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Worldwide Silicon on Insulator Industry to 2027 - Increasing use of SoI Technology in IoT Devices and Applications Presents Opportunities

Research and Markets
·10-min read

Dublin, April 15, 2021 (GLOBE NEWSWIRE) -- The "Silicon on Insulator Market by Wafer Size, Wafer Type, Technology, Product and Application: Global Opportunity Analysis and Industry Forecast, 2020-2027" report has been added to ResearchAndMarkets.com's offering.

The global silicon on insulator market size was $1.11 billion in 2019, and is projected to reach $3.18 billion by 2027, growing at a CAGR of 14.1% from 2020 to 2027. Silicon on insulator technology states the usage of layered silicon-insulator-silicon substrate in position of traditional silicon in semiconductor manufacturing work. This technology is compatible with presently used fabrication process in the industry without retooling or extra equipment of existing factory. There are several benefits of silicon on insulator technology such as high performance, power saving, reduced leakage, absence of latchup, compatibility, and ease in scaling.

Silicon on insulator (SoI) is an integral part of consumer electronics products such as tablets, smartphones, wearable devices, electric cars, and others. Thus, demand for SoI is increasing rapidly in consumer electronics. Also, the need for reducing power consumption in a variety of mobile and portable devices has fueled the demand for SOI devices in the consumer electronic industry.

Further, the SoI wafers offer the reliability, speed, and hardness beyond traditional technologies, which increases the overall operational performance at low voltage, which is further expected to contribute to the silicon on insulators market growth. Silicon on insulator catches lot of attention in the design of high-performance circuits. In recent times, chipmakers giants such as Advanced Micro Devices, IBM and Intel Corporation have taken surging interest in the commercialization of SOI technology.

The minor restructuring in the current chip fabrication methods has enabled several manufactures to shift from the bulk silicon technology to the SOI-based devices. However, the self-heating effects in SOI-based devices act as restraints to the growth of the silicon on insulator market. Moreover, the market players faced challenges in procuring the raw material and delivering the finished goods with the interrupted supply chain.

The silicon on insulator market is segmented on the basis of wafer size, wafer type, technology, product, application, and region. The wafer size segment includes 200 mm and 300 mm wafers. Based on wafer type, the market is divided into RF-SOI, FD_SOI, PD-SOI, and others. By Technology, the market is segmented into BESOI, SiMOX, Smart Cut, ELTRAN, and SoS. By product, the silicon on insulator market bifurcated into optical communication, image sensing, MEMS, power, and RF FEM. By application, the market is segmented into datacom & telecom, automotive, consumer electronics, industrial, photonics, and others.

By region, the silicon on insulator market trends are analyzed across North America, Europe, Asia-Pacific, and LAMEA. North America is studied across the U.S., Mexico, and Canada. Europe is analyzed across the UK, Germany, France, Russia, and the rest of Europe. The countries covered under Asia-Pacific are China, Taiwan, Japan, South Korea, and rest of Asia-Pacific, while LAMEA includes Latin America and Middle East & Africa. In addition, the report covers country-wise cross-sectional analysis of the products and industry vertical segments.

The key players profiled in the report include GlobalWafers, NXP Semiconductors, SUMCO CORPORATION, Shin-Etsu Chemical Co., Ltd., MagnaChip Semiconductor Corp, STMicroelectronics, Soitec SA, Simgui, Tower Semiconductor Ltd. (ToweJazz), and Murata Manufacturing Co. Ltd. These key players have adopted various strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their position in the silicon on insulator industry.

Key Topics Covered:

Chapter 1: Introduction
1.1. Report description
1.2. Key benefits for Stakeholders
1.3. Key Market Segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

CHAPTER 2: Executive summary
2.1. CXO perspective

CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter's five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Surge in usage of SoI wafers in consumer electronics
3.4.1.2. Enhances operational performance with low operating voltage
3.4.1.3. Increasing investments by wafer manufacturers and foundry players in emerging economies
3.4.2. Restraint
3.4.2.1. Self-heating effects in SoI based devices
3.4.3. Opportunities
3.4.3.1. Increasing use of SoI technology in IoT devices and applications
3.4.3.2. Implementing automation solutions across the retail industry to avoid human intervention
3.4.4. Challenges
3.4.4.1. Volatility in cost of raw materials
3.5. COVID-19 impact analysis
3.5.1. Impact on market size
3.5.2. End user trends, preferences, and budget impact
3.5.3. Parent industry impact

CHAPTER 4: silicon on insulator Market, By wafer size
4.1. Overview
4.2.200 mm
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3.300 mm
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country

CHAPTER 5: silicon on insulator Market, BY wafer type
5.1. Overview
5.2. RF-SOI
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. FD-SOI
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. PD-SOI
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Others
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country

CHAPTER 6: silicon on insulator Market, BY Technology
6.1. Overview
6.2. BESOI
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. SiMOX
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Smart Cut
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. ELTRAN
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. SoS
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country

CHAPTER 7: silicon on insulator Market, BY product
7.1. Overview
7.2. RF FEM
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country
7.3. MEMS
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country
7.4. Power
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country
7.5. Optical Communication
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country
7.6. Image Sensing
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country

CHAPTER 8: silicon on insulator Market, BY Application
8.1. Overview
8.2. Consumer electronics
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by region
8.2.3. Market analysis, by country
8.3. Automotive
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by region
8.3.3. Market analysis, by country
8.4. Datacom & Telecom
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by region
8.4.3. Market analysis, by country
8.5. Industrial
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by region
8.5.3. Market analysis, by country
8.6. Photonics
8.6.1. Key market trends, growth factors, and opportunities
8.6.2. Market size and forecast, by region
8.6.3. Market analysis, by country
8.7. Others
8.7.1. Key market trends, growth factors, and opportunities
8.7.2. Market size and forecast, by region
8.7.3. Market analysis, by country

CHAPTER 9: silicon on insulator Market, BY Region
9.1. Overview
9.2. North America
9.3. Europe
9.4. Asia-Pacific
9.5. LAMEA

CHAPTER 10: COMPETITIVE LANDSCAPE
10.1. Introduction
10.1.1. Market player positioning, 2019
10.2. Competitive dashboard
10.3. Competitive heatmap
10.4. Key developments
10.4.1. New product launches
10.4.2. Collaborations
10.4.3. Other Developments

CHAPTER 11: COMPANY PROFILES
11.1. TOWER SEMicONDUCTOR LTD.
11.1.1. Company overview
11.1.2. Key Executive
11.1.3. Company snapshot
11.1.4. Operating business segments
11.1.5. Product portfolio
11.1.6. R&D Expenditure
11.1.7. Business performance
11.1.8. Key strategic moves and developments
11.2. GLOBAL WAFERS CO., LTD.
11.2.1. Company overview
11.2.2. Key Executive
11.2.3. Company snapshot
11.2.4. Operating business segments
11.2.5. Product portfolio
11.2.6. R&D Expenditure
11.2.7. Business performance
11.3. MagnaChip Semiconductor Corporation
11.3.1. Company overview
11.3.2. Key Executive
11.3.3. Company snapshot
11.3.4. Operating business segments
11.3.5. Product portfolio
11.3.6. R&D Expenditure
11.3.7. Business performance
11.3.8. Key strategic moves and developments
11.4. MURATA MANUFACTURING COMPANY, LTD.
11.4.1. Company overview
11.4.2. Key Executive
11.4.3. Company snapshot
11.4.4. Operating business segments
11.4.5. Product portfolio
11.4.6. R&D Expenditure
11.4.7. Business performance
11.4.8. Key strategic moves and developments
11.5. NXP Semiconductor
11.5.1. Company overview
11.5.2. Key Executives
11.5.3. Company snapshot
11.5.4. Product portfolio
11.5.5. R&D Expenditure
11.5.6. Business performance
11.5.7. Key strategic moves and developments
11.6. SHIN-ETSU CHEMicAL CO., LTD
11.6.1. Company overview
11.6.2. Key Executives
11.6.3. Company snapshot
11.6.4. Operating business segments
11.6.5. Product portfolio
11.6.6. R&D Expenditure
11.6.7. Business performance
11.6.8. Key strategic moves and developments
11.7. Shanghai Simgui Technology Co., Ltd.
11.7.1. Company overview
11.7.2. Key Executive
11.7.3. Company snapshot
11.7.4. Product portfolio
11.8. Soitec
11.8.1. Company overview
11.8.2. Key Executive
11.8.3. Company snapshot
11.8.4. Operating business segments
11.8.5. Product portfolio
11.8.6. R&D Expenditure
11.8.7. Business performance
11.8.8. Key strategic moves and developments
11.9. STMicroelectronics N. V.
11.9.1. Company overview
11.9.2. Key Executives
11.9.3. Company snapshot
11.9.4. Operating business segments
11.9.5. Product portfolio
11.9.6. R&D Expenditure
11.9.7. Business performance
11.9.8. Key strategic moves and developments
11.10. SUMCO CORPORATION
11.10.1. Company overview
11.10.2. Key Executives
11.10.3. Company snapshot
11.10.4. Operating business segments
11.10.5. Product portfolio
11.10.6. R&D Expenditure
11.10.7. Business performance

For more information about this report visit https://www.researchandmarkets.com/r/8z071v

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