconductor Plc

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  • EQS Group

    Dialog Semiconductor Plc.: Battery Management Webcast Invite 4th June 2020

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous 26.05.2020 / 18:30 The issuer is solely responsible for the content of this announcement. Dialog Semiconductor (XETRA: DLG), a provider of highly integrated power management, Configurable Mixed-signal IC, AC/DC power conversion, solid state lighting and Bluetooth(R) low energy technology, will host a webcast on battery management on Thursday 4th June 2020. Dr Jalal Bagherli, Chief Executive Officer of Dialog Semiconductor, and Vivek Bhan, Senior Vice President (SVP) and General Manager (GM), Custom Mixed Signal will host the webcast.Davin Lee, SVP and GM, Advanced Mixed Signal and Wissam Jabre, Chief Financial Officer and SVP, Finance will join for the Q&A session.The webcast will be conducted in English and will begin at 15.00 (London) / 16.00 (Frankfurt).Please see below for call details.Webcast LinkClick on the link above to attend the presentation from your laptop, tablet or mobile device. Audio will stream through your selected device, so be sure to have headphones or your volume turned up. A full replay of the presentation will be available at the same link shortly after the conclusion of the live presentation. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *26.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1055623 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Plc.: Announcement related to the first interim (six weeks) settlement of the second tranche of shares pursuant to the share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019.

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Share Buyback 18.05.2020 / 18:30 The issuer is solely responsible for the content of this announcement. London, UK, May 18, 2020 - Dialog Semiconductor Plc (XTRA:DLG) reports that, pursuant to the second tranche of the share buyback programme announced by the Company on March 3, 2020, the Company has purchased the following ordinary shares in the Company from HSBC Bank plc:Date of purchase Number of ordinary shares purchased by the Company in the first settlement of the second tranche of the 2019 buyback programme Average price per share (EUR) in the first settlement of the second tranche of the 2019 buyback programme Total number of ordinary shares purchased by the Company in the second tranche of the 2019 buyback programme Total number of ordinary shares purchased by the Company under the the 2019 buyback programme May 18, 2020 654,087 25.7173 654,087 3,788,982 Further information on the Company's share buyback programme is available on the Company's website at:http://www.dialog-semiconductor.com/investor-relations/financial-news/share-buybacksDialog and the Dialog logo are registered trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2020 Dialog Semiconductor All Rights ReservedFor further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.4 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006). For more information, visit www.dialog-semiconductor.com.Forward Looking Statements This press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *18.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1049901 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Adds New Features to Bluetooth(R) low energy SoCs to Reduce Spread of COVID-19 (news with additional features)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product Launch 18.05.2020 / 08:00 The issuer is solely responsible for the content of this announcement. Latest software release enables point-to-point wireless distance measurements, enabling highly accurate tracing capabilities for its DA1469x Bluetooth(R) low energy product family to support new social distancing normsLondon, United Kingdom - May 18, 2020 - Dialog Semiconductor plc (XETRA:DLG), a leading provider of battery management, AC/DC power conversion, Wi-Fi(R), Bluetooth(R) low energy and Industrial ICs, today announced a new Wireless Ranging (WiRa(TM)) Software Development Kit (SDK) that adds highly accurate and reliable distance measurement capabilities to its DA1469x family of BLE SoCs.The need for more accurate and reliable distance measurement and tracing technology has become even more critical in the wake of COVID-19. With businesses across the globe planning a controlled reopening of their workplaces, they are looking for solutions that will help guarantee safe distances between employees and improved contact tracing capabilities, to ensure safe working environments and peace of mind for employees.Current Bluetooth low energy market solutions for distance measurement and positioning are based on measuring the strength or power of the received radio signal, known as Received Signal Strength Indicator (RSSI) measurements. However, these received power measurements may be inherently flawed due to the sensitivity of objects in the radio path blocking or reflecting the radio signals.Dialog's new Wireless Ranging SDK succeeds where RSSI falls short, leveraging a proprietary radar-like implementation for highly improved distance measurement accuracy between BLE connected devices. By interleaving Bluetooth LE data packets with constant tone frequency exchanges, the DA1469x on-chip 2.4 GHz radio generates the signals needed for phase-based ranging. The high resolution on-chip sampling of radio waves provides high quality IQ samples that form the input for distance determination. Data processing algorithms filter the data for noise, interference and reflections, to produce the shortest over-the-air signal path length as an accurate distance output.The BLE compliant stack and WiRa(TM) software implementation that Dialog offers does not require hardware adaptations or an external host processor, ensuring co-existence between the Bluetooth communication and the distance measurement process."Dialog's Bluetooth low energy solutions are already finding their way into a variety of products to help slow the spread of COVID-19", said Sean McGrath, Senior Vice President, Connectivity and Audio Business Group. "By adding unique, accurate distance measurement capabilities to our DA1469x SoCs, we expect to accelerate more tracing type applications and products into deployment on a global scale over the next few months. My expectation and hope is that this may help to significantly slow or stop the spread of the virus."For more information, documentation and SDK download please, visit: https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/products/smartbond-wireless-ranging-SDK ENDSNOTES Dialog, the Dialog logo, SmartBond are WiRa are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2020 Dialog Semiconductor. All rights reserved. Media Contact: Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845 8520 mark.tyndall@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) powering Internet of Things and Industry 4.0 applications. Dialog's solutions are integral to some of today's leading smartphones and facilitate increased performance and productivity on the go. From making smartphones more power efficient and shortening charging times, to enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit its employees, community, other stakeholders and environment. Dialog is headquartered near London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.42 billion in revenue and is consistently one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006)For more information, visit www.dialog-semiconductor.com. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Additional features: Picture: http://newsfeed2.eqs.com/dialog-semiconductor/1048695.html Subtitle: Dialog Adds New Features to Bluetooth SoC's to reduce spread of Covis-19 * * *18.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1048695 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Extends IoT Connectivity Portfolio with New Ultra-Low-Power Wi-Fi SoC.The DA16200's VirtualZero(TM) technology enables always-on IoT devices to achieve years of battery life while maintaining continuous Wi-Fi connections. (news with additional features)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product Launch 11.05.2020 / 04:00 The issuer is solely responsible for the content of this announcement. London, United Kingdom - May 11, 2020 - Dialog Semiconductor plc (XETRA:DLG), a leading provider of battery management, AC/DC power conversion, Wi-Fi(R), Bluetooth(R) low energy and Industrial ICs, today announced the availability of the DA16200, a highly-integrated, ultra-low-power Wi-Fi networking SoC, and two modules that leverage Dialog's VirtualZero technology to deliver a breakthrough in battery life for Wi-Fi connected, battery-powered IoT devices.The rise of IoT products, including connected door locks, thermostats and security video cameras, that require "always on" connectivity with a continuous Wi-Fi connection has challenged engineers to develop solutions that don't compromise battery life. Unlike competing Wi-Fi SoCs, the DA16200 is specifically optimized to support such battery-powered IoT devices. The DA16200's VirtualZero technology enables such a low level of power consumption that even continuously connected devices can typically achieve at least a year of battery life. In fact, three to five years of battery life is common.The SoC utilizes an algorithm-driven design to provide the lowest power solution for facilitating an extended battery life, while also maintaining a continuous Wi-Fi connection to ensure that end users always maintain control of their devices.The highly integrated DA16200 runs the entire Wi-Fi system, security and networking protocol stack, eliminating the need for an external network processor, CPU or microcontroller. It contains an 802.11b/g/n radio (PHY), baseband processor, MAC, on-chip memory, dedicated encryption engine and an ARM(R) Cortex(R)-M4F host networking applications processor, all on a monolithic silicon die.To achieve extended range without compromising battery life, the DA16200 also features an integrated power amplifier (PA) and low-noise amplifier (LNA), offering users industry-leading output power and receiver sensitivity.Alongside the SoC, Dialog is also launching two DA16200-based modules that deliver flexibility and design options for implementing Wi-Fi simply and easily, ensuring all customers can benefit from the SoC's high level of integration and programmable ease of use. Both modules include 4MB flash memory and all required RF components, including a crystal oscillator, RF-lumped filter and either a chip antenna or a u.FL connector for an external antenna.The modules are fully certified for worldwide operation, including certifications for FCC, IC, CE, Telec, Korea and SRRC. Additionally, both the SoC and modules are Wi-Fi CERTIFIED(R) for interoperability."As a proven leader in Bluetooth(TM) low energy connectivity, shipping upwards of 100 million units annually, these new Wi-Fi products further strengthen our position," said Sean McGrath, Senior VP, Connectivity and Audio Business Group, Dialog Semiconductor. "Delivering Wi-Fi on a battery isn't solely about achieving extended battery lifetime; it's about enabling IoT developers to unlock the full potential of smart devices by delivering low-power functionality in conjunction with always-on connectivity. That's the breakthrough the IoT market sorely needs and that the new SoC and modules provide."The DA16200 SoC and modules are equipped with industry-leading security protocols, including the latest generation hardware encryption engine and authentication standards for safeguarding against potential threats. Each of these products meets WPA/2/3 Personal and Enterprise standards and features upper layer security for TLS and HTTPs. Additionally, the SoC and modules can be securely booted and debugged and provide secure asset storage.Evaluation boards and a complete software development kit (SDK) are now available for the DA16200 SoC and modules via DigiKey. The SDK includes sample applications, provisioning apps, AT command library, power management tools and more.For more information on these devices, please visit: https://www.dialog-semiconductor.com/products/da16200.ENDSNOTESDialog, the Dialog logo, VirtualZero are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2020 Dialog Semiconductor. All rights reserved.Media Contact: Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845 8520 mark.tyndall@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) powering Internet of Things and Industry 4.0 applications. Dialog's solutions are integral to some of today's leading smartphones and facilitate increased performance and productivity on the go. From making smartphones more power efficient and shortening charging times, to enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit its employees, community, other stakeholders and environment. Dialog is headquartered near London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.42 billion in revenue and is consistently one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006)For more information, visit www.dialog-semiconductor.com. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Additional features: Picture: http://newsfeed2.eqs.com/dialog-semiconductor/1040467.html Subtitle: Making Wi-Fi Integration Childs Play * * *11.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1040467 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor's First Combo Wi-Fi and BLE Module Points the Way for a New Wave of IoT Connectivity. (news with additional features)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product Launch 11.05.2020 / 04:00 The issuer is solely responsible for the content of this announcement. Two-in-one module leverages the new DA16200 VirtualZero(TM) Wi-Fi technology with SmartBond(TM) TINY DA14531 Bluetooth for best-in-class battery life with ease of configurabilityLondon, United Kingdom - May 11, 2020 - Dialog Semiconductor plc (XETRA:DLG), a leading provider of battery management, AC/DC power conversion, Wi-Fi(R), Bluetooth(R) low energy and Industrial ICs, today announced the DA16600, a module that uniquely combines Dialog's market-leading Wi-Fi and BLE capabilities into a single solution. This two-in-one module is comprised of two groundbreaking SoCs, the newly announced DA16200 and the SmartBond(TM) TINY DA14531, to provide best-in-class, low-power Wi-Fi and BLE for customers and further broaden Dialog's IoT connectivity portfolio.The DA16200 SoC was purpose built for battery-powered IoT applications, including connected door locks, thermostats, security cameras and other devices that require an "always on" Wi-Fi connection, but may be only used sporadically. Its VirtualZero(TM) technology enables the industry's lowest level of power consumption for Wi-Fi connectivity, so that even continuously connected devices can achieve up to five years of battery life in many use cases. To give designers maximum flexibility at the lowest cost, the DA16600 module also leverages the capabilities of the SmartBond TINY DA14531, acknowledged as the world's smallest and lowest power Bluetooth SoC.This combo Wi-Fi and BLE module offers a reliable firmware solution with the combination of the two complex protocol stacks, eliminating issues often caused by the co-existence of two radios at 2.4 GHz in the same design. BLE provides ease of configurability for Wi-Fi in the application, greatly simplifying the task of Wi-Fi set up for the end user. Given its optimized design, all that is required to incorporate the module into an embedded IoT product is a simple set of guidelines provided by Dialog. Finally, the customer has the additional advantage of no longer having to source two independent SoCs for their application."We recognized that many of our customers could benefit from a more integrated two-in-one solution that could further reduce development time and costs for their IoT devices," said Sean McGrath, Senior Vice President, Connectivity and Audio Business Group, Dialog Semiconductor. "By combining our successful BLE solution with our brand new Wi-Fi VirtualZero technology into one easy-to-use and configured module, we are delivering the most value to our customers, giving them the best of both worlds with a single solution."The module is fully certified for worldwide operation, including certifications for FCC, IC, CE, Telec, Korea and SRRC. It is also Wi-Fi CERTIFIED(R) for interoperability.Evaluation boards and a complete software development kit (SDK) are available for the DA16600 module via DigiKey. The SDK includes sample applications, provisioning apps, AT command library, power management tools and more.For more information on this module, please visit: https://www.dialog-semiconductor.com/products/da16600-modules.ENDSNOTESDialog, the Dialog logo, SmartBond and SmartBond TINY and VirtualZero are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2020 Dialog Semiconductor. All rights reserved.Media Contact: Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845 8520 mark.tyndall@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) powering Internet of Things and Industry 4.0 applications. Dialog's solutions are integral to some of today's leading smartphones and facilitate increased performance and productivity on the go. From making smartphones more power efficient and shortening charging times, to enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit its employees, community, other stakeholders and environment. Dialog is headquartered near London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.42 billion in revenue and is consistently one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006)For more information, visit www.dialog-semiconductor.com. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Additional features: Picture: http://newsfeed2.eqs.com/dialog-semiconductor/1040469.html Subtitle: Best of Wi-Fi meets Best of BL * * *11.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1040469 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor reports results for the first quarter ended 27 March 2020. Q1 2020 revenue at the high-end of the guidance range at US$248 million, underlying gross margin at 50.4%, and strong balance sheet.

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Quarter Results 06.05.2020 / 07:30 The issuer is solely responsible for the content of this announcement. London, UK, 6 May 2020 - Dialog Semiconductor Plc (XETRA: DLG) today reports unaudited results for the first quarter ended 27 March 2020. IFRS basis (unaudited) Underlying basis1 (unaudited) US$ millions unless stated otherwise Q1 2020 Q1 2019 Q1 2020 Q1 2019 Change Revenue 248.5 294.9 248.5 294.9 -16% Gross margin 49.8% 49.3% 50.4% 49.6% +80bps Operating expenses2 114.8 124.9 95.2 103.7 -8% Operating profit 17.5 25.3 33.0 47.2 -30% Operating margin 7.0% 8.6% 13.3% 16.0% -270bps Diluted EPS $0.19 $0.23 $0.39 $0.49 -20% Free cash flow (59.0) 28.0 1 Underlying measures and free cash flow quoted in this Press Release are non-IFRS measures (see page 5).2 Comprising SG&A and R&D expenses.Q1 2020 Financial highlights\- Revenue of US$248 million at the high end of the guidance range and 16% below Q1 2019.\- Gross margin at 49.8% (Q1 2019: 49.3%) and underlying gross margin at 50.4% (Q1 2019: 49.6%) slightly ahead of the March guidance.\- Operating profit of US$17.5 million (Q1 2019: US$25.3 million) and underlying operating profit of US$33.0 million 30% below Q1 2019.\- Diluted EPS of US$0.19 (Q1 2019: US$0.23) and underlying diluted EPS of US$0.39 (Q1 2019: US$0.49).\- On 3 March 2020, the Company announced a second tranche of the 2019 Buyback Programme for an amount of €70 to €90 million.\- Q1 2020 cash outflow from operating activities of US$49.0 million (Q1 2019: cash inflow US$41.6 million) included US$50 million recoupment of the prepayment and higher income tax paid.\- At the end of Q1 2020, we held cash and cash equivalents of US$965 million (Q1 2019: US$690 million).\- On 20 February 2020, the Company announced it had signed a definitive agreement to acquire Adesto Technologies, broadening its presence in the Industrial IoT market.Q1 2020 Operational highlights\- Continued design-in momentum at our largest customer for the development and supply of a number of mixed-signal integrated circuits. Revenue from awarded high-volume contracts is expected to begin with new smartphones for the second half of 2021. In addition, we are progressing on a number of designs scheduled for 2022 production.\- Growing opportunity for next generation Battery Management systems in consumer IoT and mobile.\- Revenue excluding licensed main PMIC was up 34% year-on-year.\- As part of the Industrial IoT strategy, we launched the latest member of our IO-Link product family, the CCE4503.\- Q1 2020 revenue from AC/DC charging products was up 22% year-on-year, led by growth in rapid charge products.\- Increased our footprint in consumer IoT with our Bluetooth(R) low energy (BLE) products, which delivered 16% year-on-year revenue growth. Commenting on the results, Dialog Chief Executive, Dr Jalal Bagherli, said:" Revenue for the first quarter came at the high-end of the guidance range and we delivered record underlying gross margin. Products supporting mobile computing, consumer audio accessories, and wearables performed strongly." " Our fabless business model and strong balance sheet provide us with the operational and financial flexibility to successfully navigate the current economic environment. Over the course of the last few weeks, the health and safety of our employees and business partners has been our main priority. It has been encouraging to see the commitment and resilience of our employees, delivering excellent customer support and pushing ahead in an increasing number of development projects across high-growth areas. Due to the economic uncertainty, and in line with the rest of the industry, in the short term we are experiencing lower visibility into our outlook for the second half of the year."" The recently announced acquisition of Adesto, broadens and enhances our presence in the Industrial IoT market with a range of connectivity products highly-optimised for building and industrial automation. This builds on the acquisition of Creative Chips, supporting our growth strategy and accelerating the diversification of our business."OutlookIn Q2 2020, we anticipate revenue to be in the range of US$260 million to US$290 million and underlying gross margin to be broadly in line with Q1 2020.Although the situation of our supply chain and contract manufacturers is close to being fully operational, and the level of customer engagements continues as planned, the ongoing economic uncertainty caused by the COVID-19 pandemic is resulting in lower than usual visibility in our outlook for the second half of the year. Due to this, we have withdrawn the FY 2020 outlook communicated on 4 March 2020.Update on COVID-19Protecting the health and wellbeing of our employees and business partners remains our main priority. Over the last few weeks, our employees have worked remotely, in line with applicable national guidelines. We have maintained a minimal staff presence in our test labs, only where absolutely required, and adhering to recommended safe working practices. Our supply chain is close to being fully operational and our customers' contract manufacturers are operating at almost full capacity. Customer engagements are managed remotely and so far, we have not seen any significant decrease in our levels of activity.Our business remains resilient. Our fabless business model and the strength of our balance sheet provide us with financial resilience and operational flexibility to navigate the current circumstances. We continue to invest in the development of key business capabilities to build a more diverse mixed-signal business, focused in high-growth segments of our target end markets.Q1 2020 Financial overviewRevenue was 16% below Q1 2019 at US$248 million driven by the expected decline in licensed main Power Management ICs (PMICs), partially offset by growth in mixed-signal products with our largest customer, Bluetooth(R) low energy and AC/DC charging. Group revenue excluding licensed main PMICs was up 34% year-on-year. License revenue of US$9 million related to the Apple agreement was reported in Corporate.Gross margin was 49.8% and underlying gross margin was 50.4%, up year-on-year 50bps and 80bps respectively. This increase was mainly due to the positive contribution from license revenue (Q1 2019: nil), and continuing savings in manufacturing costs. Adjusting for the 80bps positive movement from non-recurring items in Q1 2019, underlying gross margin in Q1 2020 was up 160bps year-on-year.Operating expenses (OPEX), comprising SG&A and R&D expenses, and underlying OPEX in Q1 2020, were 8% below Q1 2019, representing 46.2% (Q1 2019: 42.3%) and 38.3% of revenue (Q1 2019: 35.2%) respectively. This decrease was mostly the result of lower R&D expenses, partially offset by the acquisitions of FCI and Creative Chips. In line with its long-term financial objectives, the Company has saving initiatives in place to reduce its cost base over time. Following the closing of Adesto in Q3 2020, the Company intends to execute the cost synergies plan. All these initiatives seek to protect profitability and strengthen cash flow generation.R&D expenses in Q1 2020 were 10% below Q1 2019 representing 29.1% of revenue (Q1 2019: 27.3%). Underlying R&D expenses were down 11% year-on-year representing 25.9% of revenue (Q1 2019: 24.5%). The decrease in R&D expenses was mainly due to the transfer of over 300 employees to Apple on 8 April 2019, partially offset by the acquisitions of FCI and Creative Chips.SG&A expenses in Q1 2020 were 4% below Q1 2019, representing 17.1% of revenue (Q1 2019: 15.0%). Underlying SG&A expenses in Q1 2020 were 2% below Q1 2019 representing 12.4% of revenue (Q1 2019: 10.6%). The decrease in SG&A expenses was mainly the result of cost savings partially offset by the acquisitions of FCI and Creative Chips.Other operating income in Q1 2020 was US$8.5 million (Q1 2019: US$4.7million), which comprised a US$5.3 million change in estimate of the contingent consideration payable for Creative Chips, and income from R&D contracts. Underlying other operating income in Q1 2020 was US$3.1 million, which comprised income from R&D contracts, was below Q1 2019 (Q1 2019: US$4.7 million).Operating profit in Q1 2020 was US$17.5 million, 31% below Q1 2019, mainly reflecting the lower revenue partially offset by higher gross margin together with lower operating expenses. For the same reasons, underlying operating profit was 30% below Q1 2019, at US$33.0 million.The effective tax rate in Q1 2020 was 30.4% (Q1 2019: 30.2%). Our high effective tax rates for Q1 2020 and Q1 2019 are principally due to the distorting effect on our income tax expense of the tax and accounting treatments of share-based compensation, business combinations and certain of our strategic investments. The underlying effective tax rate in Q1 2020 was 19.7%, down 80bps on the Q1 2019 underlying effective tax rate of 20.5%.Net income was 26% below Q1 2019 at US$13.6 million (Q1 2019: US$18.4 million). This decrease was mostly due to the decrease in operating profit.Underlying net income was 27% lower year-on-year. The year-on-year movement in underlying net income was mainly driven by the decrease in underlying operating profit.Diluted EPS in Q1 2020 was 17% below Q1 2019 at US$0.19 (Q1 2019: US$0.23). Underlying diluted EPS in Q1 2020 was 20% below year-on-year to US$0.39 (Q1 2019: US$0.49).At the end of Q1 2020, our total inventory level was US$129 million (or ~93 days), which is 5% above the previous quarter, representing a 35-day increase in our days of inventory from Q4 2019, mainly due to the lower revenue. During Q2 2020, we expect inventory value to be broadly in line with Q1 2020 and days of inventory to be lower than Q1 2020.On 12 March 2020, the Company announced details of the second tranche of the 2019 Buyback Programme. Under this tranche the Company committed to purchase shares for an amount between €70 million and €90 million, and a latest maturity date of 25 September 2020.At the end of Q1 2020, we held cash and cash equivalents of US$965 million (Q1 2019: US$690 million). Cash outflow from operating activities in Q1 2020 was US$49.0 million compared to a cash inflow in Q1 2019 of US$41.6 million. The year-on-year movement was due to the US$50 million recoupment of the prepayment, higher income tax paid, and working capital movements. In Q1 2020, the Group generated negative free cash flow of US$59.0 million, which was below Q1 2019 (Q1 2019: US$28.0 million) due to the cash outflow from operating activities.In support of our growth strategy and the diversification of our business, on 20 February 2020, the Company announced it had signed a definitive agreement to acquire Adesto Technologies Corporation (Adesto) for US$12.55 per share in cash, representing an enterprise value of approximately US$500 million, to be funded from our existing cash balances. Adesto accelerates Dialog's expansion into the growing Industrial IoT market that enables smart buildings and industrial automation (Industry 4.0), seamlessly driving cloud connectivity. Headquartered in Santa Clara, California, Adesto has approximately 270 employees and an established portfolio of industrial solutions for smart building automation that fully complements Dialog's manufacturing automation products.Q1 2020 Segmental overviewDialog is a fabless semiconductor company primarily focused on the development of highly integrated mixed-signal products for consumer electronics and other high-growth markets. Our highly skilled engineers, partnership approach, operational flexibility and the quality of our products are sources of competitive advantage. Our primary end markets are consumer markets such as the Internet of Things (IoT), Computing and Mobile. The increasing adoption of standard technologies, such as Bluetooth(R) low energy or LED lighting, and the expansion of high-performance processors into infotainment systems, has contributed to the expansion of our presence in the automotive segment. In line with our strategic goals, we intend to continue the expansion of our product portfolio through a combination of organic and inorganic initiatives. Our ambition is to build a vibrant mixed-signal business, with a balanced end market exposure, on innovative low power products which enable our customers to get fast to market.Underlying results by segment Revenue Operating profit/(loss) Operating margin US$ millions unless stated otherwise Q1 2020 Restated3 Q1 2019 Change Q1 2020 Restated3 Q1 2019 Q1 2020 Restated3 Q1 2019 Custom Mixed Signal 153.4 211.6 -28% 30.1 45.0 19.6% 21.2% Advanced Mixed Signal 51.5 50.9 +1% 0.1 1.0 0.1% 2.0% Connectivity & Audio 34.7 32.4 +7% (3.3) 5.0 (9.3)% 15.5% Total Segments 239.6 294.9 -19% 26.9 51.0 11.2% 17.3% Corporate and other unallocated items 8.9 - nm 6.1 (3.8) 68.4% nm Total Group 248.5 294.9 -16% 33.0 47.2 13.3% 16.0% 3 Restated to reflect the segment reorganisation and measurement changes that became effective at the beginning of Q2 2019.Custom Mixed Signal (CMS)In Q1 2020, revenue was US$153 million, 28% below Q1 2019 due to the expected decline in legacy licensed main PMICs partially offset by growth in new mixed-signal products. Revenue in CMS from our largest customer's products not covered by the licensing agreement was up 62% year-on-year to US$74 million (Q1 2019: US$46 million). Underlying operating profit for CMS decreased 33% year-on-year to US$30.1 million, mainly due to the lower revenue partially offset by lower operating expenses.During the quarter, we continued to receive requests for quotations from a multitude of customers, for new custom designs for 2022 and beyond in diverse areas of power, charging, display and audio technologies.There is a growing market opportunity for next generation Battery Management solutions, capable of supporting higher wattage chargers, safe and short charging times, as well as secondary charging from phones to other devices. Dialog is well positioned to capitalise on this opportunity, with a range of products built on our strong expertise in the design of mixed-signal and power-efficient ICs, meeting the requirements of a wide range of customers in mobile and consumer IoT end markets.In parallel, we continue to leverage our power management technology into new markets and geographies through the expansion of our platform reference designs. The collaborations with Renesas, Xilinx, and Telechips strengthen Dialog's presence in the automotive segment, in particular Intelligent In-Vehicle Infotainment and Advanced Driver-Assistance Systems. There are currently over 80 automotive customer engagements in place, most of which are expected to go into production over the next three years.As part of our Industrial IoT strategy, during the quarter we launched the CCE4503, the first IO-Link IC to be launched following the acquisition of Creative Chips in November 2019. This product complements the Company's well-established family of IO-Link Device and Master ICs, meeting our customers' demand for smaller, highly-optimised, and more cost-efficient IO-Link products that enable the next generation of Industry 4.0 devices.Advanced Mixed Signal (AMS)During Q1 2020, AMS revenue was 1% above Q1 2019 led by growth in AC/DC charging products offset by lower revenue of backlighting and the phasing of customer orders for CMICs. Earlier in the quarter, revenue from AMS was adversely impacted due to its exposure to Chinese smartphone OEMs. However, the situation has continued to improve as the restrictions imposed by the lockdown are gradually being lifted. During the quarter we continued to invest in the development of new products, resulting in lower underlying operating profit year-on-year.Dialog has successfully maintained a commanding market share in the rapid charge market through a combination of differentiated technology, speed of execution and wide support of rapid charge products, leading the industry in high power density AC/DC chargers.Our broad product portfolio, which includes LED backlighting and Solid-State Lighting (SSL) LED driver ICs, and proprietary digital control technology for power conversion, enable high quality solutions at a low cost. We are engaged with tier one customers in the high-end TV market and we are seeing a gradual expansion of our customer base in mobile and automotive display markets with medium term opportunities. Dialog's configurable technology, including the highly successful GreenPAK(TM) product family, has become established as the leading choice in the market. Low power consumption and in-system programming enables customers to rapidly customise and integrate multiple analog, logic, and discrete components into a single chip. During the last twelve months, we have expanded our product range with the launch of the first automotive grade CMIC, and the introduction of Dialog's industry-leading LDO regulator for smartphone cameras. With additional new products to be launched in Q2 2020, our expanded configurable product range will give our customers the flexibility to keep pace with rapidly changing market needs. The CMIC, along with other members of the GreenPAK(TM) family, replace dozens of components in a wide range of applications to optimize flexibility, footprint and a reduction of the bill of materials.Connectivity and Audio (C&A)During Q1 2020, revenue was 7% above Q1 2019 as a result of the strong performance of BLE and the revenue contribution from the acquisition of FCI, partially offset by a decline in the legacy audio DECT business. C&A generated a US$3.3 million operating loss in Q1 2020, which was below Q1 2019 operating profit (Q1 2019: US$5.0 million) mainly due to higher investment in the development of next generation technology for audio and BLE products, as well as the acquisition of FCI. The intensity of these investments are taking advantage of market opportunities and position the segment for higher revenue growth and profitability over the coming years.Revenue from our SmartBond(TM) BLE System-on-Chip (SoC) was 16% above Q1 2019, due to the ramp of new products from customers in Asia. Following the launch of SmartBond TINY(TM) in November 2019, during the quarter we launched the SmartBond TINY(TM) module, empowering customers to build the next generation of connected devices. The SmartBond TINY(TM) module was specifically optimized to significantly reduce the cost of adding Bluetooth(R) low energy functionality to an IoT system. Its easy-to-use design and software allow developers to quickly and intuitively develop highly functional connected devices, targeting the next generation of connected consumer, connected medical, smart home and smart appliance applications.The C&A Segment is targeting the rapidly-growing consumer wireless headset market with our SmartBeat(TM) wireless Audio IC. This technology enables a new immersive headset experience and supports both wired USB 3.0 Type-C(TM) and Bluetooth(R) based consumer headsets. Our product portfolio targeting the headset market also includes a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation (ANC), providing optimal audio performance in any environment.Non-IFRS measuresUnderlying measures of performance and free cash flow quoted in this press release are non-IFRS measures. Our use of underlying measures and reconciliations of the underlying measures to the nearest equivalent IFRS measures are presented in Section 3 of the Q1 2020 Interim report. For ease of reference, we present below reconciliations for the non-IFRS measures quoted in this press release:Q1 2020US$000 IFRS basis Share-based compensation and related expenses Accounting for business combinations Integration costs Strategic investments Underlying basis Revenue 248,481 - - - - 248,481 Gross profit 123,805 598 712 - - 125,115 SG&A expenses (42,411) 4,100 7,353 77 - (30,881) R&D expenses (72,345) 5,534 2,466 - - (64,345) Other operating income 8,467 - (5,347) - - 3,120 Operating profit 17,516 10,232 5,184 77 - 33,009 Net finance income 2,026 - 218 - (361) 1,883 Profit before income taxes 19,542 10,232 5,402 77 (361) 34,892 Income tax expense (5,943) 448 (1,442) (13) 69 (6,881) Net income 13,599 10,680 3,960 64 (292) 28,011 Q1 2019US$000 IFRS basis Share-based compensation and related expenses Accounting for business combinations Strategic investments Corporate transaction costs Underlying basis Revenue 294,886 - - - - 294,886 Gross profit 145,478 668 - - - 146,146 SG&A expenses (44,219) 5,179 4,616 - 3,048 (31,376) R&D expenses (80,633) 6,039 2,268 - - (72,326) Other operating income 4,715 - (8) - - 4,707 Operating profit 25,341 11,886 6,876 - 3,048 47,151 Net finance income 959 - 315 (268) - 1,006 Profit before income taxes 26,300 11,886 7,191 (268) 3,048 48,157 Income tax expense (7,942) (853) (782) 51 (352) (9,878) Net income 18,358 11,033 6,409 (217) 2,696 38,279 Accounting for business combinationsUS$000 Q1 2020 Q1 2019 Acquisition-related costs 2,419 983 Amortisation of acquired intangible assets 7,163 5,657 Consumption of the fair value uplift of acquired inventory 712 - Consideration accounted for as compensation expense 260 319 Forfeiture of deferred consideration (23) (83) Remeasurement of contingent consideration (5,347) - Increase in operating profit 5,184 6,876 Unwinding of discount on contingent consideration 218 315 Increase in profit before income taxes 5,402 7,191 Income tax credit (1,442) (782) Increase in net income 3,960 6,409 EBITDAUS$000 Q1 2020 Q1 2019 Net income 13,599 18,358 Net finance income (2,026) (959) Income tax expense 5,943 7,942 Depreciation expense 8,434 10,166 Amortisation expense 13,097 11,716 EBITDA 39,047 47,223 Share-based compensation and related expenses 10,232 11,886 Acquisition-related costs 2,419 983 Consumption of the fair value uplift of acquired inventory 712 - Consideration accounted for as compensation expense 260 319 Forfeiture of deferred consideration (23) (83) Remeasurement of contingent consideration (5,347) - Integration costs 77 - Corporate transaction costs - 3,048 Underlying EBITDA 47,377 63,376 Free cash flowUS$000 Q1 2020 Q1 2019 Cash flow from operating activities (49,030) 41,572 Purchase of property, plant and equipment (2,492) (4,961) Purchase of intangible assets (1,564) (1,124) Payments for capitalised development costs (3,887) (4,557) Capital element of lease payments (2,028) (2,922) Free cash flow (59,001) 28,008 ***Dialog Semiconductor invites you today at 09.30 am (London) / 10.30 am (Frankfurt) to take part in a live conference call and to listen to management's discussion of the Company's Q1 2020 performance, as well as guidance for Q2 2020. Participants will need to register using the link below. A full list of dial in numbers will also be available. To register for the webcast and receive dial in numbers, the conference PIN and a unique User ID please click on the link below:https://webcast.openbriefing.com/dialog-may20/In parallel to the call, the presentation will be available at:https://webcast.openbriefing.com/dialog-may20/The presentation will also be available under the investor relations section of the Company's website at:https://www.dialog-semiconductor.com/investor-relations/results-centerA replay will be posted on the Dialog website four hours after the conclusion of the presentation and will be available at:https://www.dialog-semiconductor.com/investor-relations/results-centerThe full release including the Company's unaudited consolidated financial statements for the quarter ended 27 March 2020 is available under the investor relations section of the Company's website at:https://www.dialog-semiconductor.com/investor-relations/results-centerDialog, the Dialog logo, SmartBond(TM), SmartBond TINY(TM), RapidCharge(TM), SmartBeat(TM), VirtualZero(TM) are registered trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names are the property of their respective owners. (c)Copyright 2020 Dialog Semiconductor Plc. All rights reserved.For further information please contact:Dialog SemiconductorJose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting LondonMatt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting FrankfurtAnja Meusel T: +49 (0)69 9203 7120 anja.meusel@fticonsulting.comAbout Dialog SemiconductorDialog Semiconductor provides highly integrated standard (ASSP) and custom (ASIC) mixed-signal integrated circuits (ICs), optimised for smartphone, tablet, IoT, LED Solid-State Lighting (SSL), and Smart Home applications. Dialog brings decades of experience to the rapid development of ICs while providing flexible and dynamic support, world-class innovation and the assurance of dealing with an established business partner. With world-class manufacturing partners, Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit employees, the community, other stakeholders and the environment we operate in. Dialog's power saving technologies including DC-DC configurable system power management deliver high efficiency and enhance the consumer's user experience by extending battery lifetime and enabling faster charging of their portable devices. Its technology portfolio also includes audio, Bluetooth(R) Low Energy, Rapid Charge(TM) AC/DC power conversion and multi-touch. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organisation. It currently has approximately 2,000 employees worldwide. In 2019, it had approximately US$ 1.42 billion in revenue. The company is listed on the Frankfurt (XETRA: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006).Forward Looking StatementsForward Looking Statements This press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: the global effects of the COVID-19 pandemic generally and on the semiconductor markets and supply chain specifically; an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Dialog Semiconductor PlcSection 1 Dialog Semiconductor Plc Interim report - Q1 2020 Financial review continued Press release - 6 May 2020 continuedDialog Semiconductor Plc Interim report - Q1 2020 Financial reviewSection 2 Dialog Semiconductor Plc Interim report - Q1 2020 Press release - 6 May 2020 continued Notes to the condensed consolidated financial statements continued Dialog Semiconductor Plc Interim report - Q1 2020Interim financial statementsSection 3 Dialog Semiconductor Plc Interim report - Q1 2020 Press release - 6 May 2020 continued Financial performance measures continued Dialog Semiconductor Plc Interim report - Q1 2020Financial performance measuresPress release - 6 May 2020 continued Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *06.05.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1036865 End of News DGAP News Service

  • EQS Group

    DIALOG SEMICONDUCTOR WITHDRAWS ITS OUTLOOK FOR THE FULL YEAR 2020

    Dialog Semiconductor Plc. / Key word(s): Miscellaneous DIALOG SEMICONDUCTOR WITHDRAWS ITS OUTLOOK FOR THE FULL YEAR 2020 01-May-2020 / 19:42 CET/CEST Disclosure of an inside information acc. to Article 17 MAR of the Regulation (EU) No 596/2014, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * *London, UK, 1 May 2020 \- Dialog Semiconductor Plc (XETRA: DLG) withdraws its outlook for the full year 2020 due to lack of visibility for the second half of the year.On 4 March 2020, Dialog indicated that for FY 2020, revenue excluding its licensed main PMICs was expected to grow in the approximately mid teens percentage range and total Group revenue was expected to be second half weighted with declining revenue from legacy licensed main PMICs. Additionally, the Company expected, total Group revenue for FY 2020 to decline from FY 2019 US$1,420 million in approximately the mid teens percentage point range, excluding any revenue from the announced acquisition of Adesto Technologies Corporation. Based on this revenue, in FY 2020 Dialog anticipated underlying1 gross margin to continue on a gradual upward trend. The March outlook assumed a return to normal for supply chain and contract manufacturers by Q2 2020.Although the situation of our supply chain and contract manufacturers is close to being fully operational, and the level of customer engagements continues as planned, the ongoing economic uncertainty caused by the COVID-19 pandemic is resulting in lower than usual visibility in our outlook for the second half of the year. Due to this, we are withdrawing the FY 2020 outlook communicated on 4 March 2020.Our fabless business model and the strength of our balance sheet provide us with financial resilience and operational flexibility to successfully navigate the current circumstances. We remain confident in our structural growth prospects as we build a more diverse mixed-signal business with a balanced market exposure, focused in high-growth segments of our target end markets.The Company will publish its results for the quarter ended 27 March 2020 on 6 May 2020.***1\. Underlying measures of performance quoted in this announcement are non-IFRS measures. Our use of underlying measures is explained on pages 183 to 189 of our 2019 Annual Report and Accounts. Reconciliations of the underlying measures to the nearest equivalent IFRS measures will be presented in our Q1 2020 Interim Report. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Information and Explanation of the Issuer to this News: For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.com FTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.com FTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.com About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment in which we operate. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.4 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006). For more information, visit www.dialog-semiconductor.com. Forward Looking Statements This press release contains 'forward-looking statements' that reflect management's current views with respect to future events. The words 'anticipate,' 'believe,' 'estimate', 'expect,' 'intend,' 'may,' 'plan,' 'project' and 'should' and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading 'Managing risk and uncertainty' in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. * * *01-May-2020 CET/CEST The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 1034919 End of Announcement DGAP News Service

  • EQS Group

    DGAP-DD: Dialog Semiconductor Plc. english

    Dialog Semiconductor Plc.: Notification and public disclosure of transactions by persons discharging managerial responsibilities and persons closely associated with them 16.03.2020 / 18:30 The issuer is solely responsible for the content of this announcement. 1\. Details of the person discharging managerial responsibilities / person closely associatedTitle: Mr First name: Davin Last name(s): Lee 2\. Reason for the notification a) Position / statusPosition: Member of the management team b) Initial notification 3\. Details of the issuer, emission allowance market participant, auction platform, auctioneer or auction monitor a) NameDialog Semiconductor Plc. b) LEI529900QA2LORU6646N15 4\. Details of the transaction(s) a) Description of the financial instrument, type of instrument, identification codeType: Share ISIN: GB0059822006 b) Nature of the transactionPurchase of shares c) Price(s) and volume(s)Price(s) Volume(s) 25.15 EUR 4,000 d) Aggregated informationPrice Aggregated volume 25.15 EUR 4,000 e) Date of the transaction2020-03-13 f) Place of the transactionName: XETRA MIC: XTRA * * *16.03.2020 The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Internet: www.dialog-semiconductor.com End of News DGAP News Service

  • EQS Group

    Announcement relating to the second tranche of shares to be bought back pursuant to Dialog Semiconductor Plc's share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Share Buyback 12.03.2020 / 08:00 The issuer is solely responsible for the content of this announcement. London, UK, March 12, 2020 \- Dialog Semiconductor Plc (the Company) refers to its ad-hoc announcement dated March 3, 2020 (Ad-hoc announcement in accordance with Article 17 of Regulation (EU) No 596/2014 of the European Parliament and the Council of 16 April 2014: Dialog Semiconductor announces commencement of the process for the second tranche of shares to be bought back pursuant to its share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019) (the Ad-Hoc Announcement)The Company today announces that HSBC Bank plc has been appointed the Preferred Broker (as defined in the Ad-Hoc Announcement) in relation to the second tranche of the Company's share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019 (the 2019 Buyback Programme). The material terms on which the Company will purchase ordinary shares from the Preferred Broker in relation to the second tranche of the 2019 Buyback Programme are as follows:\- the maximum total cost of the shares to be purchased by the Company from the Preferred Broker shall be €90.0 million;\- the minimum total cost of the shares to be purchased by the Company from the Preferred Broker shall be €70.0 million;\- the earliest date on which the Preferred Broker may purchase Certified Interests (CIs) in the Company on the Frankfurt Stock Exchange (the FSE) for the purpose of delivering ordinary shares in the Company to the Company shall be 23 March 2020;\- the latest date on which the Preferred Broker may purchase CIs on the FSE for the purpose of delivering ordinary shares in the Company to the Company shall be 24 September 2020;\- the minimum maturity date shall be 14 August 2020 and the maximum maturity date shall be 24 September 2020; and\- the price per share to be paid by the Company is equal to the average of the daily volume weighted average price (Average VWAP) paid for CIs on the FSE for each day during the period of the second tranche of the 2019 Buyback Programme (the Trading Period) less a percentage discount.During the Trading Period, the Preferred Broker may, acting independently as principal (without influence from the Company), purchase CIs in the Company on the FSE. HSBC Bank plc (and its affiliates) may also, at their discretion, undertake other transactions in the CIs (including sales and hedging activities) throughout the term of the second tranche of the 2019 Buyback Programme in order to hedge their exposure to the programme provided that any CIs to be purchased in relation to the programme shall be purchased:\- at a daily volume not to exceed 25% of the average daily volume traded on the FSE over the previous 20 trading days; and\- at a price not to exceed the higher of (i) 105% of the average middle market closing price of the CIs as derived from XETRA over the last 5 trading days; or (ii) the higher of the last independent trade or the highest current independent bid on the FSE.The Company has previously purchased 3,134,895 ordinary shares pursuant to the shareholder approvals granted at the Company's annual general meeting on 2 May 2019. Details of any ordinary shares purchased by the Company will be made available on the Company's website at https://www.dialog-semiconductor.com/investor-relations/financial-news/share-buybacks.For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.4 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German MDAX and TecDax indices. For more information, visit www.dialog-semiconductor.com.Forward Looking Statements This press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *12.03.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 995405 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Acquisition/Mergers & Acquisitions 20.02.2020 / 07:34 The issuer is solely responsible for the content of this announcement. Adds differentiated cloud-connected solutions driving Industry 4.0 adoptionDiversifies customer base adding industrial sales channel Expects to be EPS accretive in the first calendar year after closeAnnual cost synergies of approximately $20 million expected, in addition to considerable revenue synergiesLondon, United Kingdom & Santa Clara, Calif. - February 20, 2020 - Dialog Semiconductor plc (XETRA:DLG), a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth(R) low energy technology, and Adesto Technologies Corporation ("Adesto") (NASDAQ:IOTS), a leading provider of innovative custom integrated circuits (ICs) and embedded systems for the Industrial Internet of Things (IIoT) market, today announced they have signed a definitive agreement for Dialog to acquire all outstanding shares of Adesto.Adesto accelerates Dialog's expansion into the growing IIoT market that enables smart buildings and industrial automation (Industry 4.0), seamlessly driving cloud connectivity. Headquartered in Santa Clara, California, Adesto has approximately 270 employees and an established portfolio of industrial solutions for smart building automation that fully complements Dialog's manufacturing automation products. Adesto's solutions are sold across the industrial, consumer, medical, and communications markets."This acquisition substantially enhances our position in the Industrial IoT market," said Jalal Bagherli, CEO of Dialog. "Adesto's established strength in connectivity solutions and highly optimized products for building and industrial automation perfectly complements and adds scale to our Industrial IoT portfolio from the recently acquired Creative Chips. Adesto's deep customer relationships, comprehensive system expertise, and proprietary technology will deliver enhanced value for Dialog customers.""Together with Dialog, we are positioned to create unique Industrial IoT solutions through the integration of our best-in-class technologies for today's increasingly connected world," added Adesto's CEO, Narbeh Derhacobian. "We are extremely pleased to join Dialog to bring more value to our combined customer base."Benefits of Transaction Bringing Dialog and Adesto together creates a complementary product portfolio for servicing a broad customer base in growth segments of the industrial market and enables cross-selling.The combination:\- Scales Dialog's IIoT sector capabilities by combining industrial connectivity, smart metering and building automation solutions, and access to more than 5,000 customers, the majority of which are new for Dialog\- Complements Adesto's industrial wired connectivity portfolio with Dialog's wireless portfolio (BLE, Wi-Fi) for smart building and industrial applications. Cloud-connectivity adds further differentiation to Dialog's existing Industrial solutions\- Enables full system solutions for wearables, hearables, and other IoT applications by combining Adesto's low-power specialty memory products with Dialog's BLE & Wi-Fi connectivity and True Wireless Stereo (TWS) Audio ICs\- Unlocks future growth in the Automotive market by qualifying Adesto's specialty memory products by leveraging Dialog's established Automotive production and test flow. Additionally, these products address the emerging, fast-growing Artificial Intelligence (AI) segment\- Adds engineering and design scale to expand Dialog's existing custom IC business making Dialog one of the largest custom analog mixed-signal semiconductor providers Transaction Structure and TermsDialog will acquire Adesto for $12.55 per share in cash, or for approximately $500 million enterprise value. The deal will be funded from Dialog's balance sheet.The transaction is expected to be EPS accretive[1] for Dialog within the first calendar year following close. Dialog expects annual cost synergies of approximately $20 million within the first calendar year of close across the combined company. Dialog also anticipates considerable additional revenue synergies given the complementary nature of the product portfolios and technology. Adesto expects to report FY 2019 revenue of approximately $118 million and continued revenue growth is anticipated over the next few years.The transaction is subject to certain regulatory approvals and customary closing conditions and is expected to close in the third quarter of 2020.The Board of Directors of Adesto has unanimously approved the transaction and recommends that Adesto stockholders vote in favor of the transaction, and directors and executive officers of Adesto have agreed to vote their shares in favor of the transaction.Hogan Lovells is serving as Dialog's legal counsel, while BMO Capital Markets is serving as financial advisor. Fenwick & West LLP is serving as legal counsel for Adesto, with Cowen & Company, LLC serving as financial advisor. Conference Call Information:Dialog will host a conference call on Thursday, February 20 at 10:00 a.m. CET / 9:00 a.m. UK. A link to the webcast is available at https://webcast.openbriefing.com/dialog-feb2020/.Participants can pre-register at www.incommuk.com/customers/dialogsemiconductorcall to receive access details via email. Additionally, conference call information is below. Germany (Local): 0322 2109 8334 United Kingdom: 0800 640 6441 United Kingdom (Local): 020 3936 2999 United States: 1 855 979 6654 United States (Local): 1 646 664 1960 All other locations: +44 20 3936 2999 Access code: 863503 (Participants will be greeted by an operator who will register their details.)NOTESFor further information, please contact the following representatives.Dialog Investor Relations Contacts: Dialog Media Contact: Jose Cano Head of Investor Relations Dialog Semiconductor Phone: +44 (0)1793 756 961 jose.cano@diasemi.com UK - Matt Dixon FTI Consulting London Phone: +44 (0)2037 271 137 matt.dixon@fticonsulting.com Germany - Anja Meusel FTI Consulting Frankfurt Phone: +49 (0)69 9203 7120 anja.meusel@fticonsulting.com US - Antonia Gray FTI Consulting New York Phone: +1 (212) 850-5663 antonia.gray@fticonsulting.com Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845-8520 mark.tyndall@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi Adesto Investor Relations Contact: Adesto Media Contact: Joel W. Achramowicz Managing Director Shelton Group Phone: +1 (415) 845-9964 sheltonir@sheltongroup.com Jen Bernier-Santarini VP, Corporate Communications Adesto Technologies Phone: +1 (650) 336-4222 jen.bernier@adestotech.com About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that powers the Internet of Things and Industry 4.0 applications. Dialog solutions are integral to some of today's leading smartphones and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment it operates in. Dialog is headquartered near London with a global sales, R&D and marketing organization. In 2019, it had approximately $1.4 billion in revenue and is consistently one of the fastest growing European public semiconductor companies. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German MDAX and TecDax indices.For more information, visit www.dialog-semiconductor.com.About Adesto Technologies Corporation Adesto Technologies Corporation (NASDAQ:IOTS) is a leading provider of innovative application-specific semiconductors and embedded systems for the Industrial IoT. The company's technology is used by a broad industrial customer base worldwide. With its growing portfolio of high-value technologies, Adesto is helping its customers usher in the era of the Internet of Things.For more information, visit www.adestotech.com or follow Adesto on Twitter.Forward-Looking Statements This press release contains "forward-looking" statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties. In some cases, you can identify these forward-looking statements by the use of terms such as "expect," "will," "continue," or similar expressions, and variations or negatives of these words, but the absence of these words does not mean that a statement is not forward-looking. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including, but not limited to: any statements regarding the expected timing of the completion of the transaction and the benefits of the transaction; the ability of Dialog Semiconductor plc ("Dialog") and Adesto Technologies Corporation ("Adesto") to complete the proposed transaction considering the various conditions to the transaction, some of which are outside the parties' control, including those conditions related to regulatory approvals; any other statements of expectation or belief; and any statements of assumptions underlying any of the foregoing. These forward-looking statements are inherently uncertain, and are based on information available to each of Dialog and Adesto as of the date hereof and current expectations, forecasts, estimates, and assumptions. A number of important factors and uncertainties could cause actual results or events to differ materially from those described in these forward-looking statements, including without limitation: the failure to satisfy or waive any of the conditions to the consummation of the proposed transaction, including the adoption of the Merger Agreement by Adesto's stockholders and the receipt of certain governmental and regulatory approvals; matters arising in connection with the parties' efforts to comply with and satisfy applicable regulatory approvals and closing conditions relating to the proposed transaction; the risk that the proposed transaction does not close when anticipated or at all; the effects of disruption from the transactions contemplated by the Merger Agreement on Adesto's or Dialog's business and the fact that the announcement and pendency of the transaction may make it more difficult to establish or maintain relationships with employees, suppliers and other business partners; the occurrence of any event, change or other circumstance that could give rise to the termination of the Merger Agreement; the outcome of any legal proceedings that may be instituted against Adesto or Dialog related to the Merger Agreement or the proposed transaction; unexpected costs, charges or expenses resulting from the proposed transaction; the occurrence of a Material Adverse Effect (as defined in the Merger Agreement); and other risks that are described in the reports of Adesto filed with the Securities and Exchange Commission (the "SEC"), including but not limited to the risks described in Adesto's Annual Report on Form 10-K for its fiscal year ended December 31, 2018, which was filed with the SEC on March 18, 2019, and Adesto's Quarterly Reports on Form 10-Q, and that are otherwise described or updated from time to time in other filings with the SEC. All forward-looking statements attributable to Adesto or Dialog, or persons acting on behalf of either, are expressly qualified in their entirety by this cautionary statement. Further, Adesto and Dialog disclaim any obligation to update the information in this communication or to announce publicly the results of any revisions to any of the forward-looking statements to reflect future events or developments, except as otherwise required by law. Readers are cautioned not to place undue reliance on these forward-looking statements that speak only as of the date hereof.Additional Information and Where to Find It In connection with the proposed acquisition, Adesto will file relevant materials with the SEC, including a preliminary and definitive proxy statement. Promptly after filing the definitive proxy statement, Adesto will mail the definitive proxy statement and a proxy card to the stockholders of Adesto. ADESTO'S STOCKHOLDERS ARE URGED TO READ THE DEFINITIVE PROXY STATEMENT (INCLUDING ANY AMENDMENTS OR SUPPLEMENTS THERETO) CAREFULLY WHEN IT BECOMES AVAILABLE BEFORE MAKING ANY VOTING OR INVESTMENT DECISION WITH RESPECT TO THE PROPOSED TRANSACTION BECAUSE IT WILL CONTAIN IMPORTANT INFORMATION ABOUT THE PROPOSED TRANSACTION AND THE PARTIES TO THE PROPOSED TRANSACTION. Stockholders of Adesto will be able to obtain a free copy of these documents, when they become available, at the website maintained by the SEC at www.sec.gov or free of charge at www.adestotech.com.Additionally, Adesto and Dialog will file other relevant materials in connection with the proposed acquisition of Adesto by Dialog pursuant to the terms of the Merger Agreement. Adesto, Dialog and their respective directors, executive officers and other members of management and employees, under SEC rules, may be deemed to be participants in the solicitation of proxies of Adesto stockholders in connection with the proposed acquisition. Stockholders of Adesto may obtain more detailed information regarding the names, affiliations and interests of certain of Adesto's executive officers and directors in the solicitation by reading Adesto's most recent Annual Report on Form 10-K, and the proxy statement for Adesto's 2019 annual meeting of stockholders, which was filed with the SEC on April 30, 2019. These documents are available free of charge at the SEC's web site at www.sec.gov or by going to Adesto's Investor Relations Website at www.adestotech.com. Information about Dialog's directors and executive officers is set forth in Dialog's Annual Report and Accounts 2018. You can obtain free copies of this document by accessing Dialog's website at https://www.dialog-semiconductor.com. Information concerning the interests of Adesto's participants in the solicitation, which may, in some cases, be different than those of Adesto's stockholders generally, will be set forth in the definitive proxy statement relating to the proposed transaction when it becomes available.Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2020 Dialog Semiconductor. All rights reserved.Adesto and the Adesto logo are trademarks or registered trademarks of Adesto Technologies Corporation or its subsidiaries in the United States and other countries. Other company, product, and service names may be trademarks or service marks of others. [1] Financial performance measures are underlying Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *20.02.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 979607 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor to Acquire Adesto Technologies

    Dialog Semiconductor Plc. / Key word(s): Acquisition/Mergers & Acquisitions Dialog Semiconductor to Acquire Adesto Technologies 20-Feb-2020 / 07:33 CET/CEST Disclosure of an inside information acc. to Article 17 MAR of the Regulation (EU) No 596/2014, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * *London, United Kingdom - February 20, 2020 - Dialog Semiconductor plc (XETRA:DLG), today announced it has signed a definitive agreement to acquire all outstanding shares of Adesto Technologies Corporation ("Adesto") (NASDAQ:IOTS). Dialog will acquire Adesto for $12.55 per share in cash, or for approximately $500 million enterprise value. The deal will be funded from Dialog's balance sheet.The transaction is expected to be EPS accretive[1] for Dialog within the first calendar year following close. Dialog expects annual cost synergies of approximately $20 million within the first calendar year of close across the combined company. Dialog also anticipates considerable additional revenue synergies given the complementary nature of the product portfolios and technology. Adesto expects to report FY 2019 revenue of approximately $118 million and continued revenue growth is anticipated over the next few years.The transaction is subject to certain regulatory approvals and customary closing conditions, including the approval of Adesto's stockholders, and is expected to close in the third quarter of 2020.The Board of Directors of Adesto has unanimously approved the transaction and recommends that Adesto stockholders vote in favor of the transaction, and directors and executive officers of Adesto have agreed to vote their shares in favor of the transaction. [1] Financial performance measures are underlying Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *Information and Explanation of the Issuer to this News: Forward-Looking Statements This communication contains 'forward-looking' statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties. In some cases, you can identify these forward-looking statements by the use of terms such as 'expect,' 'will,' 'continue,' or similar expressions, and variations or negatives of these words, but the absence of these words does not mean that a statement is not forward-looking. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including, but not limited to: any statements regarding the expected timing of the completion of the transaction and the benefits of the transaction; the ability of Dialog and Adesto to complete the proposed transaction considering the various conditions to the transaction, some of which are outside the parties' control, including those conditions related to regulatory approvals; any other statements of expectation or belief; and any statements of assumptions underlying any of the foregoing. These forward-looking statements are inherently uncertain, and are based on information available to each of Dialog and Adesto as of the date hereof and current expectations, forecasts, estimates, and assumptions. A number of important factors and uncertainties could cause actual results or events to differ materially from those described in these forward-looking statements, including without limitation: the failure to satisfy or waive any of the conditions to the consummation of the proposed transaction, including the adoption of the Merger Agreement by Adesto's stockholders and the receipt of certain governmental and regulatory approvals; matters arising in connection with the parties' efforts to comply with and satisfy applicable regulatory approvals and closing conditions relating to the proposed transaction; the risk that the proposed transaction does not close when anticipated or at all; the effects of disruption from the transactions contemplated by the Merger Agreement on Adesto's or Dialog's business and the fact that the announcement and pendency of the transaction may make it more difficult to establish or maintain relationships with employees, suppliers and other business partners; the occurrence of any event, change or other circumstance that could give rise to the termination of the Merger Agreement; the outcome of any legal proceedings that may be instituted against Adesto or Dialog related to the Merger Agreement or the proposed transaction; unexpected costs, charges or expenses resulting from the proposed transaction; the occurrence of a Material Adverse Effect (as defined in the Merger Agreement); and other risks that are described in the reports of Adesto filed with the Securities and Exchange Commission (the 'SEC'), including but not limited to the risks described in Adesto's Annual Report on Form 10-K for its fiscal year ended December 31, 2018, which was filed with the SEC on March 18, 2019, and Adesto's Quarterly Reports on Form 10-Q, and that are otherwise described or updated from time to time in other filings with the SEC. All forward-looking statements attributable to Adesto or Dialog, or persons acting on behalf of either, are expressly qualified in their entirety by this cautionary statement. Further, Adesto and Dialog disclaim any obligation to update the information in this communication or to announce publicly the results of any revisions to any of the forward-looking statements to reflect future events or developments, except as otherwise required by law. Readers are cautioned not to place undue reliance on these forward-looking statements that speak only as of the date hereof. Additional Information and Where to Find It In connection with the proposed acquisition, Adesto will file relevant materials with the SEC, including a preliminary and definitive proxy statement. Promptly after filing the definitive proxy statement, Adesto will mail the definitive proxy statement and a proxy card to the stockholders of Adesto. ADESTO'S STOCKHOLDERS ARE URGED TO READ THE DEFINITIVE PROXY STATEMENT (INCLUDING ANY AMENDMENTS OR SUPPLEMENTS THERETO) CAREFULLY WHEN IT BECOMES AVAILABLE BEFORE MAKING ANY VOTING OR INVESTMENT DECISION WITH RESPECT TO THE PROPOSED TRANSACTION BECAUSE IT WILL CONTAIN IMPORTANT INFORMATION ABOUT THE PROPOSED TRANSACTION AND THE PARTIES TO THE PROPOSED TRANSACTION. Stockholders of Adesto will be able to obtain a free copy of these documents, when they become available, at the website maintained by the SEC at www.sec.gov or free of charge at www.adestotech.com. Additionally, Adesto and Dialog will file other relevant materials in connection with the proposed acquisition of Adesto by Dialog pursuant to the terms of the Merger Agreement. Adesto, Dialog and their respective directors, executive officers and other members of management and employees, under SEC rules, may be deemed to be participants in the solicitation of proxies of Adesto stockholders in connection with the proposed acquisition. Stockholders of Adesto may obtain more detailed information regarding the names, affiliations and interests of certain of Adesto's executive officers and directors in the solicitation by reading Adesto's most recent Annual Report on Form 10-K, and the proxy statement for Adesto's 2019 annual meeting of stockholders, which was filed with the SEC on April 30, 2019. These documents are available free of charge at the SEC's web site at www.sec.gov or by going to Adesto's Investor Relations Website at www.adestotech.com. Information about Dialog's directors and executive officers is set forth in Dialog's Annual Report and Accounts 2018. You can obtain free copies of this document by accessing Dialog's website at https://www.dialog-semiconductor.com. Information concerning the interests of Adesto's participants in the solicitation, which may, in some cases, be different than those of Adesto's stockholders generally, will be set forth in the definitive proxy statement relating to the proposed transaction when it becomes available. * * *20-Feb-2020 CET/CEST The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 977847 End of Announcement DGAP News Service

  • EQS Group

    Dialog Semiconductor Plc.: Fourth Quarter 2019 Earnings Call Invite. Wednesday 4th March 2020

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous 13.02.2020 / 21:21 The issuer is solely responsible for the content of this announcement. Dialog Semiconductor (XETRA: DLG), a provider of highly integrated power management, Configurable Mixed-signal IC, AC/DC power conversion, solid state lighting and Bluetooth(R) low energy technology, will announce its Fourth Quarter 2019 earnings on Wednesday 4th March 2020. Dr Jalal Bagherli (CEO) and Wissam Jabre (CFO) will host a conference call on the day of results.The call will be conducted in English and will commence at 09.30 (London) / 10.30 (Frankfurt).To register for the webcast and receive dial in numbers, the conference PIN and a unique User ID- please click on the link below.https://www.incommglobalevents.com/registration/client/2860/dialog-semiconductor-q4-earnings-call/In parallel to the call, the analyst presentation will be available at:https://webcast.openbriefing.com/dialogQ42019/ A replay will be posted on the Dialog website four hours after the conclusion of the presentation and will be available at https://www.dialog-semiconductor.com/investor-relations/results-centerIf you have any difficulties joining the call, please contact Charlotte Phillipson at charlotte.phillipson@fticonsulting.comWe hope you can join us and we look forward to welcoming you to the call on the day. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *13.02.2020 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 975489 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Plc.: Release according to Article 40, Section 1 of the WpHG [the German Securities Trading Act] with the objective of Europe-wide distribution

    Dialog Semiconductor Plc. 20.09.2019 / 19:15 Dissemination of a Voting Rights Announcement transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * * 1a. Identity of the issuer or the underlying issuer of existing shares to which voting rights are attached: DIALOG SEMICONDUCTOR PLC 1b. Please indicate if the issuer is a non-UK issuer (please mark with an 'X' if appropriate) Non-UK issuer 2\. Reason for the notification (please mark the appropriate box or boxes with an 'X') An acquisition or disposal of voting rights X An acquisition or disposal of financial instruments An event changing the breakdown of voting rights Other (please specify): 3\. Details of person subject to the notification obligation Name TSINGHUA UNIVERSITY City and country of registered office (if applicable) BEIJING, CHINA 4\. Full name of shareholder(s) (if different from 3.) Name UNIGROUP INTERNATIONAL CO., LTD. City and country of registered office (if applicable) BEIJING, CHINA 5\. Date on which the threshold was crossed or reached: 18/09/2019 6\. Date on which issuer notified (DD/MM/YYYY): 20/09/2019 7\. Total positions of person(s) subject to the notification obligation % of voting rights attached to shares (total of 8. A) % of voting rights through financial instruments (total of 8.B 1 + 8.B 2) Total of both in % (8.A + 8.B) Total number of voting rights of issuer Resulting situation on the date on which threshold was crossed or reached 7.91 NIL 7.91 72,440,287 Position of previous notification (if applicable) 8.93 NIL 8.93 8\. Notified details of the resulting situation on the date on which the threshold was crossed or reached A: Voting rights attached to shares Class/type of shares ISIN code (if possible) Number of voting rights % of voting rights Direct (Art 9 of Directive 2004/109/EC) (DTR5.1) Indirect (Art 10 of Directive 2004/109/EC) (DTR5.2.1) Direct (Art 9 of Directive 2004/109/EC) (DTR5.1) Indirect (Art 10 of Directive 2004/109/EC) (DTR5.2.1) GB0054822006 5,729,417 NONE 7.91 NIL SUBTOTAL 8. A B 1: Financial Instruments according to Art. 13(1)(a) of Directive 2004/109/EC (DTR5.3.1.1 (a)) Type of financial instrument Expiration date Exercise/ Conversion Period Number of voting rights that may be acquired if the instrument is exercised/converted. % of voting rights NONE SUBTOTAL 8. B 1 B 2: Financial Instruments with similar economic effect according to Art. 13(1)(b) of Directive 2004/109/EC (DTR5.3.1.1 (b)) Type of financial instrument Expiration date Exercise/ Conversion Period Physical or cash settlement Number of voting rights % of voting rights NONE SUBTOTAL 8.B.2 9\. Information in relation to the person subject to the notification obligation (please mark the applicable box with an 'X') Person subject to the notification obligation is not controlled by any natural person or legal entity and does not control any other undertaking(s) holding directly or indirectly an interest in the (underlying) issuer Full chain of controlled undertakings through which the voting rights and/or the financial instruments are effectively held starting with the ultimate controlling natural person or legal entity (please add additional rows as necessary) X Name % of voting rights if it equals or is higher than the notifiable threshold % of voting rights through financial instruments if it equals or is higher than the notifiable threshold Total of both if it equals or is higher than the notifiable threshold TSINGHUA UNIVERSITY - - - TSINGHUA HOLDINGS CO., LTD - - - TSINGHUA UNIGROUP CO., LTD - - - BEIJING UNIS CAPITAL MANAGEMENT CO., LTD - - - UNIS TECHNOLOGY STRATEGY INVESTMENT LIMITED 7.91 - 7.91 10\. In case of proxy voting, please identify: Name of the proxy holder N/A The number and % of voting rights held The date until which the voting rights will be held 11\. Additional information Place of completion LONDON Date of completion 20 September 2019 * * *20.09.2019 The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Internet: www.dialog-semiconductor.com End of News DGAP News Service

  • EQS Group

    DIALOG SEMICONDUCTOR Plc.: Release according to Article 41 of the WpHG [the German Securities Trading Act] with the objective of Europe-wide distribution

    Dialog Semiconductor Plc. / Total Voting Rights Announcement 19.09.2019 / 18:46 Total Voting Rights Announcement transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * *Publication of total number of voting rights 1\. Details of issuer Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom 2\. Type of capital measure Type of capital measure Date of status / date of effect Conditional capital increase (Sec. 41 para. 2 WpHG) X Other capital measure (Sec. 41 para. 1 WpHG) 19 Sep 2019 3\. New total number of voting rights: 71640287 * * *19.09.2019 The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Internet: www.dialog-semiconductor.com End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Plc.: Announcement related to the first interim settlement of the first tranche of shares pursuant to the share buyback programme authorised by shareholders at the annual general meeting on May 2, 2019 (the 2019 Buyback programme).

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Share Buyback 19.09.2019 / 18:36 The issuer is solely responsible for the content of this announcement. * * *London, UK, September 19, 2019 - Dialog Semiconductor Plc (XTRA:DLG) reports that, pursuant to the first tranche of the 2019 Buyback Programme announced by the Company on June 5, 2019, the Company has purchased the following ordinary shares in the Company from Goldman Sachs International:Date of purchase Number of ordinary shares purchased by the Company in the first settlement of the first tranche of the 2019 Buyback Programme Average price per share (EUR) in the first settlement of the first tranche of the 2019 Buyback Programme Total number of ordinary shares purchased by the Company in the first tranche of the 2019 Buyback Programme September 19, 2019 800,000 41.4033 800,000 Further information on the Company's share buyback programme is available on the Company's website at:http://www.dialog-semiconductor.com/investor-relations/financial-news/share-buybacksDialog and the Dialog logo are registered trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2019 Dialog Semiconductor All Rights ReservedFor further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German MDAX and TecDax indices. For more information, visit www.dialog-semiconductor.com. * * *19.09.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 876707 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor First to Market with Automotive Grade Configurable Mixed-Signal ICs. Unique GreenPAK(TM) customizable technology enhances design flexibility and scalability for driving the automotive future. (news with additional features)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Product Launch 07.08.2019 / 08:00 The issuer is solely responsible for the content of this announcement. * * *London, United Kingdom - August 07, 2019 - Dialog Semiconductor plc (XETRA:DLG), a provider of highly integrated power management, AC/DC power conversion, charging and Bluetooth(R) low energy technology, today announced its first-to-market Configurable Mixed-Signal IC (CMIC) for the automotive industry, the SLG46620-A.In today's advanced automotive market, manufacturers are required to implement the latest safety, comfort and self-driving features which demand an ever-growing number of Integrated Circuits (ICs). Current solutions aimed at supporting these functions are limited by discrete implementations and standard ICs, requiring a large bill of materials to support.The highly versatile SLG46620-A addresses these challenges by bringing Dialog's GreenPAK(TM) platform to the automotive space, providing lower project costs, an accelerated time to market and unified development flows. This CMIC, along with other members of the GreenPAK family, replace dozens of components in automotive applications to optimize flexibility, footprint and BOM reduction.Each automotive grade GreenPAK base die part can be programmed to implement multiple AEC-Q100 qualified ICs, with functionality including power sequencing, voltage monitoring, system reset, LED control, frequency detection, sensor interfacing and more. Every custom, factory-programmed IC is issued its own unique part number, top marking, automotive grade datasheet and Production Part Approval Process (PPAP). In production, the customer's unique GreenPAK configuration will be factory programmed and tested to ensure it meets its functional specification to automotive reliability levels.The CMICs give OEMs the ability to create flexible base platforms that are easily customized at no additional cost to the designer. The scalable nature of Dialog's automotive GreenPAK portfolio allows customers to choose the CMIC that best fits their needs and budget."Automotive electronics designers will benefit greatly from the flexibility and low latency that the SLG46620-A CMIC device offers," said Tom Sandoval, Senior Vice President Automotive Business Segment of Dialog Semiconductor. "Because GreenPAK products quickly and efficiently process asynchronous inputs, the SLG46620-A is ideal for implementing functional safety features. This is just the first device in a family of CMIC Automotive products that Dialog will deliver to this exciting, evolving market."For more information on the SLG46620-A, please visit SLG46620-A.ENDSNOTESDialog, GreenPAK and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2019 Dialog Semiconductor. All rights reserved.Media Contact: Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845 8520 mark.tyndalll@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment it operates in. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,100 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Additional features: Picture: http://newsfeed2.eqs.com/dialog-semiconductor/852343.html Subtitle: Automotive CMIC SLG46620 * * *07.08.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 852343 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor reports results for the second quarter ended 28 June 2019. Q2 2019 Revenue slightly above the high-end of the guidance range at US$482 million, earnings acceleration and strong cash flow generation.

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Quarter Results 30.07.2019 / 07:30 The issuer is solely responsible for the content of this announcement. * * *London, UK, 30 July 2019 - Dialog Semiconductor Plc (XETRA: DLG), a provider of highly integrated power management, Configurable Mixed-signal IC, AC/DC, solid state lighting and Bluetooth(R) low energy wireless technology, today reports unaudited results for the second quarter ended 28 June 2019.Q2 2019 Financial highlights\- Revenue of US$482 million including US$146 million one-off license revenue. Underlying1 revenue of US$336 million, slightly above the high end of the guidance range and 14% above Q2 2018.\- Gross margin at 64.7% (Q2 2018: 48.0%) and underlying1 gross margin at 49.7% (Q2 2018: 48.3%) in line with the May guidance.\- Operating profit of US$217.0 million, over eight times higher than in Q2 2018. Underlying1 operating profit of US$82.1 million, 95% above Q2 2018.\- All segments were profitable.\- Diluted EPS of US$2.20 (Q2 2018: US$0.23) and underlying1 diluted EPS of US$0.86 (Q2 2018: US$0.45).\- Q2 cash flow from operating activities of US$300.1 million (Q2 2018: US$55.6 million). US$290.3 million of free cash flow1 generated in Q2 2019 (Q2 2018: US$36.5 million). US$1,141 million of cash and cash equivalents at 28 June 2019, US$604 million above 29 June 2018.\- On 8 April 2019, the Company completed the transaction with Apple to license certain power management technologies and transfer certain assets and over 300 employees.\- On 31 May 2019, the Company completed the acquisition of Silicon Motion's mobile communications product line ("FCI") including Ultra-Low-Power Wi-Fi, extending its position in IoT connectivity.\- US$112 million returned to shareholders in Q2 2019 through the 2018 Buyback Programme.\- On 5 June 2019, the Company announced a new share buyback tranche under the 2019 Buyback Programme for an amount between EUR125 million and EUR150 million.\- On 22 July 2019, the Company announced an update to its reporting segments, reducing the number from four to three: Custom Mixed Signal, Advanced Mixed Signal and Connectivity & Audio.Q2 2019 Operational highlights\- Continued design win momentum at our largest customer for the development and supply of mixed-signal integrated circuits. Revenue from the new contracts is expected to be realized over the course of the next three years.\- Maintained a commanding market share in the smartphone rapid charge segment. Adoption of the USB Power Delivery ("USB PD Type-C") standard continues to accelerate in mobile devices. Q2 2019 revenue from our AC/DC charging products was up 52% sequentially, led by growth in rapid charge products.\- Launched the first Configurable Mixed-signal Integrated Circuit (CMIC) incorporating Dialog's differentiated IP, an industry-leading LDO regulator with the lowest noise performance, ideal to power advanced camera and sensor systems.\- Increasing our footprint in the IoT end market with our Bluetooth(R) low energy products, delivering 26% year-on-year revenue growth.\- As part of our IoT connectivity strategy Dialog launched its first Wi-Fi SoC targeted at battery-powered IoT devices enabling direct connectivity to Wi-Fi networks, while typically supporting a battery power lifetime greater than one year.\- Expanded our product portfolio with a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation ("ANC") to the rapidly-growing wireless headphones market.\- In support of Dialog's growth strategy, on 22 July 2019, the Company communicated an update to its organisational structure including the appointment of Alex McCann as Senior Vice President Global Operations.Commenting on the results, Dialog Chief Executive, Dr Jalal Bagherli, said:"This has been an excellent quarter, one where we have delivered revenue growth above the high-end of the guidance range, significantly improved operating profit and strong cash flow generation. Revenue from products in Custom Mixed Signal not covered by the agreement with Apple trebled year-on-year and we continued to increase our footprint in the IoT end-market as our Bluetooth low energy and new audio products delivered another quarter of strong year-on-year growth."We have a healthy customer design-in pipeline and a robust financial position which is allowing us to make targeted investments to expand our product portfolio and leverage our technology into new markets. These investments are helping to build a vibrant mixed-signal business with a more balanced exposure to fast growing end-markets and create value for shareholders."1 Underlying measures and free cash flow quoted in this Press Release are non-IFRS measures (see page 5).OutlookIn Q3 2019, we anticipate revenue to be in the range of US$360 million to US$400 million. Q3 2019 underlying1 gross margin is expected to be broadly in line with Q2 2019.As we enter the second half of the year, FY 2019 underlying1 revenue is now expected to decline from FY 2018 by mid-single digit percentage points and to be second half weighted. FY 2019 underlying1 gross margin is expected to be above that achieved in FY 2018.Financial overviewIFRS basis (unaudited)US$ millions unless otherwise stated Q2 2019 Q2 2018 Change H1 2019 H1 2018 Change Revenue 482.0 295.7 +63% 776.9 627.8 +24% Gross margin 64.7% 48.0% nm 58.9% 47.1% nm R&D % of revenue 15.7% 26.5% nm 20.1% 25.4% -530bps SG&A % of revenue 10.0% 13.0% -300bps 11.9% 12.5% -60bps Other operating income % of revenue 6.0% 0.3% +570bps 4.3% 0.2% +410bps Operating profit 217.0 26.2 +727% 242.3 59.1 +310% Operating margin 45.0% 8.9% nm 31.2% 9.4% nm Net income 170.1 18.1 nm 188.5 35.5 +431% Basic EPS $ 2.33 0.24 nm 2.56 0.48 +433% Diluted EPS $ 2.20 0.23 nm 2.42 0.46 +426% Cash flow from operating activities 300.1 55.6 +439% 341.7 105.3 +225% Underlying1 (unaudited)US$ millions unless otherwise stated Q2 2019 Q2 2018 Change H1 2019 H1 2018 Change Revenue 336.2 295.7 +14% 631.1 627.8 +1% Gross margin 49.7% 48.3% +140bps 49.6% 47.7% +190bps R&D % of revenue 20.1% 24.0% -390bps 22.2% 23.0% -80bps SG&A % of revenue 9.1% 10.2% -110bps 9.8% 9.8% 0bps EBITDA 99.0 56.7 +75% 162.3 123.2 +32% EBITDA margin 29.4% 19.2% nm 25.7% 19.6% +610bps Operating profit 82.1 42.1 +95% 129.3 94.5 +37% Operating margin 24.4% 14.2% nm 20.5% 15.1% +540bps Net income 66.7 35.3 +89% 105.0 76.2 +38% Basic EPS $ 0.91 0.48 +90% 1.43 1.03 +39% Diluted EPS $ 0.86 0.45 +91% 1.35 0.98 +38% 1 Underlying measures and free cash flow quoted in this Press Release are non-IFRS measures (see page 5).Revenue in Q2 2019 was 63% above Q2 2018 at US$482 million, including the license revenue relating to the Apple agreement: a one-off license revenue of US$146 million and US$6 million of ongoing license revenue. The license revenue related to the Apple agreement was reported in Corporate. Underlying1 revenue in Q2 2019 was 14% above Q2 2018 at US$336 million, including the ongoing license revenue. Custom Mixed Signal and Connectivity & Audio were the main drivers of the strong underlying1 revenue performance in the quarter. Custom Mixed Signal underlying1 revenue was US$219 million, up 13% over Q2 2018 due to higher volumes and content per device across multiple platforms, partially offset by the reduced share of volume from Apple for the main PMIC for the 2018 smartphone platform, as announced in May 2018. Underlying1 revenue in Custom Mixed Signal from products not covered by the licensing agreement with Apple trebled year-on-year to US$64 million (Q2 2018: US$21 million). In Q2 2019, Advanced Mixed Signal underlying1 revenue was 1% above Q2 2018. Revenue from AC/DC charging products was up 52% sequentially, led by growth in rapid charge, but below Q2 2018. This was offset by good growth of LED backlighting products. Connectivity & Audio underlying1 revenue was 25% above Q2 2018 as a result of the strong performance of Bluetooth(R) low energy and the new audio products.Q2 2019 gross margin was 64.7%, significantly above Q2 2018 due to the positive contribution from the license revenue as well as favourable product mix and lower manufacturing costs. Q2 2019 underlying1 gross margin was 49.7%, 140 basis points above Q2 2018, due to the positive contribution from the ongoing license revenue (Q2 2019: US$6 million; Q2 2018: nil) as well as favourable product mix and lower manufacturing costs.Operating expenses (OPEX) comprising SG&A and R&D expenses, in Q2 2019 were 6% above Q2 2018 at US$123.7 million, or 25.7% of revenue (Q2 2018: 39.5%). The increase in OPEX was mainly due to US$8 million of transaction related costs reported in SG&A and the first time consolidation of FCI into the group. Underlying1 OPEX in Q2 2019 was down 3% year-on-year to US$98.0 million, or 29.2% of revenue (Q2 2018: 34.2%). The year-on-year decrease in underlying1 OPEX was mostly due to lower R&D expenses partially offset by the first time consolidation of FCI into the group.R&D expenses in Q2 2019 were 3% below Q2 2018 at US$75.6 million (Q2 2018 US$78.3 million). The reduction in R&D expenses were mainly due to the transfer of over 300 employees to Apple on 8 April 2019. As a percentage of revenue, R&D in Q2 2019 was significantly below Q2 2018 at 15.7% (Q2 2018: 26.5%) due to the higher revenue and lower R&D expenses. On an underlying1 basis, R&D expenses were down 5% year-on-year to US$67.5 million (Q2 2018 US$71.0 million). This includes savings from the transfer of employees to Apple. As a percentage of revenue, underlying1 R&D in Q2 2019 was 390bps below Q2 2018 at 20.1% (Q2 2018: 24.0%), as a result of the higher revenue and the lower R&D expenses.SG&A expenses in Q2 2019 were up 26% from Q2 2018 to US$48.2 million (Q2 2018 US$38.4 million). This increase was mainly due to US$7.6 million of transaction costs relating to the licensing agreement with Apple and the acquisition of FCI. As a percentage of revenue, SG&A in Q2 2019 was 300bps below Q2 2018 at 10.0% (Q2 2018: 13.0%) due to the higher revenue. Underlying1 SG&A in Q2 2019 was 1% above Q2 2018 at US$30.5 million (Q2 2018: US$30.2 million) due to the first time consolidation of FCI into the group. As a percentage of revenue, underlying1 SG&A was 110bps below Q2 2018 at 9.1% (Q2 2018: 10.2%) due to the higher revenue.Other operating income in Q2 2019 was US$28.9 million (Q2 2018: US$1.0 million), comprised of a one-time US$16.0 million gain on the transfer of assets and US$12.5 million income from engineering contracts, both relating to the Apple license agreement. Underlying1 other operating income in Q2 2019 was US$13.0 million, materially above Q2 2018 (Q2 2018: US$0.5 million) due to the income from engineering contracts relating to the Apple license agreement.Operating profit in Q2 2019 was US$217.0 million, materially above Q2 2018, mainly reflecting the higher revenue and other operating income partially offset by transaction related costs. Operating profit margin in the quarter was 45.0%, also materially above Q2 2018, mainly due to the higher revenue and gross margin combined with higher other operating income. Underlying1 operating profit was US$82.1 million, 95% above Q2 2018 mainly due to the higher revenue and other operating income, as well as lower OPEX. Underlying1 operating margin in the quarter was 24.4%, 10.2 percentage points higher than Q2 2018 (Q2 2018: 14.2%).The effective tax rate in H1 2019 was 22.9% (H1 2018: 35.9%) and in Q2 2019 was 22.0% (Q2 2018: 34.5%). The relatively high effective tax rates for H1 2018 and Q2 2018 are principally due to the distorting effect on our income tax expense of the tax and accounting treatments of share-based compensation, business combinations and certain of our strategic investments. The underlying1 effective tax rate in Q2 2019 was 20.5%, down 50bps on the Q2 2018 underlying1 effective tax rate of 21.0%.In Q2 2019, net income was materially above Q2 2018 to US$170.1 million (Q2 2018: US$18.1 million). This increase was mostly due to the increase in operating profit. The higher interest income in the quarter of US$6.5 million (Q2 2018: US$2.3 million) reflects the higher average cash balance and higher US dollar interest rates. Interest expense of US$3.1 million was also higher than in Q2 2018 (Q2 2018: US$0.7 million) due to the interest on lease liabilities recognised under IFRS 16 and US$1.8 million interest expense recognised in relation to the US$300 million prepayment received from Apple. Other finance expense was US$2.4 million, compared to an income of US$0.3 million in Q2 2018. In Q2 2019, we recognised a net currency translation loss on monetary assets and liabilities of US$1.7 million. Underlying1 net income was up 89% year-on-year. The year-on-year increase in underlying1 net income was mainly driven by the underlying1 operating profit movement. Diluted EPS in Q2 2019 was materially up year-on-year to US$2.20 (Q2 2018: US$0.23). Underlying1 diluted EPS in Q2 2019 was up 91% year-on-year.At the end of Q2 2019, our total inventory level was US$156 million, broadly in line with the previous quarter (or ~83 days), representing a 11-day decrease in our days of inventory from Q1 2019. This includes approximately US$4 million of inventory from FCI. During Q3 2019, we expect inventory value to increase from Q2 2019 due to seasonality and days of inventory to be below Q2 2019.On 31 May 2019, the settlement of the 2018 Share Buyback Programme took place. The Company purchased 3,941,852 ordinary shares at an average price of EUR25.37 for a total amount of EUR100 million (US$112 million). On 5 June 2019, the Company announced a new tranche under the 2019 Share Buyback Programme for an amount between EUR125 million and EUR150 million and a latest maturity date of 5 December 2019.At the end of Q2 2019, we had a cash and cash equivalents balance of US$1,141 million. Cash flow from operating activities in Q2 2019 was US$300.1 million, over five times higher than in Q2 2018 (Q2 2018: US$55.6 million) mainly as a result of the closing of the Apple license agreement on 8 April 2019. Free cash flow in Q2 2019 was US$290.3 million, almost eight times higher than Q2 2018 (Q2 2018: US$36.5 million) mostly due to the higher cash flow from operating activities. Free cash flow margin (as a percentage of revenue) in Q2 2019 was above Q2 2018 at 60.2% (Q2 2018: 12.4%).On 8 April 2019, the Company completed the agreement with Apple receiving US$300 million in respect of the license arrangement and US$300 million prepayment in relation to future purchase of products.In support of our IoT connectivity strategy, on 31 May 2019, the Company completed the acquisition of Silicon Motion's mobile communications business ("FCI"). Dialog funded the US$45 million purchase price in an all-cash transaction from its balance sheet.1 Underlying measures and free cash flow quoted in this Press Release are non-IFRS measures (see page 5).Operational overviewDialog is a fabless semiconductor company primarily focused on the development of highly-integrated mixed-signal products for consumer electronics and other high-growth markets. Our highly-skilled engineers, partnership approach, operational flexibility and the quality of our products are sources of competitive advantage. Our primary end markets are consumer markets such as the Internet of Things (IoT) and Mobile. The increasing adoption of standard technologies, such as Bluetooth(R) low energy or LED lighting, and the expansion of high-performance processors into infotainment systems, has contributed to the expansion of our presence in the automotive segment. In line with our strategic goals, we intend to continue with the expansion of our product portfolio through a combination of organic and inorganic initiatives. Our ambition is to build a vibrant mixed-signal business, with a balanced end market exposure, built on innovative low power products which enable our customers to get to market fast.Custom Mixed Signal During Q2 2019, revenue from the Custom Mixed Signal business segment was 13% above Q2 2018. This was due to higher content per device and volumes across multiple platforms being partially offset by the reduced share of volume from Apple for the main PMIC for the 2018 smartphone platform announced on 31 May 2018. In Q2 2019, revenue from those products not covered by the Apple license agreement trebled year-on-year to US$64 million. We continue to receive a number of requests for quotes (RFQ) for new custom designs for 2021 and beyond in diverse areas of power, display and audio technologies.On 8 April 2019, the Company closed the transaction with Apple to license certain power management technologies and transfer certain assets to Apple. Additionally, more than 300 Dialog professionals became Apple employees. According to the agreement signed in October 2018, Dialog received $600 million in total, consisting of a payment from Apple of $300 million in cash for the transaction and a prepayment of $300 million for Dialog products to be delivered over the next three years. Dialog has also been awarded a broad range of new contracts from Apple for the development and supply of other mixed-signal integrated circuits. Revenue from the new contracts is expected to be realized over the course of the next three years.In parallel, we continue to leverage our power management technology into new markets and geographies through the expansion of our platform reference designs. The collaborations with Renesas and Xilinx strengthen Dialog's presence in the automotive segment. There are currently over 40 automotive customer engagements in place which are expected to go into production over the next three years.Advanced Mixed Signal During Q2 2019, Advanced Mixed Signal revenue was 1% above Q2 2018, mainly as a result of lower demand for charging products due to softness in the Chinese smartphone market. This was partially offset by the good performance of our LED backlighting products.We expect market adoption of new charging technologies, like USB PD Type-C, to continue during the next quarter. In Q2 2019, revenue from our AC/DC charging products grew 52% sequentially, led by growth in rapid charge. Dialog has successfully maintained a commanding market share in the rapid charge market through a combination of differentiated technology, speed of execution and wide support of rapid charge protocols. Our RapidCharge(TM) solutions for power adapters had approximately 60% share2 of the rapid charge adapter market for smartphones at the end of 2018.Our broad product portfolio, which includes LED backlighting and Solid-State Lighting (SSL) LED driver ICs, and proprietary digital control technology for power conversion, enable high quality solutions at a low cost. LED backlighting performed strongly during Q2 2019, contributing to the expansion of our customer base in the high-end TV market, as well as targeting the mobile and automotive display markets over the medium term. We have started our first engagement to develop a custom chip based on our LED backlight technology for an automotive tier 1 supplier as well complex LED drivers for notebook screens.With over 4.0 billion CMICs having been shipped since launch, Dialog's configurable technology, including the highly successful GreenPAK(TM) product family, has become established as the leading choice in the market. Low power consumption and in-system programming enables customers to rapidly customise and integrate multiple analog, logic and discrete components into a single chip. In Q2 2019, we launched a new CMIC device with industry-leading LDO regulator with the lowest noise performance, ideal to power advanced camera and sensor systems. This new device is part of our strategic objective of bringing Dialog's low power IP into the CMIC, increasing its use cases and the value it brings to our customers. This product was sampled to major customers, and already has seven mobile phone sockets secured in Japan, Taiwan and the United States. We are looking to release to the broader market and customers in Q3 and expect further design-ins at high end DSLR Cameras as well as smartphones to follow in second half 2019. This technology will contribute to the expansion of our customer base and strengthen our presence in IoT, mobile computing and automotive.Connectivity and Audio During Q2 2019, the Connectivity & Audio segment was 25% above Q2 2018 due to strong performance of Bluetooth(R) low energy and the new audio products.Revenue from our SmartBond(TM) System-on-Chip (SoC) was 26% above Q2 2018, due to the ramp of new products from customers in Korea and China. The DA1469x family, the latest addition to Dialog's SmartBond line, was adopted by Samsung's Galaxy Fit fitness tracker. Our most advanced SmartBond product enables the Galaxy Fit seamless smartphone connectivity while conserving energy to extend battery life. The Bluetooth(R) low energy market is estimated to grow at 19% CAGR over the 2018-2022 period3, a reflection of the continuing adoption of the technology across a wide range of applications. Our strategy remains focused on targeted verticals, like wearables, proximity tags, smart home, gaming accessories and connected health. Building on our success in fitness trackers, we are extending our market presence into new areas such as new digital watch designs in China incorporating our Bluetooth low energy solutions.In support of our IoT connectivity strategy and following the closing of the acquisition of FCI we launched the first low-power Wi-Fi device in our new VirtualZero(TM) product line. The FC9000 complements our existing portfolio of leading Bluetooth low energy SoC's for connected devices and is the first in a series solving major pain points for both manufacturers and end-users around IoT network compatibility and power consumption. Venstar, a leading energy management system supplier and one of the largest global thermostat suppliers, is utilizing the FC9000 enabling its customers reliable Wi-Fi sensors and over a year of battery life.New audio technology performed strongly during Q2 2019, delivering more than twice as much revenue as in Q2 2018. The Connectivity Segment is targeting the consumer headset market with our SmartBeat(TM) wireless Audio IC. This technology enables a new immersive headset experience and supports both wired USB 3.0 Type-C(TM) and Bluetooth(R) based consumer headsets. In Q2 2019, we announced the DA740x, a family of highly-integrated audio codec chips that deliver best-in-class active noise cancellation ("ANC"), providing optimal audio performance in any environment to the rapidly-growing wireless headphones market.2 Source: Company estimates. 3 Source: IHS Technology Q4 2018 Tracker and Company estimates.Non-IFRS measuresUnderlying measures of performance and free cash flow quoted in this press release are non-IFRS measures. Our use of underlying measures and reconciliations of the underlying measures to the nearest equivalent IFRS measures are presented in Section 3 of the Q2 2019 Interim report. For ease of reference, we present below reconciliations for the non-IFRS measures quoted in this press release:Q2 2019US$000 IFRS basis Licence and asset transfers to Apple Share-based compensation and related payroll taxes Accounting for business combinations Integration costs Corporate transaction costs Strategic investments Underlying basis Revenue 481,968 (145,750) - - - - - 336,218 Gross profit 311,758 (145,750) 672 403 - - - 167,083 SG&A expenses (48,176) - 5,253 4,711 111 7,611 - (30,490) R&D expenses (75,556) - 5,576 2,460 - - - (67,520) Other operating income 28,936 (15,898) - - - - - 13,038 Operating profit 216,962 (161,648) 11,501 7,574 111 7,611 - 82,111 Net finance income 1,076 - - - - - 634 1,710 Profit before income taxes 218,038 (161,648) 11,501 7,574 111 7,611 634 83,821 Income tax expense (47,934) 33,907 (2,171) (894) (29) 96 (121) (17,146) Net income 170,104 (127,741) 9,330 6,680 82 7,707 513 66,675 Q2 2018US$000 IFRS basis Share-based compensation and related payroll taxes Accounting for business combinations Integration costs Corporate transaction costs Effective interest Strategic investments Underlying basis Revenue 295,664 - - - - - - 295,664 Gross profit 141,856 506 406 - - - - 142,768 SG&A expenses (38,378) 3,284 3,682 474 773 - - (30,165) R&D expenses (78,273) 4,956 2,288 - - - - (71,029) Other operating income 1,022 - (522) - - - - 500 Operating profit 26,227 8,746 5,854 474 773 - - 42,074 Net finance income 1,897 - 460 - - 17 720 3,094 Profit before income taxes 28,124 8,746 6,314 474 773 17 720 45,168 Income tax expense (9,691) 1,197 (784) (100) (83) (3) (27) (9,491) Profit after income taxes 18,433 9,943 5,530 374 690 14 693 35,677 Share of loss of associate (377) - - - - - - (377) Net income 18,056 9,943 5,530 374 690 14 693 35,300 H1 2019US$000 IFRS basis Licence and asset transfers to Apple Share-based compensation and related payroll taxes Accounting for business combinations Integration costs Corporate transaction costs Strategic investments Underlying basis Revenue 776,854 (145,750) - - - - - 631,104 Gross profit 457,236 (145,750) 1,340 403 - - - 313,229 SG&A expenses (92,395) - 10,432 9,234 196 10,659 - (61,874) R&D expenses (156,189) - 11,615 4,728 - - - (139,846) Other operating income 33,651 (15,898) - - - - - 17,753 Operating profit 242,303 (161,648) 23,387 14,365 196 10,659 - 129,262 Net finance income 2,035 - - 315 - - 366 2,716 Profit before income taxes 244,338 (161,648) 23,387 14,680 196 10,659 366 131,978 Income tax expense (55,876) 33,907 (3,024) (1,668) (37) (256) (70) (27,024) Net income 188,462 (127,741) 20,363 13,012 159 10,403 296 104,954 H1 2018US$000 IFRS basis Share-based compensation and related payroll taxes Accounting for business combinations Integration costs Corporate transaction costs Effective interest Strategic investments Underlying basis Revenue 627,819 - - - - - - 627,819 Gross profit 295,624 1,148 2,794 13 - - - 299,579 SG&A expenses (78,493) 7,922 7,353 922 773 - - (61,523) R&D expenses (159,178) 10,024 4,601 228 - - - (144,325) Other operating income 1,157 - (364) - - - - 793 Operating profit 59,110 19,094 14,384 1,163 773 - - 94,524 Net finance (expense)/income (2,541) - 1,171 - - 50 4,256 2,936 Profit before income taxes 56,569 19,094 15,555 1,163 773 50 4,256 97,460 Income tax expense (20,328) 1,958 (1,986) (245) (83) (9) 206 (20,487) Profit after income taxes 36,241 21,052 13,569 918 690 41 4,462 76,973 Share of loss of associate (749) - - - - - - (749) Net income 35,492 21,052 13,569 918 690 41 4,462 76,224 Accounting for business combinationsUS$000 Q2 2019 Q2 2018 H1 2019 H1 2018 Acquisition-related costs 777 - 1,675 - Amortisation of acquired intangible assets 6,103 5,657 11,760 11,314 Consumption of the fair value uplift of acquired inventory 403 406 403 2,794 Consideration accounted for as compensation expense 305 350 625 804 Forfeiture of deferred consideration (14) (36) (98) (163) Remeasurement of contingent consideration - (523) - (365) Increase in operating profit 7,574 5,854 14,365 14,384 Unwinding of discount on contingent consideration - 460 315 1,171 Increase in profit before income taxes 7,574 6,314 14,680 15,555 Income tax credit (894) (784) (1,668) (1,986) Increase in net income 6,680 5,530 13,012 13,569 EBITDAUS$000 Q2 2019 Q2 2018 H1 2019 H1 2018 Net income 170,104 18,056 188,462 35,492 Net finance (income)/expense (1,076) (1,897) (2,035) 2,541 Income tax expense 47,934 9,691 55,876 20,328 Depreciation expense 10,317 8,043 20,483 15,936 Amortisation expense 12,637 12,239 24,353 24,025 EBITDA 239,916 46,132 287,139 98,322 Licence and asset transfers to Apple (161,648) - (161,648) - Share-based compensation and related payroll taxes 11,501 8,746 23,387 19,094 Acquisition-related costs 777 - 1,675 - Consumption of the fair value uplift of acquired inventory 403 406 403 2,794 Consideration accounted for as compensation expense 305 350 625 804 Forfeiture of deferred consideration (14) (36) (98) (163) Remeasurement of contingent consideration - (523) - (365) Corporate transaction costs 7,611 773 10,659 773 Integration costs 111 474 196 1,163 Share of loss of associate - 377 - 749 Underlying EBITDA 98,962 56,699 162,338 123,171 Free cash flowUS$000 Q2 2019 Q2 2018 H1 2019 H1 2018 Cash flow from operating activities 300,129 55,638 341,701 105,287 Purchase of property, plant and equipment (2,024) (7,729) (6,985) (16,783) Purchase of intangible assets (1,063) (1,462) (2,187) (3,238) Payments for capitalised development costs (4,014) (9,100) (8,571) (15,219) Capital element of lease payments (2,759) (832) (5,681) (1,650) Free cash flow 290,269 36,515 318,277 68,397 On 22 July the Company published an update on organisational structure and segment information. On Table 1, the revenue figures for the year ended 31 December 2017 for Advanced Mixed Signal and Connectivity & Audio were incorrectly placed. Advanced Mixed Signal should have shown (in US$000) US$147,603 and Connectivity & Audio US$137,834.***Dialog Semiconductor invites you today at 09.30 am (London) / 10.30 am (Frankfurt) to take part in a live conference call and to listen to management's discussion of the Company's Q2 2019 performance, as well as guidance for Q3 2019. Participants will need to register using the link below. A full list of dial in numbers will also be available. To register for the webcast and receive dial in numbers, the conference PIN and a unique User ID please click on the link below:https://www.incommglobalevents.com/registration/client/1937/dialog-semiconductor-q2-results-2019/In parallel to the call, the presentation will be available at:http://webcast.openbriefing.com/dialogQ2-2019/The presentation will also be available under the investor relations section of the Company's website at:https://www.dialog-semiconductor.com/investor-relations/results-centerA replay will be posted on the Dialog website four hours after the conclusion of the presentation and will be available at:https://www.dialog-semiconductor.com/investor-relations/results-centerThe full release including the Company's condensed consolidated income statement, consolidated balance sheet, consolidated statements of cash flows and financial notes for the quarter ended 28 June 2019 is available under the investor relations section of the Company's website at:https://www.dialog-semiconductor.com/investor-relations/results-centerDialog, the Dialog logo, SmartBond(TM), RapidCharge(TM), SmartBeat(TM), VirtualZero(TM) are registered trademarks of Dialog Semiconductor Plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2019 Dialog Semiconductor Plc. All rights reserved.For further information please contact:Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0)69 9203 7120 anja.meusel@fticonsulting.comNote to editorsDialog Semiconductor provides highly integrated standard (ASSP) and custom (ASIC) mixed-signal integrated circuits (ICs), optimised for smartphone, tablet, IoT, LED Solid-State Lighting (SSL), and Smart Home applications. Dialog brings decades of experience to the rapid development of ICs while providing flexible and dynamic support, world-class innovation and the assurance of dealing with an established business partner. With world-class manufacturing partners, Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in.Dialog's power saving technologies including DC-DC configurable system power management deliver high efficiency and enhance the consumer's user experience by extending battery lifetime and enabling faster charging of their portable devices. Its technology portfolio also includes audio, Bluetooth(R) Low Energy, Rapid Charge(TM) AC/DC power conversion and multi-touch.Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organisation. It currently has approximately 2,000 employees worldwide. In 2018, it had approximately US$ 1.44 billion in revenue. The company is listed on the Frankfurt (XETRA: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax and MDAX indices.Forward Looking StatementsThis press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *30.07.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 848429 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor Adds Bluetooth(R) Low Energy Connectivity to Samsung Galaxy Fit. The new Samsung Galaxy Fit is among the first wearable devices on the market featuring Dialog's DA14697 for seamless connectivity and enhanced battery life. (news with additional features)

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous 24.07.2019 / 08:00 The issuer is solely responsible for the content of this announcement. * * *London, United Kingdom - July 24, 2019 - Dialog Semiconductor plc (XETRA:DLG), a provider of highly integrated power management, AC/DC power conversion, charging and Bluetooth(R) low energy technology, today announced that Samsung has implemented Dialog's wireless microcontroller unit (MCU) in its latest Galaxy Fit.The Galaxy Fit is a slim and fashionable fitness tracker that enables users to reach their fitness goals with its intuitive tracking features. It tracks a wide range of activities and offers enhanced sleep analysis and stress management technology for users to monitor their wellbeing throughout the day.Samsung designed the Galaxy Fit band to be easy for users to interact with while on the go, which meant it needed to sync with smartphones to allow users to receive alerts and messages. Additionally, because the device is easy to style and comfortable to wear all week long, it also required a solution that would support seamless smartphone connectivity while conserving energy to extend battery life. Samsung found its solution with the DA14697, a wireless microcontroller unit within Dialog's DA1469x SmartBond(TM) line that is ideal for wearable devices."Samsung's elegantly designed Galaxy Fit epitomizes the features consumers are looking for in next generation fitness trackers," said Sean McGrath, Senior Vice President and General Manager of Dialog Semiconductor's Connectivity and Audio Business Group. "Our collaboration with Samsung not only builds on Dialog's leadership position in wearable technology, but it serves as a strong example of connected living enabled by low power Bluetooth connectivity with best-in-class power consumption features."The DA1469x family, the latest addition to Dialog's SmartBond line, is the most advanced, feature-rich range of MCUs for wireless connectivity. It offers developers greater processing power, resources, range and battery life for a wide variety of connected consumer applications, including high-end fitness trackers and other wearable devices.The family is also the first set of Bluetooth wireless microcontroller SoC's in production with a dedicated application processor based on the ARM Cortex-M33 processor. To conserve power, the devices are equipped with a Sensor Node Controller (SNC) that runs autonomously and wakes the application processor only when needed, and a state-of-the-art Power Management Unit (PMU) activates the different processing cores as required.For more information on the DA1469x product family, click here.ENDSNOTESDialog, the Dialog logo and Smartbond are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2019 Dialog Semiconductor. All rights reserved.Media Contact: Mark Tyndall SVP Corporate Development & Strategy Dialog Semiconductor Phone: +1 (408) 845 8520 mark.tyndalll@diasemi.com Web: www.dialog-semiconductor.com Twitter: @DialogSemi About Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment it operates in. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax.For more information, visit www.dialog-semiconductor.com. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961* * *Additional features: Picture: http://newsfeed2.eqs.com/dialog-semiconductor/845593.html Subtitle: DA14697_DIalog_Samsung Fit * * *24.07.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 845593 End of News DGAP News Service

  • EQS Group

    DIALOG SEMICONDUCTOR ANNOUNCES APPOINTMENT OF JOANNE CURIN TO BOARD OF DIRECTORS

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous 22.07.2019 / 18:40 The issuer is solely responsible for the content of this announcement. * * *London, United Kingdom - July 22, 2019 - Dialog Semiconductor plc (XETRA:DLG), today announced the appointment of Joanne Curin to the company's Board of Directors and the Audit Committee, effective August 1, 2019. Currently a founding Director and the Chief Financial Officer of Stirling Industries plc, Ms. Curin comes to Dialog with over 20 years of experience as a CFO and non-executive director, with a deep background in finance and an international career spanning global large-scale public companies listed in the UK and Australia."Joanne's wealth of international experience will perfectly complement the existing rich mix of financial and operational skills and perspectives on our Board," said Rich Beyer, Chairman of the Board, Dialog Semiconductor. "Her particular background on capital markets, M&A and finance as a CFO and non-executive director will be especially valuable to Dialog."Ms. Curin has achieved many successes as CFO across a wide array of markets, including the oil, manufacturing, healthcare, shipping and logistics and real estate industries. In these roles, Ms. Curin has been highly effective at initiating and leading strategic, operational and process changes that have delivered considerable shareholder value, and has successfully led a number of complex multi-billion dollar M&A transactions.Ms. Curin has a bachelor's degree in commerce from the University of Auckland and is a member of the Institute of Chartered Accountants in New Zealand.ENDS NOTES Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. (c) Copyright 2019 Dialog Semiconductor. All rights reserved.For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.com FTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.com FTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment it operates in. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue and was one of the fastest growing European public semiconductor companies. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDax.For more information, visit www.dialog-semiconductor.com. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *22.07.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 844877 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor - Update on organisational structure and segment information

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous 22.07.2019 / 18:40 The issuer is solely responsible for the content of this announcement. * * *London, UK, July 22, 2019 - Dialog Semiconductor Plc (XETRA: DLG), a provider of highly integrated power management, Configurable Mixed-signal IC, AC/DC, solid state lighting and Bluetooth(R) low energy wireless technology, today updates on its organisational structure and segment information in support of its long-term growth strategy.The Group's organisational structure has been updated to support our growth strategy and the transformation of our business over the coming years. These changes align with our focused R&D approach and pursuit of business opportunities in high-growth segments of our target end-markets - IoT, Mobile, Automotive and Computing & Storage. Our entrepreneurial culture and deep expertise in power efficient mixed-signal ICs, expanding customer base, and disciplined capital allocation will help us drive the next phase of growth and create value for shareholders.Organisational changesWe have reduced the number of reporting segments from four to three: Custom Mixed Signal (CMS), Advanced Mixed Signal (AMS) and Connectivity & Audio (C&A); previously Mobile Systems, Advanced Mixed Signal, Connectivity and Automotive & Industrial. The following table summarises the segment changes:Previous Reporting Segments Changes (+/-) New Reporting Segments Mobile Systems \+ Custom Automotive Motor Control ICs \- ASSP PMICs/Charging \- Audio Custom Mixed Signal (CMS) Advanced Mixed Signal \+ ASSP PMICs/Charging \+ Industrial Lighting Advanced Mixed Signal (AMS) Connectivity \+ Audio Connectivity and Audio (C&A) Automotive and Industrial \- Custom Automotive Motor Control ICs \- Industrial Lighting \---- In support of our growth strategy and the transformation of our business over the coming years, Dialog has made the following changes to its Management Team:\- Vivek Bhan, previously SVP, Engineering has been appointed Senior Vice President (SVP) and General Manager, Custom Mixed Signal business group taking over from Udo Kratz who retired at the end of April 2019;\- Tom Sandoval, previously SVP, Worldwide Sales has been appointed SVP Automotive and will coordinate the Group's effort into the automotive end-market; and\- John Teegen, previously VP, Configurable Mixed Signal business unit, has been appointed SVP, Worldwide Sales.Additionally, Alex McCann joined the Group in May 2019 as SVP, Global Operations, bringing over twenty years of semiconductor global operations experience to his new role. Most recently, Alex was VP, LTC Operations and Integration Chair at Analog Devices Inc (which acquired Linear Technology Corporation (LTC) where Alex was Chief Operating Officer). Alex took over from Mohamed Djadoudi who retired at the end of June 2019. Davin Lee and Sean McGrath remain in their current roles as SVP and General Manager, Advanced Mixed Signal and SVP and General Manager, Connectivity & Audio, respectively.Change in basis of segment informationAt the same time as we made the organisational changes, the Management Team changed its focus from IFRS measures to underlying measures as the principal basis for allocating resources to and assessing the financial performance of the Group's businesses. Underlying revenue is therefore the measure of segment revenue and underlying operating profit/loss the measure of segment profit/loss that is now presented in the Group's segment disclosures.Underlying revenue and underlying operating profit/loss are non-IFRS measures. Our use of non-IFRS measures is explained on pages 156 to 161 of our 2018 Annual Report and Accounts. We do not regard non-IFRS measures as a substitute for, or superior to, the equivalent IFRS measures. Non-IFRS measures presented by Dialog may not be directly comparable with similarly titled measures used by other companies.Restated segment informationSegment information restated to reflect these organisational and measurement changes for 2017 and 2018, for Q1/Q2/Q3/Q4 2018 and for Q1 2019, is shown in Table 1 and Table 2 on page 2 of this Press Release and is available on our website in pdf and excel format:https://www.dialog-semiconductor.com/organisational-updateThe Group's results for 2017 and 2018, for Q1/Q2/Q3/Q4 2018 and for Q1 2019 remain unchanged.Dialog will publish its results for Q2 and H1 2019 on July 30, 2019, including segment information presented in accordance with its new reporting structure and on an underlying basis. Analyst and investor call details are available on our website:https://www.dialog-semiconductor.com/sites/default/files/dialog_semiconductor_-_q2_2019_call_invite_-_eng_.pdfTable 1: Underlying revenue by segment (unaudited) Underlying revenue1 Underlying revenue1 Three months ended 30 March 2018 US$000 Three months ended 29 June 2018 US$000 Three months ended 28 September 2018 US$000 Three months ended 31 December 2018 US$000 Three months ended 29 March 2019 US$000 Year ended 31 December 2017 US$000 Year ended 31 December 2018 US$000 Custom Mixed Signal 245,402 194,538 274,534 327,845 211,605 1,059,603 1,042,319 Advanced Mixed Signal 53,926 63,651 66,265 60,694 50,898 137,834 244,536 Connectivity & Audio 32,819 37,467 42,734 40,984 32,376 147,603 154,004 Total segments 332,147 295,656 383,533 429,523 294,879 1,345,040 1,440,859 Corporate and other unallocated items 8 8 41 1,222 7 7,801 1,279 Total Group 332,155 295,664 383,574 430,745 294,886 1,352,841 1,442,138 1 Revenue is from sales to external customers (there were no inter-segment sales)Table 2: Underlying operating profit by segment (unaudited) Underlying operating profit/(loss) Underlying operating profit/(loss) Three months ended 30 March 2018 US$000 Three months ended 29 June 2018 US$000 Three months ended 28 September 2018 US$000 Three months ended 31 December 2018 US$000 Three months ended 29 March 2019 US$000 Year ended 31 December 2017 US$000 Year ended 31 December 2018 US$000 Custom Mixed Signal 60,515 37,558 72,027 97,489 44,945 296,236 267,589 Advanced Mixed Signal 3,028 8,175 9,040 6,511 1,008 (1,326) 26,754 Connectivity & Audio (618) 4,081 5,590 4,584 5,019 9,740 13,637 Total segments 62,925 49,814 86,657 108,584 50,972 304,650 307,980 Corporate and other unallocated items (10,475) (7,740) (2,977) (5,160) (3,821) (45,192) (26,352) Total Group 52,450 42,074 83,680 103,424 47,151 259,458 281,628 Table 3: Reconciliation of underlying measures to equivalent IFRS measures (unaudited)Underlying performance measures exclude specific items of income or expense that are recognised in profit or loss reported in accordance with IFRS that we consider hinder comparison of the financial performance of our businesses from one period to another, with each other or with other similar businesses.During the periods for which restated segment information is provided, there were no differences between underlying revenue and revenue reported in accordance with IFRS. We present reconciliations of underlying operating profit to operating profit reported in accordance with IFRS for each of those periods in the table below. Three months ended 30 March 2018 US$000 Three months ended 29 June 2018 US$000 Three months ended 28 September 2018 US$000 Three months ended 31 December 2018 US$000 Three months ended 29 March 2019 US$000 Year ended 31 December 2017 US$000 Year ended 31 December 2018 US$000 Underlying operating profit 52,450 42,074 83,680 103,424 47,151 259,458 281,628 Share-based compensation and related payroll taxes (10,348) (8,746) (10,205) (12,354) (11,886) (35,498) (41,653) Accounting for business combinations: - Acquisition-related costs - - - - (4,539) - - Amortisation of acquired intangible assets (5,657) (5,657) (5,658) (5,657) (5,657) (16,461) (22,629) - Consumption of the fair value uplift of acquired inventory (2,388) (406) (335) - - (2,305) (3,129) - Consideration accounted for as compensation expense (454) (350) (342) (335) (319) (1,409) (1,481) - Forfeiture of deferred consideration 127 36 14 27 83 - 204 - Remeasurement of contingent consideration (158) 523 1,154 (641) - - 878 Integration costs (689) (474) (940) (662) (2,305) (2,765) Corporate transaction costs - (773) (3,880) (6,693) (4,031) - (11,346) Strategic investments: - Impairment of non-current assets held by Dyna Image - - - - - (4,327) - - Loss on deconsolidation of Dyna Image - - - - - (5,597) - Operating profit reported under IFRS 32,883 26,227 63,488 77,109 25,341 187,017 199,707 *******For further information please contact:Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0)69 9203 7120 anja.meusel@fticonsulting.comAbout Dialog SemiconductorDialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment in which we operate. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDAX and MDAX indices. For more information, visit www.dialog-semiconductor.com.Forward Looking StatementsThis press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *22.07.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 844887 End of News DGAP News Service

  • EQS Group

    DIALOG SEMICONDUCTOR EXPECTS HIGHER THAN ANTICIPATED PROFITABILITY IN Q2 2019.

    Dialog Semiconductor Plc. / Key word(s): Quarter Results DIALOG SEMICONDUCTOR EXPECTS HIGHER THAN ANTICIPATED PROFITABILITY IN Q2 2019. 17-Jul-2019 / 00:09 CET/CEST Disclosure of an inside information acc. to Article 17 MAR of the Regulation (EU) No 596/2014, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * * London, UK, 16 July 2019 \- Dialog Semiconductor Plc (XETRA: DLG), expects higher than anticipated profitability in Q2 2019.In Q2 2019 the Company expects operating profit of approximately US$216 million and underlying1 operating profit of approximately US$82 million. Operating profit includes approximately US$28 million of other operating income comprising a gain of approximately US$16 million on the transfer of assets to Apple and income of approximately US$12 million from specific non-recurring engineering contracts. Underlying1 operating profit includes other operating income of approximately US$12 million from specific non-recurring engineering contracts.Operating profit and underlying operating profit were higher than anticipated mainly due to Q2 2019 revenue expected to be 1% over the high end of the guidance range communicated on 9 May 2019. In Q2 2019 the Company expects IFRS revenue of approximately US$482 million and underlying revenue of approximately US$336 million. The guidance communicated on 9 May 2019 was IFRS revenue range of US$438 million to US$478 million and underlying1 revenue range of US$293 million to US$333 million.At 28 June 2019, the Company had US$1,141 million of cash and cash equivalents.The Company will publish its results for the quarter ended 28 June 2019 on 30 July 2019.***1\. Underlying measures of performance quoted in this announcement are non-IFRS measures. Our use of underlying measures is explained on pages 156 to 161 of our 2018 Annual Report and Accounts. Reconciliations of the underlying measures to the nearest equivalent IFRS measures will be presented in our Q2 2019 Interim Report. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *Information and Explanation of the Issuer to this News: For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next.Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment in which we operate. Dialog Semiconductor Plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue. It currently has approximately 2,000 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German TecDAX and MDAX indices. For more information, visit www.dialog-semiconductor.com.Forward Looking Statements This press release contains 'forward-looking statements' that reflect management's current views with respect to future events. The words 'anticipate,' 'believe,' 'estimate', 'expect,' 'intend,' 'may,' 'plan,' 'project' and 'should' and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading 'Managing risk and uncertainty' in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement.* * *17-Jul-2019 CET/CEST The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 842247 End of Announcement DGAP News Service

  • EQS Group

    Announcement relating to the first tranche of shares to be bought back pursuant to Dialog Semiconductor Plc's share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019

    DGAP-News: Dialog Semiconductor Plc. / Key word(s): Share Buyback 12.06.2019 / 08:00 The issuer is solely responsible for the content of this announcement. * * *London, UK, June 12, 2019 \- Dialog Semiconductor Plc (the Company) refers to its ad-hoc announcement dated June 5, 2019 (Ad-hoc announcement in accordance with Article 17 of Regulation (EU) No 596/2014 of the European Parliament and the Council of 16 April 2014: Dialog Semiconductor announces commencement of the process for the first tranche of shares to be bought back pursuant to its share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019) (the Ad-Hoc Announcement)The Company today announces that Goldman Sachs International has been appointed the Preferred Broker (as defined in the Ad-Hoc Announcement) in relation to the first tranche of the Company's share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019 (the 2019 Buyback Programme). The material terms on which the Company will purchase ordinary shares from the Preferred Broker in relation to the first tranche of the 2019 Buyback Programme are as follows:\- the maximum total cost of the shares to be purchased by the Company from the Preferred Broker shall be EUR150.0 million;\- the minimum total cost of the shares to be purchased by the Company from the Preferred Broker shall be EUR125.0 million;\- the earliest date on which the Preferred Broker may purchase Certified Interests (CIs) in the Company on the Frankfurt Stock Exchange (the FSE) for the purpose of delivering ordinary shares in the Company to the Company shall be 14 June 2019;\- the latest date on which the Preferred Broker may purchase CIs on the FSE for the purpose of delivering ordinary shares in the Company to the Company shall be 5 December 2019;\- the minimum maturity date shall be 31 October 2019 and the maximum maturity date shall be 5 December 2019; and\- the price per share to be paid by the Company is equal to the average of the daily volume weighted average price (Average VWAP) paid for CIs on the FSE for each day during the period of the first tranche of the 2019 Buyback Programme (the Trading Period) less a percentage discount.During the Trading Period, the Preferred Broker may, acting independently as principal (without influence from the Company), purchase CIs in the Company on the FSE. Goldman Sachs International (and its affiliates) may also, at their discretion, undertake other transactions in the CIs (including sales and hedging activities) throughout the term of the first tranche of the 2019 Buyback Programme in order to hedge their exposure to the programme provided that any CIs to be purchased in relation to the programme shall be purchased:\- at a daily volume not to exceed 25% of the average daily volume traded on the FSE over the previous 20 trading days; and\- at a price not to exceed the higher of (i) 105% of the average middle market closing price of the CIs as derived from XETRA over the last 5 trading days; or (ii) the higher of the last independent trade or the highest current independent bid on the FSE.The Company has not previously purchased any ordinary shares pursuant to the shareholder approvals granted at the Company's annual general meeting on 2 May 2019. Details of any ordinary shares purchased by the Company will be made available on the Company's website at https://www.dialog-semiconductor.com/investor-relations/financial-news/share-buybacks.For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue. It currently has approximately 1,870 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German MDAX and TecDax indices. For more information, visit www.dialog-semiconductor.com.Forward Looking Statements This press release contains "forward-looking statements" that reflect management's current views with respect to future events. The words "anticipate," "believe," "estimate", "expect," "intend," "may," "plan," "project" and "should" and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading "Managing risk and uncertainty" in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *12.06.2019 Dissemination of a Corporate News, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 822871 End of News DGAP News Service

  • EQS Group

    Dialog Semiconductor announces commencement of the process for the first tranche of shares to be bought back pursuant to its share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019.

    Dialog Semiconductor Plc. / Key word(s): Share Buyback Dialog Semiconductor announces commencement of the process for the first tranche of shares to be bought back pursuant to its share buyback programme authorised by shareholders at the annual general meeting on 2 May 2019. 05-Jun-2019 / 17:39 CET/CEST Disclosure of an inside information acc. to Article 17 MAR of the Regulation (EU) No 596/2014, transmitted by DGAP - a service of EQS Group AG. The issuer is solely responsible for the content of this announcement. * * *London, UK, June 5, 2019 - Today the board of directors of Dialog Semiconductor Plc (XETRA: DLG) (the Company), a provider of highly integrated power management, AC/DC power conversion, solid state lighting and Bluetooth(R) low energy wireless technology, has resolved to commence the process to buy back a first tranche of shares in accordance with the shareholder approvals granted at the Company's Annual General Meeting (AGM) on 2 May 2019 relating to the share buyback programme (the 2019 Buyback Programme).The Company will give notice in writing to each of Barclays Bank PLC, Goldman Sachs International, HSBC Bank plc and Merrill Lynch International (together the Brokers) that it wishes to exercise its rights to purchase shares pursuant to the contingent forward share purchase contracts entered into with each of the Brokers on or around the date of the AGM, specifying the terms on which the Company is willing to purchase shares from the Broker that provides the most favourable pricing terms to the Company (the Preferred Broker).These terms include:\- the maximum total cost of the shares to be purchased by the Company from the Preferred Broker under the first tranche of the 2019 Buyback Programme shall be EUR150.0 million and the minimum total cost shall be EUR125.0 million; and\- the maximum maturity date for the first tranche of the 2019 Buyback Programme shall be December 5, 2019 and the minimum maturity date shall be October 31, 2019.Based on the assumption that the average price at which ordinary shares will be acquired by the Company is EUR28.43 per share, this would enable the Company to acquire up to approximately 5.3 million ordinary shares pursuant to the first tranche of the 2019 Buyback Programme.Once appointed, the Preferred Broker shall, acting independently as principal (without influence from the Company), purchase Certified Interests (CIs) in the Company on the Frankfurt Stock Exchange and, after acquiring the corresponding number of ordinary shares in the Company from Clearstream Banking AG, which is the registered shareholder for the shares underlying the CIs, shall sell these ordinary shares to the Company on certain settlement dates in accordance with the terms above and the contingent forward share purchase agreement with the Preferred Broker. Contact: Jose Cano Director, Investor Relations jose.cano@diasemi.com +44(0)1793756961 * * *Information and Explanation of the Issuer to this News: Further details relating to the first tranche of the 2019 Buyback Programme, including details of the Preferred Broker, shall be announced separately before the purchase of the first tranche of shares commences. The Company will regularly provide information on the progress of the buyback, including the number of ordinary shares purchased by the Company, on its website at https://www.dialog-semiconductor.com/investor-relations/financial-news/share-buybacks.No more than one tranche of shares will be bought back at any one time by the Company and there can be no certainty that any further ordinary shares will be acquired by the Company following the conclusion of the first tranche of the 2019 Buyback Programme.For further information please contact: Dialog Semiconductor Jose Cano Head of Investor Relations T: +44 (0)1793 756 961 jose.cano@diasemi.comFTI Consulting London Matt Dixon T: +44 (0)2037 271 137 matt.dixon@fticonsulting.comFTI Consulting Frankfurt Anja Meusel T: +49 (0) 69 9203 7120 Anja.Meusel@fticonsulting.comAbout Dialog Semiconductor Dialog Semiconductor is a leading provider of integrated circuits (ICs) that power mobile devices and the Internet of Things. Dialog solutions are integral to some of today's leading mobile devices and the enabling element for increasing performance and productivity on the go. From making smartphones more power efficient and shortening charging times, enabling home appliances to be controlled from anywhere, to connecting the next generation of wearable devices, Dialog's decades of experience and world-class innovation help manufacturers get to what's next. Dialog operates a fabless business model and is a socially responsible employer pursuing many programs to benefit the employees, community, other stakeholders and the environment we operate in. Dialog Semiconductor plc is headquartered in London with a global sales, R&D and marketing organization. In 2018, it had approximately $1.44 billion in revenue. It currently has approximately 1,800 employees worldwide. The company is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and is a member of the German MDAX and TecDax indices. For more information, visit www.dialog-semiconductor.com.Forward Looking Statements This press release contains 'forward-looking statements' that reflect management's current views with respect to future events. The words 'anticipate,' 'believe,' 'estimate', 'expect,' 'intend,' 'may,' 'plan,' 'project' and 'should' and similar expressions identify forward-looking statements. Such statements are subject to risks and uncertainties, including, but not limited to: an economic downturn in the semiconductor and telecommunications markets; changes in currency exchange rates and interest rates, the timing of customer orders and manufacturing lead times, insufficient, excess or obsolete inventory, the impact of competing products and their pricing, political risks in the countries in which we operate or sale and supply constraints. If any of these or other risks and uncertainties occur (some of which are described under the heading 'Managing risk and uncertainty' in Dialog Semiconductor's most recent Annual Report) or if the assumptions underlying any of these statements prove incorrect, then actual results may be materially different from those expressed or implied by such statements. We do not intend or assume any obligation to update any forward-looking statement which speaks only as of the date on which it is made, however, any subsequent statement will supersede any previous statement.* * *05-Jun-2019 CET/CEST The DGAP Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases. Archive at www.dgap.de * * * Language: English Company: Dialog Semiconductor Plc. Tower Bridge House, St. Katharine's Way E1W 1AA London United Kingdom Phone: +49 7021 805-412 Fax: +49 7021 805-200 E-mail: jose.cano@diasemi.com Internet: www.dialog-semiconductor.com ISIN: GB0059822006 WKN: 927200 Indices: MDAX, TecDAX Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange EQS News ID: 820089 End of Announcement DGAP News Service

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