Teardown Analysis of Ericsson's StreetMacro 6701 System: A 5G NR mmWave 28GHz Small Cell
Dublin, Sept. 03, 2021 (GLOBE NEWSWIRE) -- The "Teardown Analysis of Ericsson's StreetMacro 6701 System: A 5G NR mmWave 28GHz Small Cell" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.
This report provides a comprehensive analysis for the Ericsson StreetMacro 6701 B261 system. This product is a 5G NR mmWave 28GHz small cell.
The report is a design "teardown" analysis of an Ericsson mmWave phased array antenna unit (mpAAU) 5G NR small cell system. The mpAAU supports 5G NR technology in the FR2 frequency band. The analysis covers the entire system. A simplified mechanical analysis of the unit along with detailed bill of materials analysis is presented in this report.
The Ericsson product name is Ericsson StreetMacro 6701 (SM 6701) B261. The Ericsson part number is vRK 101 01/1. This particular unit was manufactured in Estonia and is meant for use in the United States.
Features
System Functional Description
System Level Block Diagrams
High Level Mechanical Analysis
Heat Sink
Heat Fins
High Level PCB Analysis
Component Diagrams
Semiconductor/component locations on PCB
High Level Bill of Materials
Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
Passive/other components (Transformers, Power inductors, Power capacitors, Power/Datacom/Optical connectors)
Complete Part Number/Marking
Component Manufacturer Identification
Function Component Description
Package Type
Excludes analysis of passive chip resistors, capacitors, and inductors
Key Topics Covered:
Executive Summary
Active/Passive Component Summary
Important Note
Chapter 1: Ericsson mpAAU
Overview of mmWave Phased Array Antenna Unit
Product Specifications
Chapter 2: Mechanical Analysis
Front Cover Chassis
Rear Cover Chassis
Power Supply/Fan Tray Cover
Phased Array Antenna Module (PAAM) Secondary Thermal Heatsink
Modem/Switch Transport RF Shield
Chapter 3: L1 Modem Subsystem
Chapter 4: L2/L3 Switch/Transport Subsystem
Frequency Synthesizer Modules
Chapter 5: Radio Transceiver Subsystem
Top PCB Component Analysis
Bottom PCB Component Analysis
Chapter 6: mmWave Phased Array Antenna Module (PAAM) Subsystem
PAAM Heatsink Assembly
Chapter 7: Power Supply Subsystem
Chapter 8: Fan Tray Subsystem
Appendix A: Component Analysis
Appendix B: Component Type by System Unit
Appendix C: Active Components by Supplier
Appendix D: Passive Components by Supplier
For more information about this report visit https://www.researchandmarkets.com/r/r8sj7s
CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900