|Bid||43.00 x 100|
|Ask||53.55 x 100|
|Day's range||51.90 - 53.08|
|52-week range||27.25 - 53.08|
|PE ratio (TTM)||34.45|
|Earnings date||1 Feb 2018|
|Forward dividend & yield||N/A (N/A)|
|1y target est||51.50|
II-VI Incorporated (NASDAQ:IIVI) today announced that it intends to release its fiscal 2018 second quarter results for the period ended December 31, 2017 on Thursday, February 1, 2018 before the market opens and will post these results on the Company’s web site at www.ii-vi.com. In conjunction with this release and to review the Company’s financial results, market trends and future outlook, the Company will host a conference call that will be broadcast live over the Internet that same day. Individuals wishing to participate in the webcast, to be held at 4:30p.m. Eastern Time on Thursday, February 1, 2018, can access the event on the Company’s web site by visiting www.ii-vi.com or via http://tinyurl.com/ya4drs4h.
II-VI Marlow Receives ISO 13485 Medical Devices Certification
II‐VI Incorporated (NASDAQ:IIVI), a leader in engineered materials and devices for communications, today announced the achievement of a key research milestone in the development of thin-film diamond on silicon technology for 5G wireless communications, in collaboration with the University of South Florida (USF). Mobile communications service providers are planning to enhance their high speed broadband services with 5G wireless, which is driving the demand for devices with much higher bandwidth and power efficiency than can be achieved through existing technologies. II-VI and USF successfully completed the first phase of their joint research program, which was initiated in June 2016, to develop a new technology platform using thin-film diamond on silicon that will enable next generation high speed electronic components in 5G wireless handsets.
On a per-share basis, the Saxonburg, Pennsylvania-based company said it had net income of 32 cents. The results fell short of Wall Street expectations. The average estimate of three analysts surveyed by ...
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