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TSM Jan 2023 70.000 put

OPR - OPR Delayed price. Currency in USD
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2.3200+0.4200 (+22.11%)
As of 2:36PM EDT. Market open.
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Previous close1.9000
Expiry date2023-01-20
Day's range2.3200 - 2.3200
Contract rangeN/A
Open interest793
  • Editor's pick
    Yahoo Finance Video

    Intel to make Qualcomm chips

    Myles Udland, Brian Sozzi, and Julie Hyman discuss Intel’s plans to expand its new foundry business as it ramps up production of Qualcomm chips in order to compete with other chipmakers.

  • Intel Pledges to Retake Innovation Crown, Changes Yardstick

    Intel Pledges to Retake Innovation Crown, Changes Yardstick

    (Bloomberg) -- Intel Corp., playing catch-up in semiconductor technology after losing its long-held dominance, vowed to become the industry leader again in 2025 by rethinking some of the fundamentals of how chips are made, and signed up rival Qualcomm Inc. as a manufacturing customer.Santa Clara, California-based Intel aims to step up innovation and is changing the approach used to measure progress in chip production, arguing that the current system gives competitors Taiwan Semiconductor Manufac

  • Reuters

    Explainer: Intel banks on 3D chip technology to win over new customers

    In the past, chipmakers like Intel Corp and Taiwan Semiconductor Manufacturing Co raced each other to make the features on chips smaller and smaller to cram more computing power onto a single chip. But the newest race in chipmaking is to stack "chiplets" or "tiles" - tiny squares sliced out of what would normally be a single, larger chip - on top of a base layer of silicon in one package, mixing and matching different technologies rather than trying to make a single big chip. It also could help manufacturers improve chip performance even as they push the physical limits of how small chip features can get.