Advertisement
UK markets close in 7 hours 30 minutes

  • FTSE 100

    8,124.58
    +45.72 (+0.57%)
     

  • FTSE 250

    19,747.68
    +145.70 (+0.74%)
     

  • AIM

    755.88
    +2.76 (+0.37%)
     

  • GBP/EUR

    1.1654
    -0.0003 (-0.02%)
     

  • GBP/USD

    1.2507
    -0.0004 (-0.03%)
     

  • Bitcoin GBP

    51,403.34
    +261.93 (+0.51%)
     

  • CMC Crypto 200

    1,387.89
    -8.64 (-0.62%)
     

  • S&P 500

    5,048.42
    -23.21 (-0.46%)
     

  • DOW

    38,085.80
    -375.12 (-0.98%)
     

  • CRUDE OIL

    84.05
    +0.48 (+0.57%)
     

  • GOLD FUTURES

    2,357.70
    +15.20 (+0.65%)
     

  • NIKKEI 225

    37,934.76
    +306.28 (+0.81%)
     

  • HANG SENG

    17,674.87
    +390.33 (+2.26%)
     

  • DAX

    18,027.71
    +110.43 (+0.62%)
     

  • CAC 40

    8,041.21
    +24.56 (+0.31%)
     
PROPERTY:

9 luxury homes to consider if money is no object

Ever thought about what a multimillion pound budget would buy you?

Ericsson 5G NR 2.5GHz Model AIR 3219 B41K KRD 901 210/11 R1B: Comprehensive Product Analysis

Research and Markets
·2-min read
Company Logo
Company Logo

Dublin, Nov. 07, 2022 (GLOBE NEWSWIRE) -- The "Ericsson 5G NR 2.5GHz Model AIR 3219 B41K KRD 901 210/11 R1B" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis for the Ericsson AIR 3219 B41K system. This product is a 5G NR massive MIMO 32T32R antenna radio unit and supports the RU functions of a 5G NR gNodeB.

Features

  • System Functional Description

  • System Level Block Diagrams

  • High Level Mechanical Analysis

    • Heat Sink

    • Heat Fins

    • IC Heat Sinks

    • Antenna Radome/Array/RF Distribution

  • High-Level PCB Analysis

  • Component Diagrams

    • Semiconductor/component locations on PCB

  • High Level Bill of Materials

    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, )

    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)

    • Complete Part Number/Marking

    • Component Manufacturer Identification

    • Function Component Description

    • Package Type

  • Excludes analysis of passive chip resistors, capacitors, and inductors

ADVERTISEMENT

Key Topics Covered:

Executive Summary

  • Active/Passive Component Summary

  • Important Note

Chapter 1: Ericsson MPAAU

  • Overview of Active Antenna Unit

  • Product Specifications

Chapter 2: Mechanical Analysis

  • Antenna Radome

  • Interface Panel Connectors

  • Main Chassis

  • Heat Transfer Fins

  • Radio Transceiver RF Shield

Chapter 3: DFE ASIC Vapor Chamber

Chapter 4: RF Transceiver Subsystem

  • Top Side Active Component Analysis (Areas A, B, and C)

  • Top Side Passive Component Analysis (Areas A, B, and C)

  • Bottom Side Active Component Analysis (Areas D, E, and F)

  • Bottom Side Passive Component Analysis (Areas D, E, and F)

Chapter 5: RF Filter Analysis

Chapter 6: Antenna Array Subsystem

  • Antenna Subarrays

  • Phase Shifter Subsystem

  • RF Distribution/Phase Shifter Circuit PCB

Chapter 7: Antenna XPOL Element

Appendix A Component Analysis

Appendix B Component Type By System Unit

Appendix C Active Components By Supplier

Appendix D Passive Components By Supplier

For more information about this report visit https://www.researchandmarkets.com/r/tm3c27

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood,Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900