UK Markets closed

Teardown Analysis of Ericsson's StreetMacro 6701 System: A 5G NR mmWave 28GHz Small Cell

·2-min read

Dublin, Sept. 03, 2021 (GLOBE NEWSWIRE) -- The "Teardown Analysis of Ericsson's StreetMacro 6701 System: A 5G NR mmWave 28GHz Small Cell" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis for the Ericsson StreetMacro 6701 B261 system. This product is a 5G NR mmWave 28GHz small cell.

The report is a design "teardown" analysis of an Ericsson mmWave phased array antenna unit (mpAAU) 5G NR small cell system. The mpAAU supports 5G NR technology in the FR2 frequency band. The analysis covers the entire system. A simplified mechanical analysis of the unit along with detailed bill of materials analysis is presented in this report.

The Ericsson product name is Ericsson StreetMacro 6701 (SM 6701) B261. The Ericsson part number is vRK 101 01/1. This particular unit was manufactured in Estonia and is meant for use in the United States.

Features

  • System Functional Description

  • System Level Block Diagrams

  • High Level Mechanical Analysis

    • Heat Sink

    • Heat Fins

  • High Level PCB Analysis

  • Component Diagrams

    • Semiconductor/component locations on PCB

    • High Level Bill of Materials

    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)

    • Passive/other components (Transformers, Power inductors, Power capacitors, Power/Datacom/Optical connectors)

    • Complete Part Number/Marking

    • Component Manufacturer Identification

    • Function Component Description

    • Package Type

  • Excludes analysis of passive chip resistors, capacitors, and inductors

Key Topics Covered:

Executive Summary

  • Active/Passive Component Summary

  • Important Note

Chapter 1: Ericsson mpAAU

  • Overview of mmWave Phased Array Antenna Unit

  • Product Specifications

Chapter 2: Mechanical Analysis

  • Front Cover Chassis

  • Rear Cover Chassis

  • Power Supply/Fan Tray Cover

  • Phased Array Antenna Module (PAAM) Secondary Thermal Heatsink

  • Modem/Switch Transport RF Shield

Chapter 3: L1 Modem Subsystem

Chapter 4: L2/L3 Switch/Transport Subsystem

  • Frequency Synthesizer Modules

Chapter 5: Radio Transceiver Subsystem

  • Top PCB Component Analysis

  • Bottom PCB Component Analysis

Chapter 6: mmWave Phased Array Antenna Module (PAAM) Subsystem

  • PAAM Heatsink Assembly

Chapter 7: Power Supply Subsystem

Chapter 8: Fan Tray Subsystem

Appendix A: Component Analysis

Appendix B: Component Type by System Unit

Appendix C: Active Components by Supplier

Appendix D: Passive Components by Supplier

For more information about this report visit https://www.researchandmarkets.com/r/r8sj7s

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900


Our goal is to create a safe and engaging place for users to connect over interests and passions. In order to improve our community experience, we are temporarily suspending article commenting