Samsung Electronics Co., Ltd. (SMSN.L)
| Previous close | 1,156.75 |
| Open | 1,153.00 |
| Bid | N/A x N/A |
| Ask | N/A x N/A |
| Day's range | 1,145.75 - 1,160.50 |
| 52-week range | 901.40 - 1,444.00 |
| Volume | |
| Avg. volume | 8,015 |
| Market cap | 320.478B |
| Beta (5Y monthly) | 0.84 |
| PE ratio (TTM) | 0.23 |
| EPS (TTM) | 52.24 |
| Earnings date | 25 Jul 2024 - 29 Jul 2024 |
| Forward dividend & yield | 26.54 (1.79%) |
| Ex-dividend date | 27 Mar 2024 |
| 1y target est | 1,953.34 |
PR NewswireOn-Device AI Chip Company DEEPX Officially Invited to World Economic Forum
DEEPX, a pioneering AI semiconductor technology company led by CEO Lokwon Kim, has made history as the first AI semiconductor company in the world to be invited to the World Economic Forum. This esteemed gathering of global economic leaders took place at the Summer Davos Forum in Dalian, China, from June 25-27. The 15th edition of this prestigious event centered on the theme "The Next Frontier for Growth."
- Yahoo Finance Video
Qualcomm shares rise on possible Samsung Galaxy partnership
Shares of Qualcomm (QCOM) are rising on the news that the company is expected to be the exclusive chip provider of Samsung's (005930.KS) upcoming Galaxy S25 smartphone. Catalysts Hosts Seana Smith and Madison Mills report more on the story and the increasing growth opportunities within the chip sector. For more expert insight and the latest market action, click here to watch this full episode of Catalysts. This post was Melanie Riehl
PR NewswireSEMIFIVE Collaborates with OPENEDGES on Chiplet Development
SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Technology (OPENEDGES). This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6 memory subsystem, which includes DDR memory controller and DDR PHY IPs optimized for the 4nm process node. Leveraging SEMIFIVE's extensive expertise in SoC design and package develo
