IFX.DE - Infineon Technologies AG

XETRA - XETRA Delayed price. Currency in EUR
-0.65 (-3.06%)
As of 12:11PM CET. Market open.
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Previous close21.24
Bid20.59 x 427900
Ask20.59 x 8100
Day's range20.55 - 21.40
52-week range13.42 - 21.99
Avg. volume5,451,019
Market cap25.628B
Beta (5Y monthly)1.03
PE ratio (TTM)27.53
Earnings dateN/A
Forward dividend & yield0.27 (1.23%)
Ex-dividend date21 Feb 2020
1y target estN/A
Press releases
  • Business Wire

    Flex Delivers Seamless Path from Rapid Prototyping to High Volume Manufacturing of IoT Devices

    CES – Flex (NASDAQ: FLEX), the global supply chain and manufacturing company, in collaboration with QuickLogic Corporation and Infineon Technologies AG, today announced the availability of the FLEXino Sensor Fusion Development Kit to enable rapid prototyping and a corresponding 12mm x 12mm System-in-Package (SiP) for high volume production of Internet of Things (IoT) devices. To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Bluetooth and WiFi capabilities. At the Consumer Electronics Show (CES) this week, attendees interested in seeing a demonstration of the FLEXino Sensor Fusion Development Kit can make an appointment to visit QuickLogic's suite, located in the Venetian Tower Suite 31:220, by contacting info@quicklogic.com, or visit Infineon's booth in the Venetian Toscana Ballrooms 3706 and 3707.

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