Samsung Electronics Co., Ltd. (SMSD.IL)
| Previous close | 1,160.00 |
| Open | 1,168.00 |
| Bid | 1,166.00 x 10000 |
| Ask | 1,170.00 x 12000 |
| Day's range | 1,158.00 - 1,172.00 |
| 52-week range | 969.00 - 1,296.00 |
| Volume | |
| Avg. volume | 1,957 |
| Market cap | 342.791B |
| Beta (5Y monthly) | 0.88 |
| PE ratio (TTM) | 12.09 |
| EPS (TTM) | 96.48 |
| Earnings date | N/A |
| Forward dividend & yield | 27.20 (2.70%) |
| Ex-dividend date | 29 Jun 2023 |
| 1y target est | N/A |
BenzingaAMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech
Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report
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