Assembly and testing (manufacturing) of outsourced semiconductors offer IC-packaging and testing facilities to third parties. OSATs are merchant vendors. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations.
New York, Aug. 25, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Outsourced Semiconductor Assembly and Testing Market By Service Type, Packaging Type, and Application : Global Opportunity Analysis and Industry Forecast, 2021–2028" - https://www.reportlinker.com/p06126662/?utm_source=GNW
Fabless companies often outsource their packaging to the foundries and/or the OSATs. Semiconductors are also used by many modern consumer goods in daily life, such as cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. In addition, a preference for large displays, and curved OLEDs due to growing popularity of smart TVs, 4 K ultra-HD TVs, 3D programming, and video-on - demand content drives OSAT revenues. OSATs offer cost-effective and creative solutions which deliver higher efficiency, processing speeds and functionality with space reduction in an electronic device.
The factors such as increasing demand for consumer electronics and upsurge in the degree of urbanization across the globe primarily fuels growth of the market. In addition, the growing disposable income of people across the globe has significantly fueled the sales of consumer electronics devices such as TV, mobile phones, and tablets, boosting the demand for outsourced semiconductor assembly and test services. Moreover, increase in smartphone adoption significantly propels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the contrary, growing chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rising transition towards in OSAT emerging economies such as India, China, and South Korea is opportunistic for the market growth.
The global outsourced semiconductor assembly and test market share is analyzed by service type, packaging type, application, and region. Based on service type, the market is analyzed across testing and assembly. On the basis of packaging type, the market is divided into ball grid array, chip scale package, multi package, stacked die, and quad and dual. As per the application, the market is categorized into automotive, consumer electronics, industrial, telecommunication, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key embedded processor market leaders profiled in the report include XXX. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.
By Service Type
By Packaging Type
• Ball Grid Array
• Chip Scale Package
• Multi Package
• Stacked Die
• Quad & Dual
• Consumer electronics
• North America
o Rest of Europe
o Rest of Asia-Pacific
o Latin America
o Middle East
• ASE Technology Holding, Co., LTD.
• Amkor Technology, Inc.
• Jiangsu Changjiang Electronics Technology Co., LTD
• Powertech Technology Inc.
• Tianshui Huatian Technology Co., LTD.
• TongFu Microelectronics Co., LTD.
• King Yuan Electronics Corp.
• Hana Micron Inc.
• ChipMOS Technology Inc.
• Unisem Group
Read the full report: https://www.reportlinker.com/p06126662/?utm_source=GNW
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