TSM - Taiwan Semiconductor Manufacturing Company Limited

NYSE - NYSE Delayed price. Currency in USD
102.80
+2.86 (+2.86%)
At close: 04:00PM EDT
103.00 +0.20 (+0.19%)
After hours: 07:59PM EDT
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Previous close99.94
Open102.70
Bid102.51 x 800
Ask102.80 x 1000
Day's range102.25 - 104.68
52-week range59.43 - 105.24
Volume14,871,159
Avg. volume11,724,168
Market cap533.163B
Beta (5Y monthly)1.24
PE ratio (TTM)16.45
EPS (TTM)N/A
Earnings dateN/A
Forward dividend & yield1.79 (1.78%)
Ex-dividend date15 Jun 2023
1y target estN/A
  • Business Wire

    TSMC Showcases New Technology Developments at 2023 Technology Symposium

    SANTA CLARA, Calif., April 26, 2023--TSMC (TWSE: 2330, NYSE: TSM) today showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its industry-leading 3nm technology family, offering a range of processes tuned to meet diverse customer demands. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for high performance computing (HPC) applications, and

  • Business Wire

    TSMC Files Annual Report on Form 20-F for 2022

    HSINCHU, Taiwan, April 20, 2023--TSMC (TWSE: 2330, NYSE: TSM) today filed its 2022 annual report on Form 20-F with the U.S. Securities and Exchange Commission.

  • Business Wire

    TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations

    HSINCHU, Taiwan, October 26, 2022--TSMC today announced the Open Innovation Platform® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum.

  • Business Wire

    TSMC FinFlex™, N2 Process Innovations Debut at 2022 North America Technology Symposium

    SANTA CLARA, Calif., June 16, 2022--TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex™ technology for the N3 and N3E processes making their debut.