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Development of the Taiwanese Semiconductor Industry in 4Q 2022 and Beyond

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Dublin, Feb. 20, 2023 (GLOBE NEWSWIRE) -- The "Development of the Taiwanese Semiconductor Industry in 4Q 2022 and Beyond" report has been added to's offering.

The shipment value of the Taiwanese semiconductor industry reached US$38.1 billion in the third quarter of 2022, down 0.6% compared to the previous quarter but up 7.2% year-on-year.

This report looks into the development of the semiconductor industry and its three major sectors of IC design, IC manufacturing, and packaging and testing, also known as OSAT (Outsourced Semiconductor Assembly and Test), in the third quarter of 2022 and examines their development in the fourth quarter of 2022 and beyond.

List of Topics Covered:

  • Development of the Taiwanese semiconductor industry in the third quarter of 2022, touching on key issues of IC design, IC manufacturing, and IC packaging and testing industry sectors

  • Outlook for the industry in the fourth quarter of 2022 and 2023 by sector: IC design, IC manufacturing, and packaging and testing

Key Topics Covered:

1. Analysis of Key Issues
1.1 IC Design
1.1.1 Sluggish Market Demand Slows Down Inventory Clearance
1.1.2 The Urgent Demand for Large-size Panels is Short-lived and DDIC Suppliers are Seeking to Expand in the Auto Market
1.2 IC Manufacturing
1.2.1 Demand for Display Driver ICs and PMICs Dips While Capacity Utilization Rate of 90nm and Above Processes at Foundries Decreases Significantly
1.2.2 The Volume and Price of DRAM Drops Significantly and Demand for Flash Memory Remains Weak
1.3 IC Packaging and Testing (OSAT)
1.3.1 OSAT Companies are Not Busy in the Peak Season While Inventory Clearance Continues
1.3.2 The Weak Demand for Memory ICs Forces Back-end OSAT Utilization Rate to Drop

2. Outlook for the Industry
2.1 IC Design
2.1.1 Brands Continue to Cut Product Prices and Consumer Market Demand to Remain Sluggish in 1H2023
2.1.2 Inventory Clearance of Memory ICs Expected to Continue into 2H 2023
2.2 IC Manufacturing
2.2.1 Capacity Utilization Rate of Leading Foundries is Not Satisfactory to Slow Down Shipment Growth
2.2.2 The Recovery Time of the Memory Market Remains Unknown Due to Low Order Visibility
2.3 IC Packaging and Testing (OSAT)
2.3.1 OSAT Companies Reduce Capex in Response to the Weak-seasonal Effect
2.3.2 Consumer Market Demand Remains Sluggish and OSAT Companies to Shift Focus to the Auto Market

A selection of companies mentioned in this report includes

  • Advanced Semiconductor Engineering (ASE)

  • Ardentec

  • ASUS

  • Audi

  • Benz

  • BMW

  • Chipbond Technology

  • ChipMOS Technologies

  • Elite Semiconductor Microelectronics Technology

  • Ferrari

  • FocalTech Systems

  • Formosa Advanced Technologies

  • Himax

  • HP

  • Infineon

  • King Yuan Electronics

  • Kioxia

  • Lamborghini

  • Largan

  • Lingsen Precision Industries

  • Macronix

  • MediaTek

  • Microchip

  • Micron Technology

  • Nanya

  • Novatek

  • NXP

  • Orient Semiconductor Electronics

  • Parade Technologies

  • Pegatron

  • Porsche

  • Powertech Technology

  • PSMC

  • Samsung

  • Sigurd

  • SK Hynix

  • Taiwan IC Packaging Corp.

  • TI

  • TSMC

  • UMC

  • Vate Technology

  • VIS

  • Volkswagen

  • Walton Advanced Engineering

  • Winbond

  • Yangtze Memory Technology

For more information about this report visit

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