ACM Research, Inc. (ACMR)
| Previous close | 25.29 |
| Open | 25.32 |
| Bid | 23.00 x 100 |
| Ask | 23.06 x 100 |
| Day's range | 22.80 - 25.56 |
| 52-week range | 9.10 - 34.40 |
| Volume | |
| Avg. volume | 1,743,638 |
| Market cap | 1.428B |
| Beta (5Y monthly) | 1.41 |
| PE ratio (TTM) | 19.85 |
| EPS (TTM) | N/A |
| Earnings date | N/A |
| Forward dividend & yield | N/A (N/A) |
| Ex-dividend date | N/A |
| 1y target est | N/A |
- GlobeNewswire
ACM Research Reports First Quarter 2024 Results
FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today reported financial results for its first quarter ended March 31, 2024. “I am pleased with our first quarter results, a solid start for 2024. We delivered 105% revenue growth, record shipments, and strong profitability," said ACM’s President and Chief Executive Officer, Dr. David Wang.
- GlobeNewswire
ACM Research Appoints David Kim as CEO of ACM Research Korea
FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the appointment of David Kim as Chief Executive Officer of ACM Research Korea CO., LTD. (“ACM Research Korea”). Mr. Kim brings more than thirty years of semiconductor manufacturing experience to his new role, having held senior positions at major corporations such as Hyundai
- GlobeNewswire
ACM Research Expands Advanced Packaging Portfolio with Introduction of Frame Wafer Cleaning Tool
Achieves residue-free performance for post-debonding cleaning while minimizing environmental impactFREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced its Frame Wafer Cleaning Tool for advanced packaging. The tool effectively cleans semiconductor wafers during the post-debonding cleaning process. The Frame Wafer Cleaning Too
